scholarly journals Micro-scale temperature measurement method using fluorescence polarization

2016 ◽  
Vol 745 ◽  
pp. 032097
Author(s):  
K. Tatsumi ◽  
C-H. Hsu ◽  
A. Suzuki ◽  
K. Nakabe
Author(s):  
Jun Young Kim ◽  
Kyung Min Jang ◽  
Hong Cheon Yang ◽  
Kwang-Sun Kim

In this research, uniformity of temperature on wafer in fine scale was investigated. A measurement system has been developed, and a sensor as thin-film thermocouple was fabricated using a lift-off process. To generate EMF voltage by Seebeck effect, Chromel and Alumel materials were used for the thermocouple. The system obtains the micro scale temperature from multi-points on the surface of the wafer and then precisely analyzes thermal distribution. A numerical analysis was performed to compare to the measurement method. The experimental results and the analysis shows the system can be used for thermal measurement in a micro scale.


2017 ◽  
Vol 54 (8) ◽  
pp. 2607-2616
Author(s):  
Kazuya Tatsumi ◽  
Chi Hsuan Hsu ◽  
Atsushi Suzuki ◽  
Kazuyoshi Nakabe

Author(s):  
Kazuya Tatsumi ◽  
Akihisa Tozaki ◽  
Kazuyoshi Nakabe

A fluid temperature measurement method in microscopic scale using fluorescence polarization is described in this study. The present method has the advantages in not only noncontact but also markedly reducing the influences of solution pH and quenching on the measured fluid temperature, compared to other methods including LIF (laser induced fluorescence) method. In the case of a fluid at rest, the fluorescence intensity varied with pH and linearly decreased with the elapsed time, while the polarization degree remained nearly constant. The polarization degree showed a good correlation with the fluid viscosity and temperature that corresponded to the tendency of the analytical results. The microchannel flows case also showed a good correlation between the fluid temperature and the fluorescence polarization degree was observed, which was similar to the stationary fluid case. These results affirmed the feasibility of our method using fluorescence polarization for fluid temperature measurement.


2021 ◽  
Vol 11 (9) ◽  
pp. 3913
Author(s):  
Kaifeng Zheng ◽  
Jinguang Lü ◽  
Yingze Zhao ◽  
Jin Tao ◽  
Yuxin Qin ◽  
...  

The turbine blade is a key component in an aeroengine. Currently, measuring the turbine blade radiation temperature always requires obtaining the emissivity of the target surface in advance. However, changes in the emissivity and the reflected ambient radiation cause large errors in measurement results. In this paper, a three-wavelength radiation temperature measurement method was developed, without known emissivity, for reflection correction. Firstly, a three-dimensional dynamic reflection model of the turbine blade was established to describe the ambient radiation of the target blade based on the real surface of the engine turbine blade. Secondly, based on the reflection correction model, a three-wavelength radiation temperature measurement algorithm, independent of surface emissivity, was proposed to improve the measurement accuracy of the turbine blade radiation temperature in the engine. Finally, an experimental platform was built to verify the temperature measurement method. Compared with three conventional colorimetric methods, this method achieved an improved performance on blade temperature measurement, demonstrating a decline in the maximum error from 6.09% to 2.13% and in the average error from 2.82% to 1.20%. The proposed method would benefit the accuracy in the high-temperature measurement of turbine blades.


2020 ◽  
Vol 91 (1) ◽  
pp. 015007
Author(s):  
Chi Wang ◽  
Yidong Zhang ◽  
Jianmei Sun ◽  
Chenye Yang ◽  
Xuan Ren ◽  
...  

Author(s):  
Hongcheon Yang ◽  
Jun Young Kim ◽  
Kwang-Sun Kim

As the demand of complex and small scale semiconductor devices has been increased, the measurement technologies were developed to meet the accurate requirement in semiconductor manufacturing process. The uniform temperature requirement on the wafer is the major factor related to the semiconductor device yield. It is normally acquired from the thermocouples following the inner wall of the chamber. However, since the temperature difference between the wall of equipment and the surface of wafer is existed, the actual wafer temperature is commonly measured by a thermocouple wafer to calibrate the temperature measurement accuracy of the equipment. However, as the diameter of the commercial thermocouple wires is larger than the recently demanded pattern size, the TC wafer has not been able to measure the micro scale temperature differences on the micro patterned wafer. We, therefore, designed a micro-scale thermal sensor. The developed sensor has 37 sets of the measurement points on a 4-inch silicon wafer. The size of the measurement point is approximate to 16 um2. Two alloys, chromel and alumel which are as same as the materials of the K-type thermocouple are used to generate the thermoelectric voltage. The sensor has the temperature range of −200°C to 1300°C. The commercial K-type thermocouple extension wires are connected to the pads of the sensor array and they transfer the analog voltage data to a data acquisition device (DAQ). The sensor was calibrated by comparing the EMF voltage at different temperatures to the standard thermocouple EMF voltage. With the developed micro-scale thermal sensor system, the temperature distribution of the wafer in the furnace chamber is obtained.


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