scholarly journals A cold shock protein from a thermophile bacterium promotes the high-temperature growth of bacteria and fungi through binding to diverse RNA species

2019 ◽  
Author(s):  
Zikang Zhou ◽  
Hongzhi Tang ◽  
Weiwei Wang ◽  
Lige Zhang ◽  
Fei Su ◽  
...  

AbstractHigh temperatures deleteriously affect cells by damaging cellular structures and changing the behavior of diverse biomolecules, and extensive research about thermophilic microorganisms has elucidated some of the mechanisms that can overcome these effects and allow thriving in high-temperature ecological niches. We here used functional genomics methods to screen out a cold-shock protein (CspL) from a high-productivity lactate producing thermophile strain (Bacillus coagulans strain 2-6) grown at 37°C and 60°C. We subsequently made the highly striking finding that transgenic expression of CspL conferred massive increases in high temperature growth of other organisms including E. coli (2.4-fold biomass increase at 45°C) and the eukaryote S. cerevisiae (a 2.7-fold biomass increase at 34°C). Pursuing these findings, we used bio-layer interferometry assays to characterize the nucleotide-binding function of CspL in vitro, and used proteomics and RNA-Seq to characterize the global effects of CspL on mRNA transcript accumulation and used RIP-Seq to identify in vivo RNA targets of this nucleotide-binding protein (e.g. rpoE, and rmf, etc.). Finally, we confirmed that a nucleotide-binding-dead variant form of CspL does not have increased growth rates or biomass accumulation effects at high temperatures. Our study thus establishes that CspL can function as a global RNA chaperone.

2021 ◽  
Vol 7 (1) ◽  
Author(s):  
Zikang Zhou ◽  
Hongzhi Tang ◽  
Weiwei Wang ◽  
Lige Zhang ◽  
Fei Su ◽  
...  

AbstractEndowing mesophilic microorganisms with high-temperature resistance is highly desirable for industrial microbial fermentation. Here, we report a cold-shock protein (CspL) that is an RNA chaperone protein from a lactate producing thermophile strain (Bacillus coagulans 2–6), which is able to recombinantly confer strong high-temperature resistance to other microorganisms. Transgenic cspL expression massively enhanced high-temperature growth of Escherichia coli (a 2.4-fold biomass increase at 45 °C) and eukaryote Saccharomyces cerevisiae (a 2.6-fold biomass increase at 36 °C). Importantly, we also found that CspL promotes growth rates at normal temperatures. Mechanistically, bio-layer interferometry characterized CspL’s nucleotide-binding functions in vitro, while in vivo we used RNA-Seq and RIP-Seq to reveal CspL’s global effects on mRNA accumulation and CspL’s direct RNA binding targets, respectively. Thus, beyond establishing how a cold-shock protein chaperone provides high-temperature resistance, our study introduces a strategy that may facilitate industrial thermal fermentation.


1997 ◽  
Vol 60 (12) ◽  
pp. 1583-1594 ◽  
Author(s):  
ELAINE D. BERRY ◽  
PEGGY M. FOEGEDING

Most microorganisms must accommodate a variety of changing conditions and stresses in their environment in order to survive and multiply. Because of the impact of temperature on all reactions of the cell, adaptations to fluctuations in temperature are possibly the most common. Widespread in the environment and well-equipped for cold temperature growth, psychrophilic and psychrotrophic microorganisms may yet make numerous adjustments when faced with temperatures lower than optimum. Phospholipid and fatty acid alterations resulting in increased membrane fluidity at lower temperatures have been described for many cold tolerant microorganisms while others may make no similar adjustment. While the enzymes of cold growing bacteria have been less extensively studied than those of thermophilic bacteria, it appears that function at low temperature requires enzymes with flexible conformational structure, in order to compensate for lower reaction rates. In many organisms, including psychrophilic and psychrotrophic bacteria, specific sets of cold shock proteins are induced upon abrupt shifts to colder temperatures. While this cold shock response has not been fully delineated, it appears to be adaptive, and may function to promote the expression of genes involved in translation when cells are displaced to lower temperatures. The cold shock response of Escherichia coli has been extensively studied, and the major cold shock protein CspA appears to be involved in the regulation of the response. Upon cold shock, the induction of CspA and its counterparts in most microorganisms studied is prominent, but transient; studies of this response in some psychrotrophic bacteria have reported constitutive synthesis and continued synthesis during cold temperature growth of CspA homologues, and it will be interesting to learn if these are common mechanisms of among cold tolerant organisms. Psychrotrophic microorganisms continue to be a spoilage and safety problem in refrigerated foods, and a greater understanding of the physiological mechanisms and implications of cold temperature adaptation and growth should enhance our ability to design more effective methods of preservation.


Biochemistry ◽  
2002 ◽  
Vol 41 (39) ◽  
pp. 11670-11680 ◽  
Author(s):  
Benjamin Schuler ◽  
Werner Kremer ◽  
Hans Robert Kalbitzer ◽  
Rainer Jaenicke

2003 ◽  
Vol 762 ◽  
Author(s):  
A. Gordijn ◽  
J.K. Rath ◽  
R.E.I. Schropp

AbstractDue to the high temperatures used for high deposition rate microcrystalline (μc-Si:H) and polycrystalline silicon, there is a need for compact and temperature-stable doped layers. In this study we report on films grown by the layer-by-layer method (LbL) using VHF PECVD. Growth of an amorphous silicon layer is alternated by a hydrogen plasma treatment. In LbL, the surface reactions are separated time-wise from the nucleation in the bulk. We observed that it is possible to incorporate dopant atoms in the layer, without disturbing the nucleation. Even at high substrate temperatures (up to 400°C) doped layers can be made microcrystalline. At these temperatures, in the continuous wave case, crystallinity is hindered, which is generally attributed to the out-diffusion of hydrogen from the surface and the presence of impurities (dopants).We observe that the parameter window for the treatment time for p-layers is smaller compared to n-layers. Moreover we observe that for high temperatures, the nucleation of p-layers is more adversely affected than for n-layers. Thin, doped layers have been structurally, optically and electrically characterized. The best n-layer made at 400°C, with a thickness of only 31 nm, had an activation energy of 0.056 eV and a dark conductivity of 2.7 S/cm, while the best p-layer made at 350°C, with a thickness of 29 nm, had an activation energy of 0.11 V and a dark conductivity of 0.1 S/cm. The suitability of these high temperature n-layers has been demonstrated in an n-i-p microcrystalline silicon solar cell with an unoptimized μc-Si:H i-layer deposited at 250°C and without buffer. The Voc of the cell is 0.48 V and the fill factor is 70 %.


Alloy Digest ◽  
1995 ◽  
Vol 44 (3) ◽  

Abstract NICROFER 5520 Co is a nickel-chromium-cobalt-molybdenum alloy with excellent strength and creep properties up to high temperatures. Due to its balanced chemical composition the alloy shows outstanding resistance to high temperature corrosion in the form of oxidation and carburization. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance as well as forming, heat treating, machining, and joining. Filing Code: Ni-480. Producer or source: VDM Technologies Corporation.


Alloy Digest ◽  
1994 ◽  
Vol 43 (7) ◽  

Abstract Carlson Alloy C601 is characterized by high tensile, yield and creep-rupture strengths for high temperature service. The alloy is not embrittled by extended exposure to high temperatures and has excellent resistance to stress-corrosion cracking, to carburizing, nitriding and sulfur containing environments. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as creep. It also includes information on forming, heat treating, machining, and joining. Filing Code: Ni-458. Producer or source: G.O. Carlson Inc.


Alloy Digest ◽  
2005 ◽  
Vol 54 (11) ◽  

Abstract Incotherm TD is a thermocouple-sheathing alloy with elements of silicon and rare earths to enhance oxidation resistance at high temperatures. This datasheet provides information on composition, physical properties, and tensile properties as well as deformation. It also includes information on high temperature performance and corrosion resistance as well as forming. Filing Code: Ni-628. Producer or source: Special Metals Corporation.


Alloy Digest ◽  
1954 ◽  
Vol 3 (12) ◽  

Abstract HASTELLOY Alloy X is a nickel-chromium-iron-molybdenum alloy recommended for high-temperature applications. It has outstanding oxidation resistance at high temperatures under most operating conditions, and good high-temperature strength. This datasheet provides information on composition, physical properties, and tensile properties as well as creep. It also includes information on forming, heat treating, and machining. Filing Code: Ni-14. Producer or source: Haynes Stellite Company.


Alloy Digest ◽  
2011 ◽  
Vol 60 (11) ◽  

Abstract Kubota Alloy HT is an iron-chromium-nickel alloy that has both strength and oxidation resistance at high temperatures. This datasheet provides information on composition, physical properties, and tensile properties as well as creep. It also includes information on high temperature performance as well as casting and joining. Filing Code: SS-1108. Producer or source: Kubota Metal Corporation, Fahramet Division.


Alloy Digest ◽  
1964 ◽  
Vol 13 (7) ◽  

Abstract Kentanium K138-A is a high temperature titanium carbide that greatly widens the scope of the engineering design where conditions of intermittent or continuous high temperatures in oxidizing atmospheres are combined with abrasion, and compressive or tensile loads. This datasheet provides information on composition, physical properties, hardness, elasticity, and compressive strength as well as fracture toughness, creep, and fatigue. It also includes information on machining and joining. Filing Code: Ti-40. Producer or source: Kennametal Inc..


Sign in / Sign up

Export Citation Format

Share Document