Lithography Process Optimization for 3D and 2.5D Applications
2013 ◽
Vol 2013
(1)
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pp. 000790-000793
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Keyword(s):
Low Cost
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Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon continues its investigation of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications also preliminary data illustrating 450 mm wafer process challenges.
2015 ◽
Vol 2015
(1)
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pp. 000251-000255
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2014 ◽
Vol 2014
(1)
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pp. 000905-000911
Keyword(s):