Signal integrity study of high density through silicon via (TSV) technology

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon will continue its discussion of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications.

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Lithography Process Optimization for 3D and 2.5D Applications

International Symposium on Microelectronics ◽

10.4071/isom-2013-thp11 ◽

2013 ◽

Vol 2013 (1) ◽

pp. 000790-000793 ◽

Cited By ~ 1

Author(s):

Doug Shelton ◽

Tomii Kume

Keyword(s):

High Resolution ◽

Process Optimization ◽

Preliminary Data ◽

Mass Production ◽

Low Cost ◽

High Density ◽

Through Silicon Via ◽

Key Technology ◽

Lithography Process ◽

Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon continues its investigation of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications also preliminary data illustrating 450 mm wafer process challenges.

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Flex-DIMM – A New High Density Module Form Factor

International Symposium on Microelectronics ◽

10.4071/isom-2015-thp31 ◽

2015 ◽

Vol 2015 (1) ◽

pp. 000806-000809

Author(s):

James E. Clayton

Keyword(s):

Form Factor ◽

Cross Section ◽

Lower Layer ◽

Signal Integrity ◽

High Density ◽

Thermal Dissipation ◽

Ideal Solution ◽

Memory Module ◽

The Past ◽

New Generation

The Dual In-Line Memory Module (DIMM) has remained relatively unchanged for the past two decades, with exception of an increase in PCB size, I/O pads and layer count. A new generation called Flex-DIMM is introduced by replacing the rigid-PCB substrate with a thin, bifurcated, flexible circuit that enables several improvements; including a thinner cross-section, better signal integrity with lower layer count, better thermal dissipation and ability to be directly mated to the surface of a motherboard. Originally intended for RDIMM applications, the new module may be an ideal solution for clustered microservers.

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