Low-energy electron beam generation in inductively coupled plasma via a DC biased grid

Author(s):  
Jiwon Jung ◽  
Moo-Young Lee ◽  
Jae-Gu Hwang ◽  
Moo-Hyun Lee ◽  
Min-Seok Kim ◽  
...  

Abstract Low-energy electron beam generation using a DC biased grid was investigated in an inductively coupled plasma (ICP). The electron beam was measured in argon gas at various pressures, ICP source powers, and substrate voltages (Vsub). At a low ICP source power (50 W), an electron beam was generated even at small values of Vsub (10 V), however at a high ICP source power (200 W), an electron beam was only generated when a higher voltage (30 V) was applied due to the short sheath thickness on the grid surface. The sheath on the grid surface is an important factor for generating electron beams because low-energy electrons are blocked. If the sheath thickness to small, a high voltage should be applied to generate an electron beam, as accelerate regions cannot exist without the sheath. At high pressure, since electrons experience numerous neutral collisions, a high substrate voltage is needed to generate an electron beam. However, if the applied substrate voltage becomes too high (40 V) at high pressure, high-energy electrons result in secondary plasma under the grid. Therefore, maintaining a low pressure and low ICP source power is important for generating electron beams.

2021 ◽  
Vol 640 (3) ◽  
pp. 032006
Author(s):  
U A Bliznyuk ◽  
P Yu Borchegovskaya ◽  
A P Chernyaev ◽  
V S Ipatova ◽  
V A Leontiev ◽  
...  

1998 ◽  
Vol 510 ◽  
Author(s):  
T. Maeda ◽  
J. W. Lee ◽  
C. R. Abernathy ◽  
S. J. Pearton ◽  
F. Ren ◽  
...  

AbstractThe effects of Inductively Coupled Plasma (ICP) and Electron Cyclotron Resonance (ECR) H2 plasmas on GaAs metal semiconductor field effect transistors (MESFETs), high electron mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs) have been measured as a function of ion flux, ion energy and process pressure. The chemical effects of hydrogenation have been compared to direct physical bombardment by Ar plasmas under the same conditions. Si dopant passivation in MESFETs and HEMTs and C base-dopant passivation in HBTs produces much larger changes in sheet resistance, breakdown voltage and device gain or transconductance than Ar ion bombardment and suggests that H2-containing plasma chemistries (CH4/H2 for semiconductor etching, SiH4 for dielectric deposition, CHF3 for dielectric etching) should be avoided, or at least the exposure of the surface minimized. In some cases the device degradation is less for higher source power conditions, due to the suppression of cathode dc self-bias and hence ion energy.


2002 ◽  
Author(s):  
Kaoru Koike ◽  
Shinji Omori ◽  
Kazuya Iwase ◽  
Isao Ashida ◽  
Shigeru Moriya

2009 ◽  
Vol 18 (1) ◽  
pp. 015017 ◽  
Author(s):  
A Lacoste ◽  
S Béchu ◽  
O Maulat ◽  
J Pelletier ◽  
Y Arnal

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