Effect of Multiple Reflow Cycles on Ball Impact Responses of Sn-4Ag-0.5Cu Solder Joints with Immersion Tin Substrate Pad Finish

2008 ◽  
Author(s):  
Yi-Shao Lai ◽  
C. R. Kao ◽  
Hsiao-Chuan Chang ◽  
Shu-Hua Lee ◽  
Chin-Li Kao ◽  
...  
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses ◽  
Multiple Reflow Cycles ◽  
Immersion Tin

Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints

2009 ◽  
Vol 21 (3) ◽  
pp. 4-9
Author(s):  
Yi‐Shao Lai ◽  
C.R. Kao ◽  
Hsiao‐Chuan Chang ◽  
Chin‐Li Kao
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses ◽  
Multiple Reflow Cycles

Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu ◽  
Chang-Lin Yeh ◽  
Jenn-Ming Song
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

2007 ◽  
Vol 37 (2) ◽  
pp. 201-209 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Characterizations of Ball Impact Responses of Tin-Silver-Copper Solder Joints Doped With Nickel or Germanium

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Ball Impact ◽  
Test Methodology ◽  
Surface Finishes ◽  
Reliability Of Solder Joints ◽  
Tin Silver Copper ◽  
Board Level ◽  
Immersion Tin ◽  
Board Level Reliability

The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this work, we present BIT results conducted at an impact velocity of 500 mm/s on Sn-4Ag-0.5Cu, Sn-1Ag-0.5Cu, Sn-1Ag-0.5Cu-0.05Ni, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu-0.05Ge package-level solder joints, bonded on substrate pads of immersion tin (IT) and direct solder on pad (DSOP) surface finishes. Differences of BIT results with respect to multi-reflow are also reported.

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

2012 ◽  
Vol 48 (6) ◽  
pp. 2724-2732 ◽  
Author(s):  
Cheng-Ying Ho ◽  
Jenq-Gong Duh ◽  
Chih-Wei Lin ◽  
Chun-Jen Lin ◽  
Yu-Hui Wu ◽  
...  
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
High Speed Impact ◽  
Impact Responses

scholarly journals Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles

2016 ◽  
Vol 108 ◽  
pp. 418-428 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
S.D. McDonald ◽  
C.M. Gourlay ◽  
H. Yasuda ◽  
K. Nogita
Keyword(s):  
Solder Joints ◽  
Multiple Reflow Cycles
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