Thermal management and characterization of flip chip BGA packages

2005 ◽  
Author(s):  
S. Krishnamoorthi ◽  
D.Y.R. Chong ◽  
A.Y.S. Sun
Keyword(s):  
Thermal Management ◽  
Flip Chip ◽  
Bga Packages

Thermal Design Guidelines for FC-BGA Package With Hot Spot Problem

2006 ◽  
Author(s):  
Eason Chen ◽  
Jeng Yuan Lai ◽  
Yu-Po Wang ◽  
C. S. Hsiao
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Flip Chip ◽  
Hot Spot ◽  
Design Guidelines ◽  
Thermal Design ◽  
Cfd Modeling ◽  
Bga Packages ◽  
Function Integration ◽  
Hot Spot Problem

With the evolving function integration and power consumption of high-end IC applications, thermal management has become one of the most important concerns of semiconductor designers. In particular, hot spot problem, in recent years, has turned into a popular topic in IC chip thermal management that it comes from the uneven power consumptions in various logical blocks and results in local high temperature that would increase IC chip failure risks. In this paper, thermal evaluations for hot spot impacts on Flip-Chip Ball Grid Array (FC-BGA) packages were presented using CFD modeling technique. The evaluation topics covered hot spot power density effects on substrate designs and heat sink module characterizations including passive heat sink and fan heat sink performance under various hot spot conditions. Finally, thermal suggestions were concluded for package designers to improve the substrate design in substrate via arrangements to effectively dissipate hot spot source. Also heat sink module performance was derived for different ratings of hot spots and external heat sink performance is obtained for the hot spot impact elimination.

scholarly journals Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

2015 ◽  
Author(s):  
Aneliya KARADZHINOVA ◽  
Anton Nolvi ◽  
Jaakko Härkönen ◽  
Panja Luukka ◽  
Teppo Mäenpää ◽  
...  
Keyword(s):  
Flip Chip ◽  
Pixel Detector ◽  
Silicon Pixel Detector

Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

2014 ◽  
Vol 20 (4-5) ◽  
pp. 861-867 ◽  
Author(s):  
T. Waber ◽  
W. Pahl ◽  
M. Schmidt ◽  
G. Feiertag ◽  
S. Stufler ◽  
...  
Keyword(s):  
Flip Chip ◽  
Pressure Sensors ◽  
Barometric Pressure

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

2007 ◽  
Author(s):  
Tunc Icoz ◽  
Mehmet Arik ◽  
John T. Dardis
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Efficiency ◽  
Computational Study ◽  
Heat Sinks ◽  
Advanced Materials ◽  
Air Cooling ◽  
Thermal Management Of Electronics ◽  
Thermal Solution

Thermal management of electronics is a critical part of maintaining high efficiency and reliability. Adequate cooling must be balanced with weight and volumetric requirements, especially for passive air-cooling solutions in electronics applications where space and weight are at a premium. It should be noted that there are systems where thermal solution takes more than 95% of the total weight of the system. Therefore, it is necessary to investigate and utilize advanced materials to design low weight and compact systems. Many of the advanced materials have anisotropic thermal properties and their performances depend strongly on taking advantage of superior properties in the desired directions. Therefore, control of thermal conductivity plays an important role in utilization of such materials for cooling applications. Because of the complexity introduced by anisotropic properties, thermal performances of advanced materials are yet to be fully understood. Present study is an experimental and computational study on characterization of thermal performances of advanced materials for heat sink applications. Numerical simulations and experiments are performed to characterize thermal performances of four different materials. An estimated weight savings in excess of 75% with lightweight materials are observed compared to the traditionally used heat sinks.

scholarly journals Characterization of the Uniformity of High-Flux CdZnTe Material

Sensors ◽  
2020 ◽  
Vol 20 (10) ◽  
pp. 2747 ◽  
Author(s):  
Matthew Charles Veale ◽  
Paul Booker ◽  
Simon Cross ◽  
Matthew David Hart ◽  
Lydia Jowitt ◽  
...  
Keyword(s):  
Flip Chip ◽  
Temporal Stability ◽  
Light Sources ◽  
High Flux ◽  
X Ray Imaging ◽  
Science Community ◽  
Cdznte Detectors ◽  
Photon Science ◽  
Synchrotron Light Sources

Since the late 2000s, the availability of high-quality cadmium zinc telluride (CdZnTe) has greatly increased. The excellent spectroscopic performance of this material has enabled the development of detectors with volumes exceeding 1 cm3 for use in the detection of nuclear materials. CdZnTe is also of great interest to the photon science community for applications in X-ray imaging cameras at synchrotron light sources and free electron lasers. Historically, spatial variations in the crystal properties and temporal instabilities under high-intensity irradiation has limited the use of CdZnTe detectors in these applications. Recently, Redlen Technologies have developed high-flux-capable CdZnTe material (HF-CdZnTe), which promises improved spatial and temporal stability. In this paper, the results of the characterization of 10 HF-CdZnTe detectors with dimensions of 20.35 mm × 20.45 mm × 2.00 mm are presented. Each sensor has 80 × 80 pixels on a 250-μm pitch and were flip-chip-bonded to the STFC HEXITEC ASIC. These devices show excellent spectroscopic performance at room temperature, with an average Full Width at Half Maximum (FWHM) of 0.83 keV measured at 59.54 keV. The effect of tellurium inclusions in these devices was found to be negligible; however, some detectors did show significant concentrations of scratches and dislocation walls. An investigation of the detector stability over 12 h of continuous operation showed negligible changes in performance.

Sign in / Sign up

Export Citation Format

Share Document