Correlation between sidewall surface states and off-state breakdown voltage of AlGaN/GaN HFETs

2021 ◽  
Vol 130 (11) ◽  
pp. 115703
Author(s):  
Mehrnegar Aghayan ◽  
Pouya Valizadeh
Author(s):  
Stefan Schwantes ◽  
Josef Furthaler ◽  
Bernd Schauwecker ◽  
Franz Dietz ◽  
Michael Graf ◽  
...  

1998 ◽  
Vol 19 (11) ◽  
pp. 405-407 ◽  
Author(s):  
M.H. Somerville ◽  
R. Blanchard ◽  
J.A. del Alamo ◽  
G. Duh ◽  
P.C. Chao

2006 ◽  
Vol 6 (3) ◽  
pp. 377-385 ◽  
Author(s):  
S. Schwantes ◽  
J. Furthaler ◽  
B. Schauwecker ◽  
F. Dietz ◽  
M. Graf ◽  
...  

2006 ◽  
Vol 955 ◽  
Author(s):  
Hiroshi Kambayashi ◽  
Jiang Li ◽  
Nariaki Ikeda ◽  
Seikoh Yoshida

ABSTRACTIt is reported that we demonstrated a large current operation AlGaN/GaN HFET with a low-on state resistance and a high breakdown voltage operation at room temperature and 500 K. We developed our unique ohmic electrode using Ti/AlSi/Mo. In addition, we investigated the dependence between the distance from the gate electrode to the drain electrode and the off-state breakdown voltage. As a result, the breakdown voltage of a unit HFET was over 1100 V. Furthermore, on the large scale HFET with the gate width of 240 mm, the maximum drain current of over 50 A was obtained at room temperature and also, that of over 25 A was obtained at 500 K. The off-state breakdown voltage was obtained about 800 V at room temperature and about 600 V at 500 K, although Si-based FETs can not operate in such a high temperature.


2011 ◽  
Author(s):  
H. B. Chen ◽  
C. J. Chang ◽  
J. J. Wu ◽  
W. C. Chen ◽  
C. C. Tsai ◽  
...  

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