Cycle time estimation models for printed circuit board design

2002 ◽  
Vol 40 (4) ◽  
pp. 1017-1028 ◽  
Author(s):  
K. R. Haberle ◽  
R. J. Burke ◽  
R. J. Graves
Keyword(s):  
Cycle Time ◽  
Printed Circuit Board ◽  
Time Estimation ◽  
Circuit Board ◽  
Printed Circuit ◽  
Estimation Models

Optimization of Component Placement Scheduling for SMT Assemblies

2006 ◽  
Vol 505-507 ◽  
pp. 1123-1128
Author(s):  
Chung Hsien Kuo ◽  
M.D. Jeng ◽  
J.J. Wing ◽  
Tai Hong Wang
Keyword(s):  
Cycle Time ◽  
Heuristic Search ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Component Placement ◽  
Printed Circuit ◽  
Search Approach ◽  
Optical Positioning ◽  
Surface Mounting ◽  
Assembly Models

The surface mounting of electronic component is the major manufacturing technology for the electronic products in the last decade. The surface mounting technology (SMT) is an assembly process that assembles the surface mountable component (SMC) and the printed circuit board (PCB) together. The SMT mounter is an automatic assembly machine that processes the SMT assemblies in terms of the optical positioning and robotic handling. The SMT assembly consists of calibrating printed circuit board (PCB); vacuuming components form feeder stations; compensating the orientation of the vacuumed surface mountable component (SMC); and finally placing SMC chips on the PCB. In order to increase the throughput, the synchronous batch vacuuming of SMC components is designed. In addition, different types of component feeding and mixing in each batch increase the difficulties of finding the best component mounting sequence. In this paper, the optimal component placement scheduler is desired to perform higher assembly performance and to reduce the cycle time. The proposed optimal component placement scheduler is developed based on the rule based heuristic search approach. In addition, to evaluate the cycle time of each heuristic search, the route oriented Petri nets (ROPN) based SMT assembly models are constructed. The optimal component placement scheduler can be further determined in terms of evaluating the ROPN SMT assembly models. Finally, the practical test PCB board data is discussed in this paper.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

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