Quantitative calibration of conductive pattern growth via electroless copper plating at nano-resolution

2020 ◽  
Vol 8 (3) ◽  
pp. 035003
Author(s):  
Yanqiu Chen ◽  
Yu Liu ◽  
Wei Xu ◽  
Yang Zhang ◽  
Heng-Yong Nie
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Conductive Pattern ◽  
Electroless Copper ◽  
Pattern Growth

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

2016 ◽  
Vol 6 (1) ◽  
pp. 65-73
Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper

New and clean strategy for the determination of Cu2+ in electroless copper plating baths

2007 ◽  
Vol 68 (1) ◽  
pp. 150-155 ◽  
Author(s):  
Rutao Liu ◽  
Wansong Zong ◽  
Canzhu Gao ◽  
Zhenxing Chi ◽  
Lijun Zhang
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless Copper Plating Process by Applying Alternating One-Side Air Stirring Method for High-Aspect-Ratio Through-Holes

2017 ◽  
Vol 164 (12) ◽  
pp. D771-D777 ◽  
Author(s):  
H. Kanemoto ◽  
T. Kawamura ◽  
H. Suzuki ◽  
T. Miyazaki ◽  
H. Mozumi ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper
Sign in / Sign up

Export Citation Format

Share Document