Research of power supply for digital fused silica furnace based on PSFB-PWM converter

2013 ◽  
Author(s):  
Shuzhong Song ◽  
Jianwei Ma ◽  
Yanwei Zhang ◽  
Baoxi Li
Keyword(s):  
Power Supply ◽  
Fused Silica ◽  
Pwm Converter

Research on a New Type of Plating Power Supply

2014 ◽  
Vol 513-517 ◽  
pp. 3518-3521
Author(s):  
Yi Hong He ◽  
Shui Yong Yu
Keyword(s):  
Power Factor ◽  
Power Supply ◽  
Pulse Generator ◽  
High Harmonic ◽  
Simulation Models ◽  
Pwm Rectifier ◽  
Soft Switch ◽  
Pwm Converter ◽  
Harmonic Content ◽  
New Type

Viewing the problems of lower power factor, high harmonic content, lots of switch losses in tubes of lagging bridge arm when using FB-ZVS-PWM converter in plating power supply, this paper applied the three-level PWM rectifier technology to electroplating power supply, A new converter has been researched. Both different converters have also been compared and analyzed. Phase shift pulse generator and simulation models have been established in Matlab/Simulink. The results show that the PS-FB-ZVZCS PWM converter is more suitable for plating power supply, phases of current and voltage are synchronous, it has the advantages of higher power factor, low harmonic content. All the switch tubes have achieved soft switch, reducing the switch losses, it can improve the efficiency and its performance effectively.

Dissipation Analysis of IGBT Module in FB-ZVZCS-PWM Converter

2013 ◽  
Vol 433-435 ◽  
pp. 1347-1354
Author(s):  
Xian Zheng Liu ◽  
Rui Jin ◽  
Kun Shan Yu ◽  
Li Jun Xie ◽  
Hai Long Bao ◽  
...  
Keyword(s):  
Energy Efficiency ◽  
Power Supply ◽  
Estimation Method ◽  
Working Process ◽  
Pwm Converter ◽  
Switching Converter ◽  
The Core ◽  
Igbt Module ◽  
Calculation Results ◽  
The Government

Along with the government and market take more and more attention to the energy efficiency of power supply, the loss of IGBT module, as the core device, has become a hot topic. Firstly, the dynamic process of IGBT module is analyzed, an accurate and an estimation method of loss calculate are provided, then the working process and resonant process of phase shift full-bridge soft switching converter is discussed, and constitute of IGBT module loss in the circuit is analyzed. Finally the loss is calculated in the 350A inverter welder example, and a conclusion of reliability and proposal for design are given according to the calculation results.

SEM analysis of DC magnetron sputtered beryllium films

1988 ◽  
Vol 46 ◽  
pp. 960-961
Author(s):  
E. F. Lindsey ◽  
C. W. Price ◽  
E. L. Pierce ◽  
E. J. Hsieh
Keyword(s):  
Fine Structure ◽  
Electron Emission ◽  
Secondary Electron ◽  
Low Voltage ◽  
Ion Beam ◽  
Secondary Electron Emission ◽  
Sem Analysis ◽  
Fused Silica ◽  
Grain Structure ◽  
Silica Substrate

Columnar structures produced by DC magnetron sputtering can be altered by using RF biased sputtering or by exposing the film to nitrogen pulses during sputtering, and these techniques are being evaluated to refine the grain structure in sputtered beryllium films deposited on fused silica substrates. Beryllium is brittle, and fractures in sputtered beryllium films tend to be intergranular; therefore, a convenient technique to analyze grain structure in these films is to fracture the coated specimens and examine them in an SEM. However, fine structure in sputtered deposits is difficult to image in an SEM, and both the low density and the low secondary electron emission coefficient of beryllium seriously compound this problem. Secondary electron emission can be improved by coating beryllium with Au or Au-Pd, and coating also was required to overcome severe charging of the fused silica substrate even at low voltage. The coating structure can obliterate much of the fine structure in beryllium films, but reasonable results were obtained by using the high-resolution capability of an Hitachi S-800 SEM and either ion-beam coating with Au-Pd or carbon coating by thermal evaporation.

New replica method with plasma polymerized film by glow discharge

1988 ◽  
Vol 46 ◽  
pp. 414-415
Author(s):  
A. Tanaka ◽  
M. Yamaguchi ◽  
T. Hirano
Keyword(s):  
Power Supply ◽  
Plasma Polymerization ◽  
Vacuum Chamber ◽  
Complex Surface ◽  
Replica Method ◽  
Metal Extraction ◽  
High Voltage Power Supply ◽  
Negative Glow ◽  
Hydrocarbon Gas ◽  
Hydrocarbon Molecules

The plasma polymerization replica method and its apparatus have been devised by Tanaka (1-3). We have published several reports on its application: surface replicas of biological and inorganic specimens, replicas of freeze-fractured tissues and metal-extraction replicas with immunocytochemical markers.The apparatus for plasma polymerization consists of a high voltage power supply, a vacuum chamber containing a hydrocarbon gas (naphthalene, methane, ethylene), and electrodes of an anode disk and a cathode of the specimen base. The surface replication by plasma polymerization in negative glow phase on the cathode was carried out by gassing at 0.05-0.1 Torr and glow discharging at 1.5-3 kV D.C. Ionized hydrocarbon molecules diffused into complex surface configurations and deposited as a three-dimensionally polymerized film of 1050 nm in thickness.The resulting film on the complex surface had uniform thickness and showed no granular texture. Since the film was chemically inert, resistant to heat and mecanically strong, it could be treated with almost any organic or inorganic solvents.

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