Thickness and grain size dependence of the strength of copper thin films as investigated with bulge tests and nanoindentations

Author(s):  
Benoit Merle ◽  
Elmar W. Schweitzer ◽  
Mathias Göken
1986 ◽  
Vol 4 (5-7) ◽  
pp. 313-315 ◽  
Author(s):  
A.F. Jankowski ◽  
J.F. Shewbridge

1993 ◽  
Vol 8 (2) ◽  
pp. 237-238 ◽  
Author(s):  
C.V. Thompson

In recent experiments it has been shown that the yield stress of polycrystalline thin films depends separately on the film thickness and the grain size. It was also shown that the grain size dependence varies as the reciprocal of the grain size. In this paper an analysis is presented which leads to these results and provides a more detailed understanding of the origins of the observed behavior.


2017 ◽  
Vol 19 (19) ◽  
pp. 12206-12220 ◽  
Author(s):  
Jay Sheth ◽  
Di Chen ◽  
Harry L. Tuller ◽  
Scott T. Misture ◽  
Sean R. Bishop ◽  
...  

In-situ wafer curvature and x-ray diffraction measurements were employed to investigate the grain size dependence of stress and strain in Pr doped ceria thin films.


1997 ◽  
Vol 81 (8) ◽  
pp. 4122-4124 ◽  
Author(s):  
M. A. Akhter ◽  
D. J. Mapps ◽  
Y. Q. Ma Tan ◽  
Amanda Petford-Long ◽  
R. Doole

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