Some aspects of bulk cable current injection (BCCI) test method at system level testing of an aircraft

1999 ◽  
Keyword(s):  
Current Injection ◽  
Test Method ◽  
System Level

Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Dhananjay Panchagade ◽  
Prakriti Choudhary ◽  
Jeff Suhling ◽  
Sameep Gupte
Keyword(s):  
Electronic Packaging ◽  
Wavelet Transforms ◽  
High Speed ◽  
Damage Index ◽  
Test Method ◽  
System Level ◽  
Failure Envelope ◽  
Ball Grid Arrays ◽  
Cost Constraints ◽  
Damage Progression

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging. Data on damage progression under transient-shock and vibration in both 95.5Sn4.0Ag0.5Cu and 63Sn37Pb ball-grid arrays has been presented. Component types examined include — flex-substrate and rigid substrate ball-grid arrays. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using high-speed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video at 150,000 fps per second has been used to capture the deformation kinematics. The concept of relative damage index has been used to both evaluate and predict damage progression during transient shock. The failure-envelope provides a fundamental basis for development of component integration guidelines to ensure survivability in shock and vibration environments at a user-specified confidence level. The approach is scalable to application at system-level. Explicit finite-element models have been developed for prediction of shock survivability based on the failure envelope. Model predictions have been correlated with experimental data for both leaded and leadfree ball-grid arrays.

scholarly journals Study on the system-level test method of digital metering in smart substation

2017 ◽  
Author(s):  
Xiang Zhang ◽  
Min Yang ◽  
Juan Hu ◽  
Fuchao Li ◽  
Ruixi Luo ◽  
...  
Keyword(s):  
Test Method ◽  
System Level ◽  
Smart Substation

scholarly journals Modular System-Level Modeling Method for the Susceptibility Prediction of Balise Information Transmission System

2020 ◽  
Vol 10 (21) ◽  
pp. 7944
Author(s):  
Dan Zhang ◽  
Yinghong Wen ◽  
Jinbao Zhang ◽  
Jianjun Xiao ◽  
Yali Song ◽  
...  
Keyword(s):  
High Speed ◽  
Electromagnetic Compatibility ◽  
Theoretical Method ◽  
Simulation Method ◽  
Physical Structure ◽  
Modeling Method ◽  
Test Method ◽  
System Level ◽  
Modular System ◽  
System Level Modeling

For high-speed train, balise transmission module (BTM) system is easily interfered with by other equipment of the train. This could cause the train to malfunction. Studying the electromagnetic susceptibility (EMS) of the BTM is very important for the performance and efficiency of the train. In this paper, a modular, system-level modeling method is proposed to predict the EMS of BTM systems. Based on object-oriented technology and a modular method, the BTM system is disassembled into several modules according to the electromagnetic characteristics of the whole system rather than the physical structure. All the modules are mutually independent, and the total EMS could be evaluated by the output of them. The modules of three key elements of electromagnetic compatibility (EMC), i.e., sources, coupling paths, and sensitive equipment, are established by the theoretical method, full-wave simulation method, and black-box test method, respectively, and put into different layers. According to the functions of the BTM system, the EMS of BTM is given by analyzing the interrelation of input and output of modules. Results of the proposed model were verified by measurement.

Models for Shock and Vibration Survivability of Electronic and MEMS Packaging

2005 ◽  
Author(s):  
Pradeep Lall ◽  
Dhananjay Panchagade ◽  
Prakriti Choudhary ◽  
Jeff Suhling ◽  
Sameep Gupte
Keyword(s):  
Electronic Packaging ◽  
Wavelet Transforms ◽  
High Speed ◽  
Damage Index ◽  
Test Method ◽  
System Level ◽  
Failure Envelope ◽  
Ball Grid Arrays ◽  
Cost Constraints ◽  
Damage Progression

Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints. Presently, one of the primary methodologies for evaluating shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected to a wide-array of boundary conditions beyond those targeted in the test method. In this paper, a failure-envelope approach based on wavelet transforms and damage proxies has been developed to model drop and shock survivability of electronic packaging. Data on damage progression under transient-shock and vibration in both 95.5Sn4.0Ag0.5Cu and 63Sn37Pb ball-grid arrays has been presented. Component types examined include — flex-substrate and rigid substrate ball-grid arrays. Dynamic measurements like acceleration, strain and resistance are measured and analyzed using high-speed data acquisition system capable of capturing in-situ strain, continuity and acceleration data in excess of 5 million samples per second. Ultra high-speed video at 150,000 fps per second has been used to capture the deformation kinematics. The concept of relative damage index has been used to both evaluate and predict damage progression during transient shock. The failure-envelope provides a fundamental basis for development of component integration guidelines to ensure survivability in shock and vibration environments at a user-specified confidence level. The approach is scalable to application at system-level. Explicit finite-element models have been developed for prediction of shock survivability based on the failure envelope. Model predictions have been correlated with experimental data for both leaded and leadfree ball-grid arrays.

scholarly journals Research on Wideband Differential-Mode Current Injection Testing Technique Based on Directional Coupling Device

2014 ◽  
Vol 2014 ◽  
pp. 1-13
Author(s):  
Xiaodong Pan ◽  
Guanghui Wei ◽  
Xinfu Lu ◽  
Lisi Fan ◽  
Xing Zhou
Keyword(s):  
Structure Design ◽  
Current Injection ◽  
Test Method ◽  
Voltage Source ◽  
Response Analysis ◽  
Differential Mode ◽  
Injection Test ◽  
Injection Method ◽  
Coupling Device ◽  
Directional Coupling

This paper presents a new kind of differential-mode current injection test method. The equal response voltage on the cable or the antenna port of the equipment under test (EUT) is regarded as equivalent principle for radiation and injection test. The injection and radiation response analysis model and the injection voltage source extrapolation model in high intensity radiated field are established. The conditions of using differential-mode current injection as a substitute for radiation are confirmed. On the basis of the theoretical analysis, the function and structure design scheme of the directional coupling device is proposed. The implementation techniques for the single differential-mode current injection method (SDMCI) and the double differential-mode current injection method (DDMCI) are discussed in detail. The typical nonlinear response interconnected systems are selected as the EUT. The test results verify the validity of the SDMCI and DDMCI test methods.

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