Precision evaluation for thermal fatigue life of power module using coupled electrical-thermal-mechanical analysis

For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal fatigue. In this study, thermal fatigue life of solder joints on power module was evaluated. The finite element method (FEM) was used to evaluate temperature distribution induced by joule heating. Higher temperature appears below the Al wire because the electric current flows through the bonding Al wire. Coupled thermal-structure analysis is also required to evaluate the inelastic strain distribution. The damage of each part of solder joint can be calculated from equivalent inelastic strain range and crack propagation was simulated by deleting damaged elements step by step. The initial cracks were caused below the bonding Al wire and propagated concentrically under power cycling. There is the difference from environmental thermal cycling where the crack initiated at the edge of solder layer. In addition, in order to accurately evaluate the thermal fatigue life, the factors affecting the thermal fatigue life of solder joint where verified using coupled electrical-thermal-structural analysis. Then, the relation between the thermal fatigue life of solder joint and each factor is clarified. The precision evaluation for the thermal fatigue life of power module is improved.

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Examination of evaluation parameter for thermal fatigue life of wirebond used in power module

The Proceedings of The Computational Mechanics Conference ◽

10.1299/jsmecmd.2019.32.063 ◽

2019 ◽

Vol 2019.32 (0) ◽

pp. 063

Author(s):

Toru OSAKO ◽

Yoshiki SETOGUCHI ◽

Nobuyuki SHISHIDO ◽

Masaaki KOGANEMARU ◽

Toru IKEDA ◽

...

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Power Module ◽

Thermal Fatigue Life

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Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module

Frattura ed Integrità Strutturale ◽

10.3221/igf-esis.55.24 ◽

2020 ◽

Vol 15 (55) ◽

pp. 316-326

Author(s):

Dianhao Zhang ◽

Xiao-guang Huang ◽

Bin-liang Cheng ◽

Neng Zhang

Keyword(s):

Finite Element ◽

Fatigue Life ◽

Thermal Fatigue ◽

High Frequency ◽

Fatigue Behavior ◽

Electronic Devices ◽

Power Module ◽

Thermomechanical Model ◽

Thermal Fatigue Life ◽

Solder Layer

Limited by the mechanical properties of materials, silicon (Si) carbide insulated gate bipolar transistor (IGBT) can no longer meet the requirements of high power and high frequency electronic devices. Silicon carbide (SiC) IGBT, represented by SiC MOSFET, combines the excellent performance of SiC materials and IGBT devices, and becomes an ideal device for high-frequency and high-temperature electronic devices. Even so, the thermal fatigue failure of SiC IGBT, which directly determines its application and promotion, is a problem worthy of attention. In this study, the thermal fatigue behavior of SiC-IGBT under cyclic temperature cycles was investigated by finite element method. The finite element thermomechanical model was established, and stress-strain distribution and creep characteristics of the SnAgCu solder layer were obtained. The thermal fatigue life of the solder was predicted by the creep, shear strain and energy model respectively, and the failure position and factor of failure were discussed.

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Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

Journal of Physics Conference Series ◽

10.1088/1742-6596/841/1/012014 ◽

2017 ◽

Vol 841 ◽

pp. 012014 ◽

Cited By ~ 2

Author(s):

C Barbagallo ◽

G L Malgioglio ◽

G Petrone ◽

G Cammarata

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Solder Joints ◽

Power Module ◽

Snagcu Solder ◽

Thermal Fatigue Life ◽

Life Evaluation ◽

Fatigue Life Evaluation

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Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Journal of Electronic Packaging ◽

10.1115/1.4002451 ◽

2010 ◽

Vol 132 (3) ◽

Cited By ~ 8

Author(s):

Takashi Anzawa ◽

Qiang Yu ◽

Masanori Yamagiwa ◽

Tadahiro Shibutani ◽

Masaki Shiratori

Keyword(s):

Thermal Analysis ◽

Fatigue Life ◽

Temperature Distribution ◽

Simulation Method ◽

Thermomechanical Analysis ◽

Mechanical Analysis ◽

Power Module ◽

Insulated Gate Bipolar Transistor ◽

Power Cycling ◽

Thermal Mechanical Analysis

This paper presents a simulation method to evaluate the thermal fatigue life of a power module. A coupled electrical-thermal analysis was performed to obtain the nonuniform temperature distribution of electric current. Then, a thermomechanical analysis was carried out based on the temperature distribution from the electrical-thermal analysis. Since crack propagation can change the route of heat transfer, a crack path simulation technique was used to investigate the fracture behavior of the power module. The crack initiates in the solder joint below the Al bonding wire of the insulated gate bipolar transistor module and propagates by increasing the diameter. The effect of the bonding type on power cycling fatigue life is also discussed. The fracture process was found to depend on the type of bonding. Lead frame bonding was found to be more effective than wire bonding.

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