scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

Effect of h-BN/EP and BNNS/EP Composite Materials on the Reliability of Flip Chip

2021 ◽  
Author(s):  
ZK Li ◽  
Zhekun Fan ◽  
Long Dou ◽  
Zhong Jin ◽  
Zhan Liu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Finite Element ◽  
Current Density ◽  
Flip Chip ◽  
High Current Density ◽  
Electronic Devices ◽  
Thermal Interface Materials ◽  
High Current ◽  
Thermal Interface ◽  
Interface Materials

Abstract Under the action of electro-thermal-mechanical coupling, the failure and performance degradation of electronic devices are prone to occur, which has become a particularly important reliability problem in microelectronic packaging. The improvement of flip chip reliability by using thermal interface materials was studied. First, a three-dimensional finite element model of the flip-chip packaging system, and finite element simulation of electric-thermal-force multi-field coupling were conducted, and the Joule heating, temperature distribution, thermal stress and deformation of the flip-chip under high current density was analyzed. At the same time, the influence of thermal interface material thermal conductivity and operating current on flip chip reliability was studied. Then, the reliability experiment of the flip chip connected to the radiator under high current density was performed, and the temperature change in the flip chip under different thermal interface materials was obtained. Finally, through the combination of experiment and simulation, the influence of thermal interface materials on flip chip reliability was analyzed. It is further confirmed that the reliability and service life of electronic devices were effectively improved by using the high thermal conductivity BNNS/epoxy composite material prepared in this paper.

Achieving Significant Thermal Conductivity Improvement via Constructing Vertically Arranged and Covalently Bonded Silicon Carbide Nanowires/Natural Rubber Composites

2021 ◽  
Author(s):  
Shuaishuai Cheng ◽  
Xiaoyuan Duan ◽  
Liu Xiaoqing ◽  
Zhiyi Zhang ◽  
Dong An ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Natural Rubber ◽  
Electronic Devices ◽  
Thermal Interface Materials ◽  
Rubber Composites ◽  
Thermal Interface ◽  
Covalently Bonded ◽  
Natural Rubber Composites ◽  
Interface Materials

Abstract: With the development of electronic devices, it is becoming increasingly important for thermal interface materials (TIM) to efficiently and quickly remove the heat generated. However, due to the high...

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Joseph R. Wasniewski ◽  
David H. Altman ◽  
Stephen L. Hodson ◽  
Timothy S. Fisher ◽  
Anuradha Bulusu ◽  
...  
Keyword(s):  
Steady State ◽  
High Performance ◽  
Applied Pressure ◽  
Test Facility ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Interface Resistance ◽  
Vertically Aligned ◽  
Performance Results ◽  
Interface Materials

The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low resistance heat transport from device-to-spreader and compliance between materials with dissimilar coefficients of thermal expansion (CTEs), but few application-ready configurations have been produced and tested. Recently, we have undertaken major efforts to develop functional nanothermal interface materials (nTIMs) based on short, vertically aligned CNTs grown on both sides of a thin interposer foil and interfaced with substrate materials via metallic bonding. A high-precision 1D steady-state test facility has been utilized to measure the performance of nTIM samples, and more importantly, to correlate performance to the controllable parameters. In this paper, we describe our material structures and the myriad permutations of parameters that have been investigated in their design. We report these nTIM thermal performance results, which include a best to-date thermal interface resistance measurement of 3.5 mm2 K/W, independent of applied pressure. This value is significantly better than a variety of commercially available, high-performance thermal pads and greases we tested, and compares favorably with the best results reported for CNT-based materials in an application-representative setting.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

Managing Human Resources in Family Businesses

2014 ◽  
pp. 96-112 ◽  
Author(s):  
Santiago Gutiérrez-Broncano ◽  
Mercedes Rubio-Andrés ◽  
Pedro Jiménez Estévez
Keyword(s):  
Human Capital ◽  
Human Resources ◽  
High Performance ◽  
Negative Impact ◽  
Business Owners ◽  
Family Businesses ◽  
Future Research ◽  
Research Directions ◽  
Positive Effects ◽  
Future Research Directions

Although a lot of research has been carried out in the field of family businesses in recent years, not much of it has focused on human resource management. After compiling the major studies, both negative aspects (e.g. nepotism) and positive ones (e.g. employee commitment) have been identified. Therefore, the authors propose high-performance human resources practices to reduce the negative impact of family in business and boost the positive effects, increase their human capital, and achieve a competitive advantage in this field. Finally, the authors provide key insights for practitioners, family business owners, and managers, and they propose future research directions.

A Context and Content Reflection on Business-IT Alignment Research

2012 ◽  
Vol 3 (2) ◽  
pp. 21-37 ◽  
Author(s):  
John Joe Parappallil ◽  
Novica Zarvic ◽  
Oliver Thomas
Keyword(s):  
Point Of View ◽  
Future Research ◽  
Research Directions ◽  
It Alignment ◽  
Systems Research ◽  
Information Systems Research ◽  
Metadata Analysis ◽  
Future Research Directions ◽  
Business It Alignment ◽  
Research Domain

In this paper, the authors present the results of a recently performed literature analysis on the topic of Business-IT Alignment. They have thereby investigated 270 articles from the period 1993-2011 in a structured way. The articles were selected on the basis of three well-known ranking lists of publications in the Information Systems research domain. In the authors’ analysis they distinguish a context and a content point of view. The former one focuses on metadata analysis of the articles under consideration whereas the latter one uses text mining techniques to dive into the articles´ body of content. Finally, they discuss their results and present conceivable future research directions that should be tackled by alignment researchers and conclude their paper.

A review on the mechanical properties of textile structural composite T-beams

2019 ◽  
Vol 90 (5-6) ◽  
pp. 710-727 ◽  
Author(s):  
Yiwei Ouyang ◽  
Xianyan Wu
Keyword(s):  
Mechanical Properties ◽  
High Performance ◽  
Raw Materials ◽  
Research Progress ◽  
Future Research ◽  
Research Directions ◽  
Structural Composite ◽  
Delamination Resistance ◽  
Application Potential ◽  
Future Research Directions

In order to review the most effective ways to improve the mechanical properties of composite T-beams and further increase their application potential, research progress on the mechanical properties of textile structural composite T-beams was summarized based on two-dimensional (2-D) ply structure composite T-beams, delamination resistance enhanced 2-D ply structure T-beams, and three-dimensional (3-D) textile structural composite T-beams; future research directions for composite T-beams were also considered. From existing literature, the research status and application bottlenecks of 2-D ply structure composite T-beams and T-beams with enhanced delamination resistance performance were described, as were the specific classification, research progress, and mechanical properties of 3-D textile structural composite T-beams. In addition, the superior mechanical properties of 3-D braided textile structural composite T-beams, specifically their application potential based on excellent delamination resistance capacity, were highlighted. Future research directions for composite T-beams, that is, the applications of high-performance raw materials, locally enhanced design, structural blending enhancement, functionality, and intelligence are presented in this review.

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