scholarly journals Study on the system-level test method of digital metering in smart substation

2017 ◽  
Author(s):  
Xiang Zhang ◽  
Min Yang ◽  
Juan Hu ◽  
Fuchao Li ◽  
Ruixi Luo ◽  
...  
Keyword(s):  
Test Method ◽  
System Level ◽  
Smart Substation

Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Dhananjay Panchagade ◽  
Prakriti Choudhary ◽  
Jeff Suhling ◽  
Sameep Gupte
Keyword(s):  
Electronic Packaging ◽  
Wavelet Transforms ◽  
High Speed ◽  
Damage Index ◽  
Test Method ◽  
System Level ◽  
Failure Envelope ◽  
Ball Grid Arrays ◽  
Cost Constraints ◽  
Damage Progression

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging. Data on damage progression under transient-shock and vibration in both 95.5Sn4.0Ag0.5Cu and 63Sn37Pb ball-grid arrays has been presented. Component types examined include — flex-substrate and rigid substrate ball-grid arrays. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using high-speed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video at 150,000 fps per second has been used to capture the deformation kinematics. The concept of relative damage index has been used to both evaluate and predict damage progression during transient shock. The failure-envelope provides a fundamental basis for development of component integration guidelines to ensure survivability in shock and vibration environments at a user-specified confidence level. The approach is scalable to application at system-level. Explicit finite-element models have been developed for prediction of shock survivability based on the failure envelope. Model predictions have been correlated with experimental data for both leaded and leadfree ball-grid arrays.

Study on Smart Substation System Level Test

2013 ◽  
Vol 448-453 ◽  
pp. 2394-2397
Author(s):  
Jia Yong Zhong ◽  
Zhi Long Chen
Keyword(s):  
Loss Rate ◽  
Performance Test ◽  
Transmission Delay ◽  
System Level ◽  
Delay Test ◽  
Iec 61850 ◽  
Electronic Transformer ◽  
Accuracy Test ◽  
Test Flow ◽  
Smart Substation

This paper deals with the study of smart substation system level test. The test include three parts:network performance test,electronic transformer test and conformance testing.Network performance test involves the process layer network and station level networks test, transmission delay and frame loss rate of switch is tested.Electronic transformer test contains accuracy test, absolute delay test and polarity test. Conformance test is a test for model based on IEC 61850,test flow is studied.

scholarly journals Modular System-Level Modeling Method for the Susceptibility Prediction of Balise Information Transmission System

2020 ◽  
Vol 10 (21) ◽  
pp. 7944
Author(s):  
Dan Zhang ◽  
Yinghong Wen ◽  
Jinbao Zhang ◽  
Jianjun Xiao ◽  
Yali Song ◽  
...  
Keyword(s):  
High Speed ◽  
Electromagnetic Compatibility ◽  
Theoretical Method ◽  
Simulation Method ◽  
Physical Structure ◽  
Modeling Method ◽  
Test Method ◽  
System Level ◽  
Modular System ◽  
System Level Modeling

For high-speed train, balise transmission module (BTM) system is easily interfered with by other equipment of the train. This could cause the train to malfunction. Studying the electromagnetic susceptibility (EMS) of the BTM is very important for the performance and efficiency of the train. In this paper, a modular, system-level modeling method is proposed to predict the EMS of BTM systems. Based on object-oriented technology and a modular method, the BTM system is disassembled into several modules according to the electromagnetic characteristics of the whole system rather than the physical structure. All the modules are mutually independent, and the total EMS could be evaluated by the output of them. The modules of three key elements of electromagnetic compatibility (EMC), i.e., sources, coupling paths, and sensitive equipment, are established by the theoretical method, full-wave simulation method, and black-box test method, respectively, and put into different layers. According to the functions of the BTM system, the EMS of BTM is given by analyzing the interrelation of input and output of modules. Results of the proposed model were verified by measurement.

Models for Shock and Vibration Survivability of Electronic and MEMS Packaging

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Dhananjay Panchagade ◽  
Prakriti Choudhary ◽  
Jeff Suhling ◽  
Sameep Gupte
Keyword(s):  
Electronic Packaging ◽  
Wavelet Transforms ◽  
High Speed ◽  
Damage Index ◽  
Test Method ◽  
System Level ◽  
Failure Envelope ◽  
Ball Grid Arrays ◽  
Cost Constraints ◽  
Damage Progression

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging. Data on damage progression under transient-shock and vibration in both 95.5Sn4.0Ag0.5Cu and 63Sn37Pb ball-grid arrays has been presented. Component types examined include — flex-substrate and rigid substrate ball-grid arrays. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using high-speed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video at 150,000 fps per second has been used to capture the deformation kinematics. The concept of relative damage index has been used to both evaluate and predict damage progression during transient shock. The failure-envelope provides a fundamental basis for development of component integration guidelines to ensure survivability in shock and vibration environments at a user-specified confidence level. The approach is scalable to application at system-level. Explicit finite-element models have been developed for prediction of shock survivability based on the failure envelope. Model predictions have been correlated with experimental data for both leaded and leadfree ball-grid arrays.

scholarly journals Designing of PMU Tester in Smart Substation Based on Test Method

2017 ◽  
Author(s):  
Li HE ◽  
Yu-fei TENG ◽  
Shi-lin FENG ◽  
Zhen-chao JIANG ◽  
Ming-zhong LIU
Keyword(s):  
Test Method ◽  
Smart Substation
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