Ion-beam-induced plastic deformation: A universal phenomenon in glasses

1989 ◽  
Vol 110 (1-2) ◽  
pp. 79-83 ◽  
Author(s):  
S. Klaumünzer
Keyword(s):  
2007 ◽  
Vol 550 ◽  
pp. 289-294
Author(s):  
Suk Hoon Kang ◽  
Jae Hyung Cho ◽  
Joon Sub Hwang ◽  
Jong Soo Cho ◽  
Yong Jin Park ◽  
...  

Cold drawn gold wires are widely applied in electronic packaging process to interconnect micro-electronic components. They basically provides a conducting path for electronic signal transfer, and experience thermo-mechanical loads in use. The mechanical stability of drawn gold wires is a matter of practical concern in the reliable functioning of electronic devices. It is known that mechanical properties of materials are deeply related to the microstructure. With appropriate control of deformation and heat processes, the mechanical properties of final products, such as tensile strength and elongation can be improved. Severe plastic deformation by torsion usually contributes to grain refinement and increment of strength. In this study, microstructure variations with torsion strain followed by drawing and heat treatment were investigated. Analyses by focused ion beam (FIB) and electron backscattered diffraction (EBSD) were carried out to characterize the effect of deformation and heat treatment on the drawn gold wires. Pattern quality of EBSD measurements was used as a quantitative measure for plastic deformation.


Author(s):  
E.A. Stepantsov

It was studied the possibility of solid phase intergrowth of optical Y-ZrO2 crystals with preliminarily developed one of their two contacting surfaces. The developing included creation of determined relief by argon ion beam milling through a mask with determined layout. The process of solid phase intergrowth of crystals with such developed surfaces was fulfilled in the same conditions, which were used at the similar procedure for crystals with undeveloped surfaces. During the process crystal samples were put together in contact in parallel crystallographic orientation along preliminary polished and etched surfaces. Then they were heated in vacuum up to temperature 1600°С. After that they were pressed to each other up to pressure 1.4 kN/mm2 for 4 hours with further cooling with rate 10°С/min down to room temperature. Decreasing of effective square of contacting surfaces on a value of total square of etched relief picture was taken into account at calculating of compression pressure. It was found out that solid phase intergrowth on undeveloped parts of the surfaces was realized with the same result, as it was in case of solid phase intergrowth of Y-ZrO2 crystals, the contacting surfaces of which had not been developed by Ar beam milling. It was shown that nano-voids is formed at the rest parts of the contacting surfaces of crystalline specimens during their solid phase intergrowth. As a result a planar structure of nano-voids is created in a volume of a crystal, fabricated by solid phase intergrowth of two crystalline samples with preliminarily developed surface of one of them by argon beam milling through special mask. It was demonstrated that a configuration of nano-voids planar structure corresponds to a picture of the relief of the developed crystal surface with precision not worse than +/- 1 µ. By chemical etching for dislocation holes of the crystal side surfaces, which are perpendicular to a plane of a planar structure of nano-voids, it was demonstrated that during of solid phase intergrowth process plastic deformation of the material did not have place even on micro-level, corresponding to thickness of etched relief. Full absence of even weak traces of plastic deformation in the zone of crystal specimen intergrowth is an explanation of so high precision correspondance of etched relief to configuration of planar structure of nono-voids. The shown results demonstrate the possibility of creation a planar structure of nano-voids inside of a crystal, corresponding to in advance determined picture with so high precision, that it gives new possibilities in designing of photonic devices.


1999 ◽  
Vol 14 (6) ◽  
pp. 2196-2203 ◽  
Author(s):  
T. Y. Tsui ◽  
Joost Vlassak ◽  
William D. Nix

The plastic deformation behavior of Knoop indentations made in a soft, porous titanium/aluminum multilayered thin film on a hard silicon substrate is studied through use of the focused-ion-beam milling and imaging technique. Pileup is observed for indentations with depths larger than 30% of the total film thickness. Analysis of the indentation cross sections shows that plastic deformation around the indentation is partly accommodated by the closing of the pores within the multilayers. This densification process reduces the amount of pileup formed below that predicted by finite element simulations. Experimental results show that the pileup is formed by an increase of the titanium layer thickness near the edges of the indentation. The thickness increase is largest near the film/substrate interface and decreases toward the surface of the multilayered film. The amount of normal compression near the center of the indenter is characterized, and it is demonstrated that the deformation becomes more nonuniform with increasing indentation depth.


2017 ◽  
Vol 23 (6) ◽  
pp. 1076-1081 ◽  
Author(s):  
Ádám István Hegyi ◽  
Péter Dusán Ispánovity ◽  
Michal Knapek ◽  
Dániel Tüzes ◽  
Kristián Máthis ◽  
...  

AbstractPlastic deformation of micron-scale crystalline materials differs considerably from bulk samples as it is characterized by stochastic strain bursts. To obtain a detailed picture of the intermittent deformation phenomena, numerous micron-sized specimens must be fabricated and tested. An improved focused ion beam fabrication method is proposed to prepare non-tapered micropillars with excellent control over their shape. Moreover, the fabrication time is less compared with other methods. The in situ compression device developed in our laboratory allows high-accuracy sample positioning and force/displacement measurements with high data sampling rates. The collective avalanche-like motion of the dislocations is observed as stress decreases on the stress–strain curves. An acoustic emission (AE) technique was employed for the first time to study the deformation behavior of micropillars. The AE technique provides important additional in situ information about the underlying processes during plastic deformation and is especially sensitive to the collective avalanche-like motion of the dislocations observed as the stress decreases on the deformation curves.


1993 ◽  
Vol 126 (1-4) ◽  
pp. 129-132 ◽  
Author(s):  
F. Garrido ◽  
A. Benyagoub ◽  
A. Chamberod ◽  
J. C. Dran ◽  
A. Dunlop ◽  
...  

2004 ◽  
Vol 84 (18) ◽  
pp. 3591-3593 ◽  
Author(s):  
T. van Dillen ◽  
M. J. A. de Dood ◽  
J. J. Penninkhof ◽  
A. Polman ◽  
S. Roorda ◽  
...  

Nanomaterials ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1630
Author(s):  
Chia-Hung Lee ◽  
Erh-Ju Lin ◽  
Jyun-Yang Wang ◽  
Yi-Xuan Lin ◽  
Chen-Yu Wu ◽  
...  

Tensile tests were carried on the electroplated Cu films with various densities of twin grain boundary. With TEM images and a selected area diffraction pattern, nano-twinned structure can be observed and defined in the electroplated Cu films. The density of the nano-twin grain structure can be manipulated with the concentration of gelatin in the Cu-sulfate electrolyte solution. We found that the strength of the Cu films is highly related to the twin-boundary density. The Cu film with a greater twin-boundary density has a larger fracture strength than the Cu film with a lesser twin-boundary density. After tensile tests, necking phenomenon (about 20 μm) occurred in the fractured Cu films. Moreover, by focused ion beam (FIB) cross-sectional analysis, the de-twinning can be observed in the region where necking begins. Thus, we believe that the de-twinning of the nano-twinned structure initiates the plastic deformation of the nano-twinned Cu films. Furthermore, with the analysis of the TEM images on the nano-twinned structure in the necking region of the fractured Cu films, the de-twinning mechanism attributes to two processes: (1) the ledge formation by the engagement of the dislocations with the twin boundaries and (2) the collapse of the ledges with the opposite twin-boundaries. In conclusion, the plastic deformation of nano-twinned Cu films is governed by the de-twinning of the nano-twinned structure. Moreover, the fracture strength of the nano-twinned Cu films is proportional to the twin-boundaries density.


1999 ◽  
Vol 14 (6) ◽  
pp. 2204-2209 ◽  
Author(s):  
T. Y. Tsui ◽  
Joost Vlassak ◽  
William D. Nix

The plastic displacements around Knoop indentations made in hard titanium/aluminum multilayered films on soft aluminum alloy substrates have been studied. Indentations were cross-sectioned and imaged using focused-ion-beam (FIB) milling and high-resolution scanning electron microscopy (SEM), respectively. The FIB milling method has the advantage of removing material in a localized region without producing mechanical damage to the specimen. The micrographs of the cross-sectioned indentations indicate that most of the plastic deformation around the indentation is dominated by the soft aluminum substrate. There is a very small change in the multilayered film thickness around the indentation—less than 10%. The plastic deformation of the thin film resembles a membrane being deflected by a localized pressure gradient across the membrane. Stress-induced voids are also observed in the multilayered film, especially in the area around the indentation apex. The density and the size of the voids increase with indentation depth. Indentation sink-in effects are observed in all of the indentations inspected. Based on the experimental results, the amount of sink-in of the hard film–soft substrate composite is larger than the bulk substrate and film alone. This is confirmed by the finite element analyses conducted in this work.


Sign in / Sign up

Export Citation Format

Share Document