Adaptive test method on production system-level testing (SLT) to optimize test cost, resources and defect parts per million (DPPM)

2018 ◽  
Author(s):  
Subagaran Letchumanan ◽  
Terrence Huat Hin Tan ◽  
Yee Pheng Gan ◽  
Sai Leong Wong
Keyword(s):  
Production System ◽  
Test Method ◽  
System Level ◽  
Test Cost ◽  
Adaptive Test

scholarly journals Identifying the Optimal Subsets of Test Items through Adaptive Test for Cost Reduction of ICs

Electronics ◽  
2021 ◽  
Vol 10 (6) ◽  
pp. 680
Author(s):  
Huaguo Liang ◽  
Jinlei Wan ◽  
Tai Song ◽  
Wangchao Hou
Keyword(s):  
Integrated Circuits ◽  
Cost Reduction ◽  
Bayesian Model ◽  
Test Methods ◽  
Test Time ◽  
Test Quality ◽  
Test Cost ◽  
Test Items ◽  
Adaptive Test ◽  
Test Escapes

With the growing complexity of integrated circuits (ICs), more and more test items are required in testing. However, the large number of invalid items (which narrowly pass the test) continues to increase the test time and, consequently, test costs. Aiming to address the problems of long test time and reduced test item efficiency, this paper presents a method which combines a fast correlation-based filter (FCBF) and a weighted naive Bayesian model which can identify the most effective items and make accurate quality predictions. Experimental results demonstrate that the proposed method reduces test time by around 2.59% and leads to fewer test escapes compared with the recently adopted test methods. The study shows that the proposed method can effectively reduce the test cost without jeopardizing test quality excessively.

Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Dhananjay Panchagade ◽  
Prakriti Choudhary ◽  
Jeff Suhling ◽  
Sameep Gupte
Keyword(s):  
Electronic Packaging ◽  
Wavelet Transforms ◽  
High Speed ◽  
Damage Index ◽  
Test Method ◽  
System Level ◽  
Failure Envelope ◽  
Ball Grid Arrays ◽  
Cost Constraints ◽  
Damage Progression

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging. Data on damage progression under transient-shock and vibration in both 95.5Sn4.0Ag0.5Cu and 63Sn37Pb ball-grid arrays has been presented. Component types examined include — flex-substrate and rigid substrate ball-grid arrays. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using high-speed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video at 150,000 fps per second has been used to capture the deformation kinematics. The concept of relative damage index has been used to both evaluate and predict damage progression during transient shock. The failure-envelope provides a fundamental basis for development of component integration guidelines to ensure survivability in shock and vibration environments at a user-specified confidence level. The approach is scalable to application at system-level. Explicit finite-element models have been developed for prediction of shock survivability based on the failure envelope. Model predictions have been correlated with experimental data for both leaded and leadfree ball-grid arrays.

Speech Perception with Cochlear Implants as Measured Using a Roving-Level Adaptive Test Method

ORL ◽  
2010 ◽  
Vol 72 (6) ◽  
pp. 312-318 ◽  
Author(s):  
Sabine Haumann ◽  
Thomas Lenarz ◽  
Andreas Büchner
Keyword(s):  
Speech Perception ◽  
Cochlear Implants ◽  
Test Method ◽  
Adaptive Test

In search of the optimum test set - adaptive test methods for maximum defect coverage and lowest test cost

2005 ◽  
Author(s):  
R. Madge ◽  
B. Benware ◽  
R. Turakhia ◽  
R. Daasch ◽  
C. Schuermyer ◽  
...  
Keyword(s):  
Test Methods ◽  
Defect Coverage ◽  
Test Set ◽  
Test Cost ◽  
Adaptive Test

Concurrent Design for Optimal Production Performance

2002 ◽  
Author(s):  
Yu-Feng Wei ◽  
Anna C. Thornton
Keyword(s):  
Production System ◽  
Lead Time ◽  
Quantitative Method ◽  
Feedback Loop ◽  
Production Performance ◽  
System Level ◽  
Concurrent Design ◽  
Efficient Manufacturing ◽  
Production And Inventory Control

In this paper we propose a quantitative method for optimizing the design tasks at the product, process, and system level based on predicted system performance. We develop a set of models for a production system that comprises two plants: manufacturing and assembly, with a finished-good inventory in between, and seek to optimize the part design, tolerancing, production and inventory control concurrently. Such an approach provides an efficient manufacturing feedback loop for the design tasks and can significantly shorten the product development lead-time. A case study of an aircraft tube production system is used to illustrate this methodology.

scholarly journals Study on the system-level test method of digital metering in smart substation

2017 ◽  
Author(s):  
Xiang Zhang ◽  
Min Yang ◽  
Juan Hu ◽  
Fuchao Li ◽  
Ruixi Luo ◽  
...  
Keyword(s):  
Test Method ◽  
System Level ◽  
Smart Substation

Measuring healthcare productivity – from unit to system level

2016 ◽  
Vol 29 (3) ◽  
Author(s):  
Vesa Johannes Kämäräinen ◽  
Antti Peltokorpi ◽  
Paulus Torkki ◽  
Kaj Tallbacka
Keyword(s):  
Production System ◽  
Design Methodology ◽  
System Level ◽  
Organizational Level ◽  
Background Information ◽  
Productivity Measurement ◽  
System Productivity ◽  
Pilot Investigation ◽  
Practical Implications ◽  
Different Levels

Purpose Healthcare productivity is a growing issue in most Western countries where healthcare expenditure is rapidly increasing. Therefore, accurate productivity metrics are essential to avoid sub-optimization within a healthcare system. In this article, we focus on healthcare production system productivity measurement. Design/methodology/approach Traditionally, healthcare productivity has been studied and measured independently at the unit, organization, and system level. Suggesting that productivity measurement should be done in different levels, while simultaneously linking productivity measurement to incentives, this study presents the challenges of productivity measurement at the different levels. The study introduces different methods to measure productivity in healthcare. In addition, it provides background information on the methods used to measure productivity and the parameters used in these methods. A pilot investigation of productivity measurement is used to illustrate the challenges of measurement, to test the developed measures, and to prove the practical information for managers. Findings The study introduces different approaches and methods to measure productivity in healthcare. Research limitations/implications Practical implications A pilot investigation of productivity measurement is used to illustrate the challenges of measurement, to test the developed measures, and to prove the practical benefits for managers. Originality/value We focus on the measurement of the whole healthcare production system and try to avoid sub-optimization. Additionally considering an individual patient approach, productivity measurement is examined at the unit level, the organizational level, and the system level.

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