Array antenna with uniformly excited elements to realize an equivalent arbitrary field distribution: A key technology for mass-production antenna engineering

2017 ◽  
Author(s):  
Tadashi Takano ◽  
Toshihiro Naganawa ◽  
Kuniaki Shibata ◽  
Kenji Saegusa
Keyword(s):  
Field Distribution ◽  
Mass Production ◽  
Array Antenna ◽  
Arbitrary Field ◽  
Key Technology

Lithography Process Challenges for 3D and 2.5D Applications

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000398-000424
Author(s):  
Doug Shelton ◽  
Tomii Kume
Keyword(s):  
High Resolution ◽  
Process Optimization ◽  
Mass Production ◽  
Low Cost ◽  
High Density ◽  
Through Silicon Via ◽  
Key Technology ◽  
Lithography Process ◽  
Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon will continue its discussion of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications.

Lithography Process Optimization for 3D and 2.5D Applications

2013 ◽  
Vol 2013 (1) ◽  
pp. 000790-000793 ◽  
Author(s):  
Doug Shelton ◽  
Tomii Kume
Keyword(s):  
High Resolution ◽  
Process Optimization ◽  
Preliminary Data ◽  
Mass Production ◽  
Low Cost ◽  
High Density ◽  
Through Silicon Via ◽  
Key Technology ◽  
Lithography Process ◽  
Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon continues its investigation of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications also preliminary data illustrating 450 mm wafer process challenges.

Technology Research about Beamforming of Multiple-Beam Array Antenna

2014 ◽  
Vol 568-570 ◽  
pp. 1336-1339
Author(s):  
Gao Feng Pan ◽  
Sheng Liang ◽  
Hao Xue ◽  
Guang Ming Xu ◽  
Xing Yuan Xu
Keyword(s):  
Theoretical Basis ◽  
Phased Array ◽  
Array Antenna ◽  
Engineering Practice ◽  
Technology Research ◽  
Phased Array Antenna ◽  
Key Technology ◽  
Beam Array ◽  
Low Sidelobe ◽  
Beamforming Algorithm

Active phased array antenna (APAA) can realize multi-object tracking and the beamforming is the key technology. Multi-area array and the implement method of its beamforming are introduced in this paper. Coordinated transformation formula is offered based on engineering practice and beams are synthesized by beamforming algorithm of low sidelobe. Following simulation shows results about beam coverage, those provide theoretical basis for the further research.

Advanced Manufacturing Technology for Fan-Out Wafer Level Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000251-000255 ◽  
Author(s):  
Doug Shelton
Keyword(s):  
High Resolution ◽  
Mass Production ◽  
High Density ◽  
Advanced Manufacturing Technology ◽  
Successful Implementation ◽  
Advanced Manufacturing ◽  
Wafer Level ◽  
Process Technology ◽  
Key Technology ◽  
Wafer Level Packaging

Advanced process technology is required to develop and enable mass production of Fan-Out Wafer-Level Packaging (FOWLP) solutions for high-density 3D and 2.5D packaging. Canon has identified key challenges that must be solved for successful implementation of high-density integration technologies and has developed key technology for Canon Litho Systems to support the most challenging processes. In this paper, Canon will present process optimization results for high-resolution patterning of wafers across large topography as well as solutions that enable litho systems to compensate for FOWLP grid error due to die placement errors.

Sign in / Sign up

Export Citation Format

Share Document