ON NUMERICAL SIMULATION OF COUPLED SEMICONDUCTOR DEVICES IN ARBITRARY SPACE DIMENSIONS PLUS TIME

Author(s):  
MICHAEL S. MOCK
2010 ◽  
Vol 24 (04n05) ◽  
pp. 401-409
Author(s):  
EUGENIA TULCAN-PAULESCU ◽  
DAN COMǍNESCU ◽  
MARIUS PAULESCU

This article deals with quantum hydrodynamic models (QHD) for electronic transport in semiconductor devices. Numerical simulation of ballistic diode and resonant tunneling diode is discussed. Based on overall results, it can be concluded that the considered QHD models have remarkable abilities to express the refinements of electronic transport in nanodevices.


VLSI Design ◽  
1995 ◽  
Vol 3 (2) ◽  
pp. 211-224 ◽  
Author(s):  
Edwin C. Kan ◽  
Zhiping Yu ◽  
Robert W. Dutton ◽  
Datong Chen ◽  
Umberto Ravaioli

According to different assumptions in deriving carrier and energy flux equations, macroscopic semiconductor transport models from the moments of the Boltzmann transport equation (BTE) can be divided into two main categories: the hydrodynamic (HD) model which basically follows Bløtekjer's approach [1, 2], and the Energy Transport (ET) model which originates from Strattton's approximation [3, 4]. The formulation, discretization, parametrization and numerical properties of the HD and ET models are carefully examined and compared. The well-known spurious velocity spike of the HD model in simple nin structures can then be understood from its formulation and parametrization of the thermoelectric current components. Recent progress in treating negative differential resistances with the ET model and extending the model to thermoelectric simulation is summarized. Finally, we propose a new model denoted by DUET (Dual ET)which accounts for all thermoelectric effects in most modern devices and demonstrates very good numerical properties. The new advances in applicability and computational efficiency of the ET model, as well as its easy implementation by modifying the conventional drift-diffusion (DD) model, indicate its attractiveness for numerical simulation of advanced semiconductor devices


1989 ◽  
Vol 32 (3) ◽  
pp. 19-24
Author(s):  
Frederick Kern

Improved room and equipment aerodynamics can have a significant impact on the ability to obtain acceptable yields on high density semiconductor products.1 Goals for the equipment engineer/vendor are presented here, a set of design guidelines is established, and a design and test regimen formulated to achieve aerodynamically acceptable equipment designs is proposed.


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