Multiple Soaking with Different Solution Concentration in Doped Silica Preform Fabrication Using Modified Chemical Vapor Deposition and Solution Doping

Absorption and fluorescence spectra in the range from 350 to 1750 nm of several Tm3+- doped optical performs (rods) for optical fiber drawing were measured. Silica-based matrices of Al2O3-GeO2-P2O5-Sb2O3-SiO2 composition doped with several thousands ppm of Tm3+ were characterized. The preforms were fabricated by the Modified Chemical Vapor Deposition and by the solution doping methods. A new method, Genetic Algorithm SPEctra Decomposition was adopted for processing of the measured absorption spectra. This decomposition made it possible to calculate the oscillator strengths of Tm3+ absorption levels. Fluorescence bands of Tm3+ at 800 nm or 1640 nm were found in fluorescence spectra measured on the preform samples when excited at 1064 nm only.

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Properties of O-Doped CuI Thin Films by Chemical Vapor Deposition (CVD) at Different Deposition Flow Rate

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.832.444 ◽

2013 ◽

Vol 832 ◽

pp. 444-448

Author(s):

Nur Amalina Muhamad ◽

Firdaus Che Mat ◽

M. Rusop

Keyword(s):

Thin Films ◽

Chemical Vapor Deposition ◽

Flow Rate ◽

Vapor Deposition ◽

Gas Flow ◽

Chemical Vapor ◽

Solution Concentration ◽

Oxygen Gas ◽

Effect Of Oxygen ◽

Oxygen Ratio

The effect of oxygen doping to the properties of CuI thin films was studied. The doping of oxygen to the CuI thin films was done by using single furnace chemical vapor deposition (CVD) method at different oxygen gas flow rate (e.g 10, 20, 30, 40 and 50 sccm). The CuI thin film was first deposited by using mister atomizer at constant CuI solution concentration of 0.05M. The surface morphology and electrical properties of O-doped CuI was studied. The field emission scanning electron microscopy (FESEM) was used to observe the morphology of O-doped CuI thin films. The FESEM images revealed that all the CuI thin films deposited were uniform with the existence of nanostructured CuI particle. The EDX measurement confirm the existence of Cu:I in the films and also the variation of oxygen ratio in the CuI thin films as the oxygen was introduced. The resistivity of 101 Ωcm to 103 Ωcm at constant voltage of-5V to 5V was obtained for the O-doped CuI thin films.

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In situ study of electron beam-induced chemical vapor deposition of Au in an environmental TEM

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100137653 ◽

1995 ◽

Vol 53 ◽

pp. 256-257

Author(s):

J. Drucker ◽

R. Sharma ◽

J. Kouvetakis ◽

K.H.J. Weiss

Keyword(s):

Electron Beam ◽

Chemical Vapor Deposition ◽

Vapor Deposition ◽

Quantum Effect ◽

Line Drawing ◽

Chemical Vapor ◽

Environmental Cell ◽

Engineering Changes ◽

Kinetics Of

Patterning of metals is a key element in the fabrication of integrated microelectronics. For circuit repair and engineering changes constructive lithography, writing techniques, based on electron, ion or photon beam-induced decomposition of precursor molecule and its deposition on top of a structure have gained wide acceptance Recently, scanning probe techniques have been used for line drawing and wire growth of W on a silicon substrate for quantum effect devices. The kinetics of electron beam induced W deposition from WF6 gas has been studied by adsorbing the gas on SiO2 surface and measuring the growth in a TEM for various exposure times. Our environmental cell allows us to control not only electron exposure time but also the gas pressure flow and the temperature. We have studied the growth kinetics of Au Chemical vapor deposition (CVD), in situ, at different temperatures with/without the electron beam on highly clean Si surfaces in an environmental cell fitted inside a TEM column.

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The relaxation of compressive biaxial strains in SOS via microtwins

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100155013 ◽

1989 ◽

Vol 47 ◽

pp. 608-609

Author(s):

M. E. Twigg ◽

E. D. Richmond ◽

J. G. Pellegrino

Keyword(s):

Thin Film ◽

Chemical Vapor Deposition ◽

Molecular Beam Epitaxy ◽

Compressive Stress ◽

Vapor Deposition ◽

Partial Dislocation ◽

Molecular Beam ◽

Volume Fraction ◽

Chemical Vapor ◽

Silicon Thin Film

For heteroepitaxial systems, such as silicon on sapphire (SOS), microtwins occur in significant numbers and are thought to contribute to strain relief in the silicon thin film. The size of this contribution can be assessed from TEM measurements, of the differential volume fraction of microtwins, dV/dν (the derivative of the microtwin volume V with respect to the film volume ν), for SOS grown by both chemical vapor deposition (CVD) and molecular beam epitaxy (MBE).In a (001) silicon thin film subjected to compressive stress along the [100] axis , this stress can be relieved by four twinning systems: a/6[211]/( lll), a/6(21l]/(l1l), a/6[21l] /( l1l), and a/6(2ll)/(1ll).3 For the a/6[211]/(1ll) system, the glide of a single a/6[2ll] twinning partial dislocation draws the two halves of the crystal, separated by the microtwin, closer together by a/3.

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