A low power, high performance, phone headset amplifier in CMOS technology

Author(s):  
M. Negahban-Hagh ◽  
R. Stolaruk ◽  
V. Kraz
2013 ◽  
Vol 22 (10) ◽  
pp. 1340033 ◽  
Author(s):  
HONGLIANG ZHAO ◽  
YIQIANG ZHAO ◽  
YIWEI SONG ◽  
JUN LIAO ◽  
JUNFENG GENG

A low power readout integrated circuit (ROIC) for 512 × 512 cooled infrared focal plane array (IRFPA) is presented. A capacitive trans-impedance amplifier (CTIA) with high gain cascode amplifier and inherent correlated double sampling (CDS) configuration is employed to achieve a high performance readout interface for the IRFPA with a pixel size of 30 × 30 μm2. By optimizing column readout timing and using two operating modes in column amplifiers, the power consumption is significantly reduced. The readout chip is implemented in a standard 0.35 μm 2P4M CMOS technology. The measurement results show the proposed ROIC achieves a readout rate of 10 MHz with 70 mW power consumption under 3.3 V supply voltage from 77 K to 150 K operating temperature. And it occupies a chip area of 18.4 × 17.5 mm2.


2011 ◽  
Vol 20 (03) ◽  
pp. 439-445 ◽  
Author(s):  
M. H. GHADIRY ◽  
ABU KHARI A'AIN ◽  
M. NADI S.

This paper, presents a new full-swing low power high performance full adder circuit in CMOS technology. It benefits from a full swing XOR-XNOR module with no feedback transistors, which decreases delay and power consumption. In addition, high driving capability of COUT module and low PDP design of SUM module contribute to more PDP reduction in cascaded mode. In order to have accurate analysis, the new circuit along with several well-known full adders from literature have been modeled and compared with CADENCE. Comparison consists of power consumption, performance, PDP, and area. Results show that there are improvements in both power consumption and performance. This design trades area with low PDP.


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