An analysis of the cathode thermal conductivity affecting on stability vacuum arc

2010 ◽  
Author(s):  
N. Mungkung ◽  
S. Arunrungrusmi ◽  
T. Yuji
2014 ◽  
Vol 941-944 ◽  
pp. 8-12
Author(s):  
Bai Ping Lu ◽  
Jun Zhe Zhang ◽  
Yu Feng Fang

Effects of niobium element adding method and addition content on the microstructure, thermal conductivity and melting point of Cu-Ni-Nb alloys prepared by vacuum non-consumable arc-melting were studied. We found that it is difficult to dissolve high melting point element Nb into Cu-Ni alloy by one-step smelting. However, Nb can be dissolved into Cu-Ni alloy in style of Nb-Ni master alloy by two-steps smelting. New phases Ni3Nb and Ni8Nb generate in matrix of Cu-Ni alloy. In addition, the thermal conductivity coefficient of Cu-Ni-Nb alloy increases as increasing the content of Nb, while melting point of that alloy decreases as increasing the content of Nb. Moreover, the thermal conductivity coefficient of Cu-20Ni-3Nb alloy is 43.23W/m•k, while melting point of that alloy is 1146°C. That meets the requirement of pure copper casting process.


Author(s):  
L. Wan ◽  
R. F. Egerton

INTRODUCTION Recently, a new compound carbon nitride (CNx) has captured the attention of materials scientists, resulting from the prediction of a metastable crystal structure β-C3N4. Calculations showed that the mechanical properties of β-C3N4 are close to those of diamond. Various methods, including high pressure synthesis, ion beam deposition, chemical vapor deposition, plasma enhanced evaporation, and reactive sputtering, have been used in an attempt to make this compound. In this paper, we present the results of electron energy loss spectroscopy (EELS) analysis of composition and bonding structure of CNX films deposited by two different methods.SPECIMEN PREPARATION Specimens were prepared by arc-discharge evaporation and reactive sputtering. The apparatus for evaporation is similar to the traditional setup of vacuum arc-discharge evaporation, but working in a 0.05 torr ambient of nitrogen or ammonia. A bias was applied between the carbon source and the substrate in order to generate more ions and electrons and change their energy. During deposition, this bias causes a secondary discharge between the source and the substrate.


1981 ◽  
Vol 42 (C4) ◽  
pp. C4-931-C4-934 ◽  
Author(s):  
M. F. Kotkata ◽  
M.B. El-den

1981 ◽  
Vol 42 (C6) ◽  
pp. C6-893-C6-895
Author(s):  
M. Locatelli ◽  
R. Suchail ◽  
E. Zecchi
Keyword(s):  

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