scholarly journals How surface stress transforms surface profiles and adhesion of rough elastic bodies

2020 ◽  
Vol 476 (2243) ◽  
pp. 20200477
Author(s):  
Chung-Yuen Hui ◽  
Zezhou Liu ◽  
Nicolas Bain ◽  
Anand Jagota ◽  
Eric R. Dufresne ◽  
...  
Keyword(s):  
Surface Stress ◽  
Periodic Structures ◽  
Surface Profile ◽  
Initial Surface ◽  
One Dimensional ◽  
Patterned Substrate ◽  
Soft Solids ◽  
Elastic Bodies ◽  
Surface Profiles ◽  
Qualitative Changes

The surface of soft solids carries a surface stress that tends to flatten surface profiles. For example, surface features on a soft solid, fabricated by moulding against a stiff-patterned substrate, tend to flatten upon removal from the mould. In this work, we derive a transfer function in an explicit form that, given any initial surface profile, shows how to compute the shape of the corresponding flattened profile. We provide analytical results for several applications including flattening of one-dimensional and two-dimensional periodic structures, qualitative changes to the surface roughness spectrum, and how that strongly influences adhesion.

Analysis of Handling Stresses in Thin Solar Silicon Wafers Generated by a Rigid Vacuum Gripper

2015 ◽  
Vol 138 (3) ◽  
Author(s):  
Hao Wu ◽  
Shreyes N. Melkote
Keyword(s):  
Stress Distribution ◽  
Dominant Role ◽  
High Stress ◽  
Surface Profile ◽  
Silicon Wafers ◽  
Wafer Surface ◽  
Initial Surface ◽  
Fe Modeling ◽  
Solar Silicon ◽  
Surface Profiles

Breakage of thin solar silicon wafers during handling and transport depends on the stresses imposed on the wafer by the handling/transport device. In this paper, the stresses generated in solar silicon wafers by a rigid vacuum gripper are analyzed via a combination of experiments and numerical modeling. Specifically, stresses produced in monocrystalline (Cz) and multicrystalline (Cast) silicon wafers of different thicknesses when handled by a vacuum gripper are analyzed using the finite element (FE) method. With the measured surface profiles of the wafer and the gripper as input, the handling process is simulated using FE modeling and the stress distribution obtained. The FE modeling results are validated by experimental data of wafer surface profile during handling. The results show that while the vacuum level does not have significant impact on the stress distribution, the initial surface profiles of the thin wafer and gripper play a dominant role in producing regions of high stress in the wafer.

Instabilities, Elasticity, and Wetting Effect in Multilayer Heteroepitaxial Growth

2003 ◽  
Vol 794 ◽  
Author(s):  
Zhi-Feng Huang ◽  
Rashmi C. Desai
Keyword(s):  
Periodic Structures ◽  
Morphological Evolution ◽  
Surface Profile ◽  
Theoretical Work ◽  
Semiconductor Films ◽  
Morphological Instability ◽  
Heteroepitaxial Growth ◽  
Surface And Interface ◽  
Short Period ◽  
Short Period Superlattices

ABSTRACTFor multilayer semiconductor films comprising various material layers, the coupling of elastic states in different layers as well as the nonequilibrium nature of the growing process are essential in understanding the surface and interface morphological instability and hence the growth mechanisms of nanostructures in the overall film. We present the theoretical work on the stress-driven instabilities during the heteroepitaxial growth of multilayers, based on the elastic analysis and the continuous nonequilibrium model. We develop a general theory which determines the morphological evolution of surface profile of the multilayer system, and then apply the results to two types of periodic structures that are being actively investigated: alternating tensile/compressive and strained/spacer multilayers. The wetting effect, which arises from the material properties changing across layer-layer interfaces, is incorporated. It exhibits a significant influence of stabilization on film morphology, particularly for the short-period superlattices. Our results are consistent with the experimental observations in AlAs/InAs/InP(001) and Ge/Si(001) multilayer structures.

Anomalous phase in one-dimensional, multilayer, periodic structures with birefringent materials

2004 ◽  
Vol 70 (16) ◽  
Author(s):  
A. Mandatori ◽  
C. Sibilia ◽  
M. Bertolotti ◽  
S. Zhukovsky ◽  
J. W. Haus ◽  
...  
Keyword(s):  
Periodic Structures ◽  
One Dimensional

scholarly journals A Simple Model to Predict Machined Depth and Surface Profile for Picosecond Laser Surface Texturing

2018 ◽  
Vol 8 (11) ◽  
pp. 2111 ◽  
Author(s):  
Jieyu Xian ◽  
Xingsheng Wang ◽  
Xiuqing Fu ◽  
Zhengwei Zhang ◽  
Lu Liu ◽  
...  
Keyword(s):  
Mathematical Model ◽  
Surface Texturing ◽  
Surface Profile ◽  
Picosecond Laser ◽  
Scanning Speed ◽  
Laser Surface ◽  
Laser Surface Texturing ◽  
Micro Channels ◽  
Surface Profiles ◽  
Simulation Parameters

A simple mathematical model was developed to predict the machined depth and surface profile in laser surface texturing of micro-channels using a picosecond laser. Fabrication of micro-craters with pulse trains of different numbers was initially performed. Two baseline values from the created micro-craters were used to calculate the estimated simulation parameters. Thereafter, the depths and profiles with various scanning speeds or adjacent intervals were simulated using the developed model and calculated parameters. Corresponding experiments were conducted to validate the developed mathematical model. An excellent agreement was obtained for the predicted and experimental depths and surface profiles. The machined depth decreased with the increase of scanning speed or adjacent interval.

scholarly journals A Parameter Study of Localization

1996 ◽  
Vol 3 (1) ◽  
pp. 1-10 ◽  
Author(s):  
Sandor Stephen Mester ◽  
Haym Benaroya
Keyword(s):  
Periodic Structures ◽  
Numerical Study ◽  
Vibration Characteristics ◽  
Periodic Pattern ◽  
Parameter Study ◽  
Structural Damping ◽  
One Dimensional

Extensive work has been done on the vibration characteristics of perfectly periodic structures. Disorder in the periodic pattern has been found to lead to localization in one-dimensional periodic structures. It is important to understand localization because it causes energy to be concentrated near the disorder and may cause an overestimation of structural damping. A numerical study is conducted to obtain a better understanding of localization. It is found that any mode, even the first, can localize due to the presence of small imperfections.

scholarly journals Periodic and Near-Periodic Structures

1995 ◽  
Vol 2 (1) ◽  
pp. 69-95 ◽  
Author(s):  
S. S. Mester ◽  
H. Benaroya
Keyword(s):  
State Physics ◽  
Solid State ◽  
Periodic Structures ◽  
Vibration Characteristics ◽  
Aerospace Engineering ◽  
Structural Damping ◽  
Solid State Physics ◽  
One Dimensional ◽  
Fields Of Study ◽  
Effects Of Disorder

Extensive work has been done on the vibration characteristics of perfectly periodic structures. This article reviews the different methods of analysis from several fields of study, for example solid-state physics and civil, mechanical, and aerospace engineering, used to determine the effects of disorder in one-dimensional (1-D) and 2-D periodic structures. In the work examined, disorder has been found to lead to localization in 1-D periodic structures. It is important to understand localization because it causes energy to be concentrated near the disorder and may cause an overestimation of structural damping. The implications of localization for control are also examined.

The Evolution of Contact Stress and Surface Profile in Press-Fitted Shaft under Partial Slip Conditions

2006 ◽  
Vol 321-323 ◽  
pp. 1495-1498 ◽  
Author(s):  
Dong Hyung Lee ◽  
Seok Jin Kwon ◽  
Chan Woo Lee ◽  
Jae Boong Choi ◽  
Young Jin Kim
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Surface Profile ◽  
Contact Stresses ◽  
Fretting Wear ◽  
Partial Slip ◽  
Initial Surface ◽  
Slip Conditions ◽  
Bending Load ◽  
Element Method

In this paper the fretting wear of press-fitted specimens under partial slip conditions was simulated using finite element method and numerical analysis based on Archard's equation. An elasto-plastic analysis of contact stresses in a press-fitted shaft in contact with a boss was conducted with finite element method and the amount of microslip and contact pressure due to bending load was estimated. The predicted wear profile of press-fitted specimens at the contact edge was compared with the experimental results. It is found that the depth of fretting wear by repeated slip between shaft and boss reaches the maximum value at the contact edge. The initial surface profile is continuously changed by the wear at the contact edge, and then the corresponding contact stresses and strain are redistributed.

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