SiC Power Module Design for High Bandwidth Integrated Current Sensing using a Magnetoresistive Point Field Detector

Author(s):  
Muhammad H. Alvi ◽  
Minhao Sheng ◽  
Robert D. Lorenz ◽  
Thomas M. Jahns
Author(s):  
J. D. Hoffman ◽  
B. A. Dow ◽  
R. D. Lorenz

The spatially varying magnetic field within a power electronics package contains information of the semiconductor junction temperature and the interconnect currents, temperature, displacement, and strain. The design of semiconductor interconnects for point field detector based high bandwidth current and strain sensing is investigated using finite element analysis (FEA) and verified by experimental results. High bandwidth (10MHz) current sensing was achieved by interconnect design based field shaping and concentration. A displacement sensing resolution of 0.6 μm was achieved by eddy current based high frequency field shaping. Design methodologies to achieve this multifunctional integration of sensing are the primary new contribution of this work.


Author(s):  
Zhao Wen-jie ◽  
Wan Cheng-an ◽  
Gao Yi-fei ◽  
Zhang Guo-shuai ◽  
Zheng Yan ◽  
...  

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000289-000296 ◽  
Author(s):  
James D. Scofield ◽  
J. Neil Merrett ◽  
James Richmond ◽  
Anant Agarwal ◽  
Scott Leslie

A custom multi-chip power module packaging was designed to exploit the electrical and thermal performance potential of silicon carbide MOSFETs and JBS diodes. The dual thermo-mechanical package design was based on an aggressive 200°C ambient environmental requirement and 1200 V blocking and 100 A conduction ratings. A novel baseplate-free module design minimizes thermal impedance and the associated device junction temperature rise. In addition, the design incorporates a free-floating substrate configuration to minimize thermal expansion coefficient induced stresses between the substrate and case. Details of the module design and materials selection process will be discussed in addition to highlighting deficiencies in current packaging materials technologies when attempting to achieve high thermal cycle life reliability over an extended temperature range.


2012 ◽  
Vol 48 (4) ◽  
pp. 1432-1439 ◽  
Author(s):  
Patrick E. Schneider ◽  
Masafumi Horio ◽  
Robert D. Lorenz

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