scholarly journals Research of a wind tunnel parameters by means of cross-section analysis of air flow profiles

2019 ◽  
Author(s):  
Vitalii Yanovych ◽  
Daniel Duda ◽  
Vít Horáček ◽  
Václav Uruba
Keyword(s):  
Wind Tunnel ◽  
Cross Section ◽  
Air Flow ◽  
Flow Profiles ◽  
Section Analysis

Failure Modes, Reliability Analysis and Case Studies on the Integration of Copper and Low-K Technology

2004 ◽  
Author(s):  
Huixian Wu ◽  
James Cargo ◽  
Huixian Wu ◽  
Marvin White
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Cross Section ◽  
Focused Ion Beam ◽  
Failure Modes ◽  
Ion Beam ◽  
Copper Interconnects ◽  
Wet Chemical ◽  
Low K ◽  
Section Analysis

Abstract The integration of copper interconnects and low-K dielectrics will present novel failure modes and reliability issues to failure analysts. This paper discusses failure modes related to Cu/low-K technology. Here, physical failure analysis (FA) techniques including deprocessing and cross-section analysis have been developed. The deprocessing techniques include wet chemical etching, reactive ion etching, chemical mechanical polishing and a combination of these techniques. Case studies on different failure modes related to Cu/low k technology are discussed: copper voiding, copper extrusion; electromigration stress failure; dielectric cracks; delamination-interface adhesion; and FA on circuit-under-pad. For the cross-section analysis of copper/low-K samples, focused ion beam techniques have been developed. Scanning electron microscopy, EDX, and TEM analytical analysis have been used for failure analysis for Cu/low-K technology. Various failure modes and reliability issues have also been addressed.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

Air flow quality analysis of an open-circuit boundary layer wind tunnel and comparison with a closed-circuit wind tunnel

2020 ◽  
Vol 32 (12) ◽  
pp. 125120
Author(s):  
María Jiménez-Portaz ◽  
Luca Chiapponi ◽  
María Clavero ◽  
Miguel A. Losada
Keyword(s):  
Boundary Layer ◽  
Wind Tunnel ◽  
Air Flow ◽  
Open Circuit ◽  
Closed Circuit ◽  
Quality Analysis ◽  
Flow Quality

Objective Cross Section Analysis

1966 ◽  
Vol 5 (3) ◽  
pp. 233-245 ◽  
Author(s):  
R. T. Duquet ◽  
E. F. Danielsen ◽  
N. R. Phares
Keyword(s):  
Cross Section ◽  
Section Analysis

Influence of the Side Walls on the Turbulent Center-Plane Boundary-Layer in a Square Duct

1978 ◽  
Vol 100 (1) ◽  
pp. 91-96 ◽  
Author(s):  
V. de Brederode ◽  
P. Bradshaw
Keyword(s):  
Boundary Layer ◽  
Wind Tunnel ◽  
Flat Plate ◽  
Cross Section ◽  
Secondary Flows ◽  
Plane Boundary ◽  
Square Duct ◽  
Streamwise Pressure Gradient ◽  
Side Walls ◽  
Working Section

Measurements in the entry region of a square duct (specifically, a wind-tunnel working section) show that the direct effect of stress-induced secondary flows in the corners on the center-plane boundary layer is negligible for boundary layers thinner than about one-fourth of the duct width. Further, the effects of streamwise pressure gradient and of quasi-collinear lateral convergence tend to cancel so that the velocity profiles and skin friction are quite close to those on a flat plate. This shows that the boundary layer on the floor of a wind tunnel of constant, square cross section can be used to simulate a flat-plate flow even when the boundary layer thickness is as large as one-fourth of the tunnel height.

A Cross-Section Analysis of Non-Business Air Travel

1958 ◽  
Vol 53 (284) ◽  
pp. 928-947 ◽  
Author(s):  
John B. Lansing ◽  
Dwight M. Blood
Keyword(s):  
Cross Section ◽  
Air Travel ◽  
Section Analysis

scholarly journals The Cross Section for the J = 0 → 2 Rotational Excitation of Hydrogen by Slow Electrons

1969 ◽  
Vol 22 (6) ◽  
pp. 715 ◽  
Author(s):  
RW Crompton ◽  
DK Gibson ◽  
AI McIntosh
Keyword(s):  
Momentum Transfer ◽  
Cross Section ◽  
Cross Sections ◽  
Vibrational Excitation ◽  
The Cross ◽  
Excitation Processes ◽  
Slow Electrons ◽  
And Diffusion ◽  
Momentum Transfer Cross Section ◽  
Section Analysis

The results of electron drift and diffusion measurements in parahydrogen have been analysed to determine the cross sections for momentum transfer and for rotational and vibrational excitation. The limited number of possible excitation processes in parahydrogen and the wide separation of the thresholds for these processes make it possible to determine uniquely the J = 0 → 2 rotational cross section from threshold to 0.3 eV. In addition, the momentum transfer cross section has been determined for energies less than 2 eV and it is shown that, near threshold, a vibrational cross section compatible with the data must lie within relatively narrow limits. The problems of uniqueness and accuracy inherent in the swarm method of cross section analysis are discussed. The present results are compared with other recent theoretical and experimental determinations; the agreement with the most recent calculations of Henry and Lane is excellent.

Sign in / Sign up

Export Citation Format

Share Document