Demonstration of 20 um I/O Pitch RDL Using a Novel, Ultra-Thin Dry Film Photosensitive Dielectric for Panel-Based Glass Interposers

Author(s):  
Atsushi Kubo ◽  
Chandrasekharan Nair ◽  
Ryuta Furuya ◽  
Tomoyuki Ando ◽  
Hao Lu ◽  
...  
Keyword(s):  
Author(s):  
Theresa Han ◽  
Eunin Cho ◽  
Jinwoo Heo ◽  
Seoung Jae Lee

Abstract In the manufacture of Printed Wiring Boards (PWB), unwelcome structures, such as nodules and whiskers can be formed during copper electroplating with copper sulfate. Copper (Cu) whiskers with lengths of up to a few hundred micrometers can lead to electrical shorts between layers or patterns. In this paper, we document factors that can affect the growth of Cu whiskers; decomposition of additives in the Cu electroplating solution, surface stress, acidic cleaner, and the ingredients of a dry film. Contaminants from outside of the electroplating bath and the ingredients of the dry film were shown as key components in the formation of Cu whiskers.


Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1223
Author(s):  
Max Tönsmann ◽  
Philip Scharfer ◽  
Wilhelm Schabel

Convective Marangoni instabilities in drying polymer films may induce surface deformations, which persist in the dry film, deteriorating product performance. While theoretic stability analyses are abundantly available, experimental data are scarce. We report transient three-dimensional flow field measurements in thin poly(vinyl acetate)-methanol films, drying under ambient conditions with several films exhibiting short-scale Marangoni convection cells. An initial assessment of the upper limit of thermal and solutal Marangoni numbers reveals that the solutal effect is likely to be the dominant cause for the observed instabilities.


2020 ◽  
Vol 7 (22) ◽  
pp. 2001109
Author(s):  
Azhar Vellore ◽  
Sergio Romero Garcia ◽  
Nicholas Walters ◽  
Duval A. Johnson ◽  
Andrew Kennett ◽  
...  
Keyword(s):  

Micromachines ◽  
2021 ◽  
Vol 12 (6) ◽  
pp. 632
Author(s):  
Yuan Cao ◽  
Julia Floehr ◽  
Sven Ingebrandt ◽  
Uwe Schnakenberg

In micro-electrical-mechanical systems (MEMS), thick structures with high aspect ratios are often required. Dry film photoresist (DFR) in various thicknesses can be easily laminated and patterned using standard UV lithography. Here, we present a three-level DFR lamination process of SUEX for a microfluidic chip with embedded, vertically arranged microelectrodes for electrical impedance measurements. To trap and fix the object under test to the electrodes, an aperture is formed in the center of the ring-shaped electrodes in combination with a microfluidic suction channel underneath. In a proof-of-concept, the setup is characterized by electrical impedance measurements with polystyrene and ZrO2 spheres. The electrical impedance is most sensitive at approximately 2 kHz, and its magnitudes reveal around 200% higher values when a sphere is trapped. The magnitude values depend on the sizes of the spheres. Electrical equivalent circuits are applied to simulate the experimental results with a close match.


Author(s):  
Sadia Farjana ◽  
Mohammadamir Ghaderi ◽  
Ashraf Uz Zaman ◽  
Sofia Rahiminejad ◽  
Per Lundgren ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document