Reversed de Wolff figure of merit and its application to powder indexing solutions

2013 ◽  
Vol 46 (5) ◽  
pp. 1277-1282 ◽  
Author(s):  
R. Oishi-Tomiyasu
Keyword(s):  
Figure Of Merit ◽  
Zero Point ◽  
Figures Of Merit

Two new figures of merit for powder indexing solutions are proposed: the reversed figure of meritMnRevand the symmetric figure of meritMnSym. These are naturally suggested by the theory underlying the de Wolff figure of meritMn. Nevertheless,MnRevhas characteristics opposite to those ofMnwith regard to sensitivity to impurity peaks and extinct reflections.MnSymhas intermediate properties betweenMnandMnRev. Applications of the new figures of merit to powder indexing solutions and zero-point shift estimation are introduced. All of the figures of merit are available from the powder auto-indexing softwareConograph(http://sourceforge.jp/projects/conograph/; http://research.kek.jp/people/rtomi/ConographGUI/web_page.html).

Proteins and direct methods

1991 ◽  
Vol 197 (3-4) ◽  
Author(s):  
Fan Hai-fu ◽  
Hao Quan ◽  
M. M. Woolfson
Keyword(s):  
First Principles ◽  
Figure Of Merit ◽  
Direct Methods ◽  
Large Structure ◽  
Low Resolution ◽  
Figures Of Merit ◽  
Large Structures ◽  
Resolution Data

AbstractConventional direct methods, which work so well for small structures, are less successful for macromolecules. Where it has been demonstrated that a solution might be found using direct methods it is then found that the usual figures of merit are unable to distinguish the few good sets of phases from the large number of sets generated. The reasons for the difficulties with very large structures are considered from a first-principles approach taking into account both the factors of having a large number of atoms and low resolution data. A proposal is made for trying to recognize good phase sets by taking a large structure as a sum of a number of smaller structures for each of which a conventional figure of merit can be applied.

scholarly journals Thermal Ranges and Figures of Merit for Gold-Containing Precursors For ALD

2020 ◽  
Author(s):  
Matthew Griffiths ◽  
Zachary Dubrawski ◽  
Peter Gordon ◽  
Marcel Junige ◽  
Sean Barry
Keyword(s):  
Atomic Layer Deposition ◽  
Chemical Vapour Deposition ◽  
Figure Of Merit ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Thermal Characteristics ◽  
Atomic Layer ◽  
Figures Of Merit ◽  
Layer Deposition

A survey of known gold-containing chemical vapour deposition (CVD) and atomic layer deposition (ALD) precursors, with a focus on collecting their volatilization and decomposition data. These data were applied to a figure of merit (σ) developed to easily assess the thermal characteristics.

A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit

2004 ◽  
Vol 126 (1) ◽  
pp. 8-13 ◽  
Author(s):  
Ning Zheng ◽  
R. A. Wirtz
Keyword(s):  
Energy Storage ◽  
Thermal Energy ◽  
Thermal Energy Storage ◽  
Figure Of Merit ◽  
Design Procedure ◽  
Storage Device ◽  
Storage Unit ◽  
Figures Of Merit ◽  
Design Requirements ◽  
Plate Type

Two figures of merit for hybrid Thermal Energy Storage (TES) units are developed: the volumetric figure of merit, V˜, and the temperature control figure of merit, ΔT˜. A dimensional analysis shows that these quantities are related to the performance specification of the storage unit and its physical design. A previously benchmarked semi-empirical finite volume model is used to study the characteristics of various plate-type TES-unit designs. A parametric study is used to create a database of optimal designs, which is then used to form simple correlations of V˜ and ΔT˜ in terms of design requirements and attributes. A preliminary design procedure utilizing these figures of merit is suggested. Sample calculations show that these correlations can be used to quickly determine the design attributes of a plate-type TES-unit, given design requirements.

An optimum design for a time-of-flight neutron diffractometer for measuring engineering stresses

2002 ◽  
Vol 35 (1) ◽  
pp. 49-57 ◽  
Author(s):  
Michael W. Johnson ◽  
Mark R. Daymond
Keyword(s):  
Figure Of Merit ◽  
Time Of Flight ◽  
Peak Position ◽  
Shape Parameters ◽  
Gaussian Peak ◽  
Figures Of Merit ◽  
Neutron Diffractometer ◽  
Ceramic Components ◽  
Non Gaussian ◽  
First Time

A method is described for optimizing the design of a time-of-flight neutron diffractometer designed to measure lattice parameters. Such diffractometers are now used extensively by engineers and materials scientists for measuring strain within metallic and ceramic components. The method presented relies on the identification of a figure of merit (FOM) that accurately describes the performance of such an instrument. For the first time, an FOM for an instrument exhibiting non-Gaussian peak shapes is described, and the methods by which this FOM may be maximized are described. Although the instrument described is based on the time-of-flight technique, the FOM derived may equally well be used to optimize a reactor-based instrument. While measuring peak position is a straightforward example, it is shown that similar figures of merit may be found for other peak shape parameters, and thus other types of instrumentation.

Electrical Properties and Figures of Merit for New Chalcogenide-Based Thermoelectric Materials

1997 ◽  
Vol 478 ◽  
Author(s):  
Jon L. Schindler ◽  
Tim P. Hogan ◽  
Paul W. Brazis ◽  
Carl R. Kannewurf ◽  
Duck-Young Chung ◽  
...  
Keyword(s):  
Thermoelectric Materials ◽  
Figure Of Merit ◽  
Room Temperature ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
Figures Of Merit ◽  
Lattice Symmetry ◽  
Thermoelectric Refrigeration ◽  
Polychalcogenide Flux ◽  
P Type

AbstractNew Bi-based chalcogenide compounds have been prepared using the polychalcogenide flux technique for crystal growth. These materials exhibit characteristics of good thermoelectric materials. Single crystals of the compound CsBi4Te6 have shown conductivity as high as 2440 S/cm with a p-type thermoelectric power of ≈ +110 μV/K at room temperature. A second compound, β-K2Bi8Se13 shows lower conductivity ≈ 240 S/cm, but a larger n-type thermopower ≈ −200 μV/K. Thermal transport measurements have been performed on hot-pressed pellets of these materials and the results show comparable or lower thermal conductivities than Bi2Te3. This improvement may reflect the reduced lattice symmetry of the new chalcogenide thermoelectrics. The thermoelectric figure of merit for CsBi4Te6 reaches ZT ≈ 0.32 at 260 K and for β-K2Bi8Se13 ZT ≈ 0.32 at room temperature, indicating that these compounds are viable candidates for thermoelectric refrigeration applications.

Evaluation on Use of Thermoelectric Devices for Electronics Cooling

2007 ◽  
Author(s):  
H. Peter J. De Bock ◽  
Tunc Icoz
Keyword(s):  
Figure Of Merit ◽  
Electronics Cooling ◽  
Constant Heat Flux ◽  
Thermoelectric Device ◽  
Thermoelectric Cooling ◽  
Thermoelectric Devices ◽  
Figures Of Merit ◽  
Higher Temperature ◽  
Conventional Cooling ◽  
Better Than

As Thermoelectric devices are getting cheaper and more powerful in cooling, these devices are getting more popular for electronics cooling applications. However, due to the additional heat production inside the thermoelectric device, the application of a TE-cooler might not always be appropriate. In some applications, use of thermoelectric devices or coolers might cause higher temperature rises on heat generating electronics than conventional cooling solutions. To authors’ best knowledge, there exists no literature that studies whether thermoelectric cooling is better than traditional convective cooling without Thermoelectrics. This study aims to evaluate the performance and effectiveness of thermoelectric cooling for electronics. Two figures of merit are proposed, to compare performances of conventional and thermoelectric cooling techniques. An attempt is made to derive this figure of merit analytically with assumptions reflecting common electronics applications. Selective case studies will be presented based on constant heat flux and constant temperature difference.

Effect of rotary-die equal channel angular pressing on the thermoelectric properties of a (Bi,Sb)2Te3 alloy

2005 ◽  
Vol 20 (4) ◽  
pp. 895-903 ◽  
Author(s):  
Z.M. Sun ◽  
H. Hashimoto ◽  
N. Keawprak ◽  
A.B. Ma ◽  
L.F. Li ◽  
...  
Keyword(s):  
Carrier Concentration ◽  
Equal Channel Angular Pressing ◽  
Figure Of Merit ◽  
Pulse Discharge ◽  
Sintering Process ◽  
X Ray Diffraction ◽  
Ecap Processing ◽  
Figures Of Merit ◽  
Angular Pressing ◽  
Ecap Process

A (Bi,Sb)2Te3 alloy powder was sintered via a pulse discharge sintering process followed by a rotary-die equal channel angular pressing (ECAP) process. It was found by x-ray diffraction analysis that the as-sintered material shows preferentially orientated microstructure, which were considerably eliminated by following ECAP processes. Generally, the Seebeck coefficient of the material was reduced by ECAP processing, which was attributed to the increased carrier concentration after the severe plastic deformation. Electrical conductivity increases after ECAP, which was also originated from the increased carrier concentration. The figure of merit of the material in different conditions shows higher value in the transverse direction. In the transverse samples, those after ECAP processing showed increased figures of merit, which reached 3.85 × 10−3/K in the material after 4 passes of ECAP.

Improved Thermoelectric Properties of SixGe1−x by the “Nanoparticle-in-Alloy” Approach

2009 ◽  
Author(s):  
Shidong Wang ◽  
Natalio Mingo
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Power ◽  
Heat Recovery ◽  
Waste Heat Recovery ◽  
Figure Of Merit ◽  
Room Temperature ◽  
Waste Heat ◽  
Fold Increase ◽  
Thermoelectric Power Factor ◽  
Figures Of Merit

We theoretically find that embedding silicide nanoparticles in SixGe1-x alloys is able to considerably improve the figure of merit (ZT). We have computed the thermal conductivity as a function of the sizes of NiSi2 and CoSi2 nanoparticles. We find that the optimal nanoparticle diameters minimizing the composite’s thermal conductivity are 6.9 nm for NiSi2 and 12.6 nm for CoSi2 at room temperature. We provide validity ranges of nanoparticle volume fractions that will not reduce the thermoelectric power factor, but will considerably decrease the thermal conductivity. Embedding NiSi2 or CoSi2 nanoparticles in SixGe1-x may lead to a 5-fold increase of figure of merit (ZT ∼ 0.5) at room temperature and 2.8 times increase (ZT ∼ 2.0) at 900 K. The proposed materials with high figures of merit are promising candidates to be used in integrated micro refrigerators in chips and thermoelectric power generation and waste heat recovery.

scholarly journals Universal asymmetric quantum cloning revisited

2017 ◽  
Vol 17 (9&10) ◽  
pp. 747-778
Author(s):  
Anna-Lena Hashagen
Keyword(s):  
Convex Analysis ◽  
Figure Of Merit ◽  
Optimization Problem ◽  
Single Quantum ◽  
Quantum Cloning ◽  
Figures Of Merit ◽  
Asymmetric Quantum ◽  
Symmetry Properties

This paper revisits the universal asymmetric 1 → 2 quantum cloning problem. We identify the symmetry properties of this optimization problem, giving us access to the optimal quantum cloning map. Furthermore, we use the bipolar theorem, a famous method from convex analysis, to completely characterize the set of achievable single quantum clone qualities using the fidelity as our figure of merit; from this it is easier to give the optimal cloning map and to quantify the quality tradeoff in universal asymmetric quantum cloning. Additionally, it allows us to analytically specify the set of achievable single quantum clone qualities using a range of different figures of merit.

scholarly journals Thermal Ranges and Figures of Merit for Gold-Containing Precursors For ALD

2020 ◽  
Author(s):  
Matthew Griffiths ◽  
Zachary Dubrawski ◽  
Peter Gordon ◽  
Marcel Junige ◽  
Sean Barry
Keyword(s):  
Atomic Layer Deposition ◽  
Chemical Vapour Deposition ◽  
Figure Of Merit ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Thermal Characteristics ◽  
Atomic Layer ◽  
Figures Of Merit ◽  
Layer Deposition

A survey of known gold-containing chemical vapour deposition (CVD) and atomic layer deposition (ALD) precursors, with a focus on collecting their volatilization and decomposition data. These data were applied to a figure of merit (σ) developed to easily assess the thermal characteristics.

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