Indentation plastic displacement field: Part II. The case of hard films on soft substrates

1999 ◽  
Vol 14 (6) ◽  
pp. 2204-2209 ◽  
Author(s):  
T. Y. Tsui ◽  
Joost Vlassak ◽  
William D. Nix
Keyword(s):  
Plastic Deformation ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Mechanical Damage ◽  
Multilayered Film ◽  
Milling Method ◽  
Bulk Substrate ◽  
Small Change ◽  
Plastic Displacement ◽  
Made In

The plastic displacements around Knoop indentations made in hard titanium/aluminum multilayered films on soft aluminum alloy substrates have been studied. Indentations were cross-sectioned and imaged using focused-ion-beam (FIB) milling and high-resolution scanning electron microscopy (SEM), respectively. The FIB milling method has the advantage of removing material in a localized region without producing mechanical damage to the specimen. The micrographs of the cross-sectioned indentations indicate that most of the plastic deformation around the indentation is dominated by the soft aluminum substrate. There is a very small change in the multilayered film thickness around the indentation—less than 10%. The plastic deformation of the thin film resembles a membrane being deflected by a localized pressure gradient across the membrane. Stress-induced voids are also observed in the multilayered film, especially in the area around the indentation apex. The density and the size of the voids increase with indentation depth. Indentation sink-in effects are observed in all of the indentations inspected. Based on the experimental results, the amount of sink-in of the hard film–soft substrate composite is larger than the bulk substrate and film alone. This is confirmed by the finite element analyses conducted in this work.

Indentation plastic displacement field: Part I. The case of soft films on hard substrates

1999 ◽  
Vol 14 (6) ◽  
pp. 2196-2203 ◽  
Author(s):  
T. Y. Tsui ◽  
Joost Vlassak ◽  
William D. Nix
Keyword(s):  
Plastic Deformation ◽  
Cross Sections ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Porous Titanium ◽  
Titanium Layer ◽  
Plastic Deformation Behavior ◽  
Plastic Displacement ◽  
Film Substrate ◽  
Made In

The plastic deformation behavior of Knoop indentations made in a soft, porous titanium/aluminum multilayered thin film on a hard silicon substrate is studied through use of the focused-ion-beam milling and imaging technique. Pileup is observed for indentations with depths larger than 30% of the total film thickness. Analysis of the indentation cross sections shows that plastic deformation around the indentation is partly accommodated by the closing of the pores within the multilayers. This densification process reduces the amount of pileup formed below that predicted by finite element simulations. Experimental results show that the pileup is formed by an increase of the titanium layer thickness near the edges of the indentation. The thickness increase is largest near the film/substrate interface and decreases toward the surface of the multilayered film. The amount of normal compression near the center of the indenter is characterized, and it is demonstrated that the deformation becomes more nonuniform with increasing indentation depth.

FIB Micromachining and Nano-Structure Fabrication

1999 ◽  
Author(s):  
Raymond A. Lee ◽  
Patrick J. Wolpert
Keyword(s):  
High Precision ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Biological Applications ◽  
Optical Lens ◽  
Nano Structure ◽  
Beam System ◽  
Afm Tips ◽  
Established Technique ◽  
Made In

Abstract FIB Micromachining has long been an established technique, but until recently it has been overshadowed by the more mainstream semiconductor application of the Focused Ion Beam system. Nano- Structure fabrication using the FIB system has become more popular recently due to several factors. The need for sub-micron structures have grown significantly due to a need for enhanced optical and biological applications. Another reason for the growth in micromachining is the improvement made in the ability of FIB systems to produce geometric shapes with high precision. With the latest high-end FIB systems, it is possible to produce microstructures with tens of nano-meters of precision. Optical lens, AFM tips, and nano-apertures are all part of the growing application for FIB Micromachining. This paper will discuss the ability and limitations of the FIB system and some possible application for FIB Micromachining.

scholarly journals Micron-Scale Deformation: A Coupled In Situ Study of Strain Bursts and Acoustic Emission

2017 ◽  
Vol 23 (6) ◽  
pp. 1076-1081 ◽  
Author(s):  
Ádám István Hegyi ◽  
Péter Dusán Ispánovity ◽  
Michal Knapek ◽  
Dániel Tüzes ◽  
Kristián Máthis ◽  
...  
Keyword(s):  
Plastic Deformation ◽  
Acoustic Emission ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Data Sampling ◽  
Deformation Curves ◽  
High Data ◽  
Excellent Control ◽  
As Stress

AbstractPlastic deformation of micron-scale crystalline materials differs considerably from bulk samples as it is characterized by stochastic strain bursts. To obtain a detailed picture of the intermittent deformation phenomena, numerous micron-sized specimens must be fabricated and tested. An improved focused ion beam fabrication method is proposed to prepare non-tapered micropillars with excellent control over their shape. Moreover, the fabrication time is less compared with other methods. The in situ compression device developed in our laboratory allows high-accuracy sample positioning and force/displacement measurements with high data sampling rates. The collective avalanche-like motion of the dislocations is observed as stress decreases on the stress–strain curves. An acoustic emission (AE) technique was employed for the first time to study the deformation behavior of micropillars. The AE technique provides important additional in situ information about the underlying processes during plastic deformation and is especially sensitive to the collective avalanche-like motion of the dislocations observed as the stress decreases on the deformation curves.

Characterisation of nanoporous materials using Focused Ion Beam milling method

2012 ◽  
Author(s):  
Sahand Chitsaz Charandabi ◽  
Aydin Sabouri ◽  
Hossein Ostadi ◽  
Carl J. Anthony ◽  
Philip D. Prewett
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Nanoporous Materials ◽  
Milling Method ◽  
Focused Ion Beam Milling

Effect of Machining of Small Tools by Means of Focused Ion Beam

2012 ◽  
Vol 565 ◽  
pp. 588-593
Author(s):  
Kohichi Miura ◽  
Syou Satoh ◽  
Takazo Yamada ◽  
Hwa Soo Lee
Keyword(s):  
Experimental Evaluation ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cutting Edge ◽  
Geometrical Shape ◽  
Geometrical Shapes ◽  
Micro Holes ◽  
Made In ◽  
The Ideal

Micro holes which diameters are more than 0.1 mm are mechanically machined.　However since the ideal sharp cutting edges are difficult to be made in micro drills, fine geometrical shape of micro holes is difficult to be obtained. In this study, the influence of the geometrical shape of cutting edge is experimentally discussed. In order to carry out experimental evaluation, focused ion beam is used to make the geometrical shapes of micro drills.

Focused Ion Beam Milling of Crystalline Diamonds

2011 ◽  
Vol 1282 ◽  
Author(s):  
Rustin Golnabi ◽  
Won I. Lee ◽  
Deok-Yang Kim ◽  
Glen R. Kowach
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Milling Process ◽  
Pattern Design ◽  
Wide Range ◽  
Milling Method ◽  
Micrometer Size ◽  
New Applications ◽  
Milling Yield ◽  
Focused Ion Beam Milling

ABSTRACTRecently, a wide range of new applications of diamond materials such as spintronics, field emission, and bio-sensing have been proposed. These applications often require the precise patterning of diamonds, which is not trivial because diamonds are the hardest materials known in nature. Among various patterning techniques, the focused ion beam milling method has been proven to provide flexibility as well as high resolution in the pattern design. In this study, a focused beam of 30 kV Ga+ ions was utilized to create sub-micrometer size patterns out of crystalline diamonds. The sputtering rate, re-deposition, and surface roughening of diamond structure have been closely monitored with various milling parameters during the milling process. Our study revealed a low milling yield of 0.02 μm3/nC, high Ga content re-deposition, and the formation of sub-micron scale terracing on the sidewall of patterned diamonds.

A Novel Method to Inspect Deep Trench Capacitor Planar Profiles in DRAM

2006 ◽  
Author(s):  
J. L. Lue ◽  
A. Huang ◽  
T. Wang
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cost Effective ◽  
Large Area ◽  
Deep Trench ◽  
Milling Method ◽  
Novel Method ◽  
Scanning Electron

Abstract This paper presents a novel method to inspect deep trench (DT) planar profiles at any particular depths using the mechanical polishing method instead of the Focused Ion Beam (FIB) milling method. The sample is polished at a small beveled angle and then inspected in the Scanning Electron Microscope (SEM). This method creates a large area for the inspection of DT profiles. It is accurate and fast in providing the result on process evaluation and failure analysis. Since the FIB is not needed, it is also simple and cost effective.

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