Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu ◽  
Chang-Lin Yeh ◽  
Jenn-Ming Song
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

2007 ◽  
Vol 37 (2) ◽  
pp. 201-209 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints

2009 ◽  
Vol 21 (3) ◽  
pp. 4-9
Author(s):  
Yi‐Shao Lai ◽  
C.R. Kao ◽  
Hsiao‐Chuan Chang ◽  
Chin‐Li Kao
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses ◽  
Multiple Reflow Cycles

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

2012 ◽  
Vol 48 (6) ◽  
pp. 2724-2732 ◽  
Author(s):  
Cheng-Ying Ho ◽  
Jenq-Gong Duh ◽  
Chih-Wei Lin ◽  
Chun-Jen Lin ◽  
Yu-Hui Wu ◽  
...  
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
High Speed Impact ◽  
Impact Responses

Characterizations of ball impact responses of wafer-level chip-scale packages

2008 ◽  
Vol 450 (1-2) ◽  
pp. 238-244 ◽  
Author(s):  
Yi-Shao Lai ◽  
Chang-Lin Yeh ◽  
Hsiao-Chuan Chang ◽  
Chin-Li Kao
Keyword(s):  
Wafer Level ◽  
Ball Impact ◽  
Impact Responses

Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

2013 ◽  
Vol 42 (9) ◽  
pp. 2813-2821 ◽  
Author(s):  
Jenn-Ming Song ◽  
Meng-Ju Lin ◽  
Kun-Hung Hsieh ◽  
Tsung-Yun Pai ◽  
Yi-Shao Lai ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joints ◽  
Ball Impact ◽  
Impact Reliability ◽  
High Temperature Solder
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