Numerical Simulation of the Degradation Behavior of the Phenolic Resin Matrix During the Production of Carbon/Carbon Composites

Carbon-carbon composites (CCCs) widely used in the aerospace and automotive industries due to their excellent mechanical and thermal properties. Phenolic resins have a relatively high carbon yield, which makes them a suitable candidate for CCCs manufacturing. Molecular Dynamics (MD) can further reduce costs by predicting properties of a material before manufacturing and testing. In the present work, a Molecular Dynamics (MD) model of a crosslinked phenolic resin was developed to predict mechanical properties by implementing the fix bond/react algorithm in LAMMPS. The predicted mass density (ρ) and Young’s Modulus (E) agree well with experimental values and highlights the validity of the topologybased approach to building stable molecular models of phenolic resins.

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Effects of pressure and temperature on thermal contact resistance between different materials

Thermal Science ◽

10.2298/tsci1504369z ◽

2015 ◽

Vol 19 (4) ◽

pp. 1369-1372 ◽

Cited By ~ 3

Author(s):

Zhe Zhao ◽

Hai-Ming Huang ◽

Qing Wang ◽

Song Ji

Keyword(s):

Thermal Conductivity ◽

Contact Resistance ◽

Thermal Contact Resistance ◽

Experimental Approach ◽

Phenolic Resin ◽

Thermal Conductivity Coefficient ◽

Thermal Contact ◽

Carbon Composites ◽

Interfacial Temperature ◽

Temperature And Pressure

To explore whether pressure and temperature can affect thermal contact resistance, we have proposed a new experimental approach for measurement of the thermal contact resistance. Taking the thermal contact resistance between phenolic resin and carbon-carbon composites, cuprum, and aluminum as the examples, the influence of the thermal contact resistance between specimens under pressure is tested by experiment. Two groups of experiments are performed and then an analysis on influencing factors of the thermal contact resistance is presented in this paper. The experimental results reveal that the thermal contact resistance depends not only on the thermal conductivity coefficient of materials, but on the interfacial temperature and pressure. Furthermore, the thermal contact resistance between cuprum and aluminum is more sensitive to pressure and temperature than that between phenolic resin and carbon-carbon composites.

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Preparation and damping properties of medium-temperature co-cured phenolic resin matrix composite structures

Composite Structures ◽

10.1016/j.compstruct.2019.03.034 ◽

2019 ◽

Vol 217 ◽

pp. 122-129 ◽

Cited By ~ 11

Author(s):

Changsheng Zheng ◽

Sen Liang

Keyword(s):

Matrix Composite ◽

Composite Structures ◽

Phenolic Resin ◽

Resin Matrix ◽

Damping Properties ◽

Medium Temperature ◽

Resin Matrix Composite

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Influence of Phenolic Resin Surface Treatment Agent on Interfacial Adhesion of Carbon Fibre Reinforced Epoxy Resin Composites

Advanced Composites Letters ◽

10.1177/096369350701600605 ◽

2007 ◽

Vol 16 (6) ◽

pp. 096369350701600 ◽

Cited By ~ 1

Author(s):

Chao Wang ◽

Jing Wang ◽

Yongan Niu

Keyword(s):

Carbon Fibre ◽

Surface Treatment ◽

Epoxy Resin ◽

Photoelectron Spectroscopy ◽

Interfacial Adhesion ◽

Phenolic Resin ◽

Resin Matrix ◽

Resin Composites ◽

Treatment Agent ◽

Epoxy Resin Composites

To enhance the interfacial adhesion between carbon fibre and epoxy resin matrix, phenolic resin surface treatment agent has been carried out. The influence of phenolic resin treatment agent on interfacial adhesion of carbon fibre reinforced epoxy resin composites were investigated by interlaminar shear strength, atomic force microscopy, X-ray photoelectron spectroscopy and scanning electron microscopy. The results indicated that the interfacial adhesion was improved greatly after carbon fibre treated by phenolic resin surface treatment agent.

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