Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV)

2015 ◽  
Author(s):  
Jihye Kim ◽  
Insu Hwang ◽  
Youngwoo Kim ◽  
Heegon Kim ◽  
Joungho Kim ◽  
...  
Keyword(s):  
Electrical Characteristics ◽  
Through Silicon Via ◽  
Characteristics Analysis

Electrical characteristics analysis of video surveillance systems

2021 ◽  
Author(s):  
Valentin Ion ◽  
Horia Andrei ◽  
Emil Diaconu ◽  
Mihaita Nicolae Ardeleanu ◽  
Andrei Cosmin Gheorghe
Keyword(s):  
Video Surveillance ◽  
Surveillance Systems ◽  
Electrical Characteristics ◽  
Characteristics Analysis

scholarly journals Design of 2.5D Interposer in High Bandwidth Memory and Through Silicon Via for High Speed Signal

2020 ◽  
Author(s):  
Bo Pu
Keyword(s):  
Artificial Intelligence ◽  
High Speed ◽  
High Performance ◽  
Equivalent Model ◽  
Electrical Characteristics ◽  
Through Silicon Via ◽  
High Bandwidth ◽  
Signal Path ◽  
High Speed Switching ◽  
Performance Computing

<p>The 2.5D interposer becomes a crucial solution to realize grand bandwidth of HBM for the increasing data requirement of high performance computing (HPC) and Artificial Intelligence (AI) applications. To overcome high speed switching bottleneck caused by the large resistive and capacitive characteristics of interposer, design methods to achieve an optimized performance in a limited routing area are proposed. Unlike the conventional single through silicon via (TSV), considering the reliability, multiple TSV are used as the robust 3D interconnects for each signal path. An equivalent model to accurately describe the electrical characteristics of the multiple TSVs, and a configuration pattern strategy of TSV to mitigate crosstalk are also proposed.</p>

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