Carbon nanotube/graphene composites as thermal interface materials for electronic devices

2019 ◽  
Vol 27 (12) ◽  
pp. 907-913
Author(s):  
Xiaogang Wang ◽  
Liuying Zhao ◽  
Jun Liu
Keyword(s):  
Carbon Nanotube ◽  
Electronic Devices ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

scholarly journals Carbon Nanotube Films for Energy Applications

Energies ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1890
Author(s):  
Monika Rdest ◽  
Dawid Janas
Keyword(s):  
Carbon Nanotube ◽  
Mechanical Energy ◽  
Research Community ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Conductive Coatings ◽  
Storage Devices ◽  
Energy Applications ◽  
Wide Range ◽  
Interface Materials

This perspective article describes the application opportunities of carbon nanotube (CNT) films for the energy sector. Up to date progress in this regard is illustrated with representative examples of a wide range of energy management and transformation studies employing CNT ensembles. Firstly, this paper features an overview of how such macroscopic networks from nanocarbon can be produced. Then, the capabilities for their application in specific energy-related scenarios are described. Among the highlighted cases are conductive coatings, charge storage devices, thermal interface materials, and actuators. The selected examples demonstrate how electrical, thermal, radiant, and mechanical energy can be converted from one form to another using such formulations based on CNTs. The article is concluded with a future outlook, which anticipates the next steps which the research community will take to bring these concepts closer to implementation.

Denser and taller carbon nanotube arrays on Cu foils useable as thermal interface materials

2015 ◽  
Vol 54 (9) ◽  
pp. 095102 ◽  
Author(s):  
Nuri Na ◽  
Kei Hasegawa ◽  
Xiaosong Zhou ◽  
Mizuhisa Nihei ◽  
Suguru Noda
Keyword(s):  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Interface Materials

Coating-boosted interfacial thermal transport for carbon nanotube array nano-thermal interface materials

Carbon ◽  
2019 ◽  
Vol 145 ◽  
pp. 725-733 ◽  
Author(s):  
Lin Qiu ◽  
Pu Guo ◽  
Qinyu Kong ◽  
Chong Wei Tan ◽  
Kun Liang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Transport ◽  
Thermal Interface Materials ◽  
Nanotube Array ◽  
Thermal Interface ◽  
Carbon Nanotube Array ◽  
Interface Materials

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

Architecting Three-Dimensional Networks in Carbon Nanotube Buckypapers for Thermal Interface Materials

2012 ◽  
Vol 116 (6) ◽  
pp. 3903-3909 ◽  
Author(s):  
Hongyuan Chen ◽  
Minghai Chen ◽  
Jiangtao Di ◽  
Geng Xu ◽  
Hongbo Li ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Three Dimensional ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

Present and future thermal interface materials for electronic devices

2017 ◽  
Vol 63 (1) ◽  
pp. 1-21 ◽  
Author(s):  
Kafil M. Razeeb ◽  
Eric Dalton ◽  
Graham Lawerence William Cross ◽  
Anthony James Robinson
Keyword(s):  
Electronic Devices ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Andrew J. McNamara ◽  
Yogendra Joshi ◽  
Zhuomin Zhang ◽  
Kyoung-sik Moon ◽  
Ziyin Lin ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Resistance ◽  
Prolonged Exposure ◽  
Silicon Substrates ◽  
Thermal Interface Materials ◽  
Total Thermal Resistance ◽  
Thermal Interface ◽  
Ir Microscopy ◽  
Vertically Aligned ◽  
Interface Materials

Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from 4 to 50 mm2 KW-1. These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).

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