Ontological Modelling of Knowledge Management for Human-Machine Integrated Design of Ultra-Precision Grinding Machine

In the global machining industry, ultra-precision/ultra-high-speed machining has become a challenge, and its requirements are getting higher and higher. The challenge of precision grinding lies in the difficulty in ensuring the various dimensions and geometric accuracy of the final machined parts. This paper mainly uses the theory of a multi-body system to propose a “double accuracy” theory of manufacturing and measurement. Firstly, the grinding theory with an accuracy of 0.1 μm and the precision three-coordinate measuring machine theory with an accuracy of 0.3 μm are deduced. Secondly, the two theories are analyzed. Aiming to better explain the practicability of the “double accuracy” theory, a batch of motorized spindle parts is processed by a grinding machine. Then the precision three-coordinate measuring machine is used to measure the shape and position tolerances such as the roundness, the squareness, the flatness, and the coaxiality. The results show that the reached roundness of part A and B is 5 μm and 0.5 μm, the squareness is 3 μm and 4.5 μm, and the coaxiality tolerance is 1.2 μm, respectively.

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Structural Analysis of a Grinding Machine with Linear Motion Guide Applied

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.336-338.1014 ◽

2013 ◽

Vol 336-338 ◽

pp. 1014-1019

Author(s):

Seon Yeol Oh ◽

Han Seok Bang ◽

B. Y. Choi ◽

Woo Chun Choi ◽

S. J. Cho

Keyword(s):

Finite Element ◽

Structural Analysis ◽

Structural Design ◽

Element Model ◽

Linear Motion ◽

Precision Grinding ◽

Base Side ◽

Ultra Precision ◽

Linear Motion Guide ◽

Grinding Machine

A finite element model of an ultra-precision grinding machine that can have high precision and high stiffness is constructed and structural analysis is done with equivalent stiffnesses of linear motion guides by after structural design and the deformation of the grinding machine is obtained. In order to reduce the deformation of the grinding machine that causes bad influence, structural complement is conducted by adding ribs at the lower part of the column. Also, the straightness of the grinding machine is improved by lifting that the base side of the column.

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Ultra Precision Grinding of Wafer Scale

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.516.257 ◽

2012 ◽

Vol 516 ◽

pp. 257-262

Author(s):

Martin Hünten ◽

Fritz Klocke ◽

Olaf Dambon ◽

Benjamin Bulla

Keyword(s):

Tungsten Carbide ◽

Surface Topography ◽

Precision Grinding ◽

Wafer Scale ◽

Advantages And Disadvantages ◽

Grinding Processes ◽

Ultra Precision ◽

Grinding Tool ◽

Glass Optics ◽

Grinding Machine

Manufacturing moulds for the wafer-scale replication of precision glass optics sets new demands in terms of grinding tool lifetime and the processes to be applied. This paper will present different approaches to grinding processes and kinematics to machine wafer-scale tungsten carbide moulds with diameters of up to 100 mm and more than 100 single aspheric cavities, each featuring form accuracies in the micron range. The development of these processes will be described and advantages and disadvantages of the approaches derived from practical tests performed on an ultra precision grinding machine (Moore Nanotech 350FG) will be discussed. Finally, a comparison between the developed processes is made where achieved form accuracies and surface topography are analyzed.

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Stick-Slip Simulation of Feeding System in Silicon Ultra-Precision Grinding Machine

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.566.530 ◽

2012 ◽

Vol 566 ◽

pp. 530-533

Author(s):

Zhi Hua Sha ◽

Shao Xing Zhang ◽

Yi Wang ◽

Sheng Fang Zhang

Keyword(s):

Surface Quality ◽

Silicon Wafer ◽

Crystalline Silicon ◽

Virtual Prototype ◽

Feeding System ◽

Precision Grinding ◽

Stick Slip ◽

Machining Precision ◽

Ultra Precision ◽

Grinding Machine

Mono-crystalline silicon is the typical substrate material in integrated circuits manufacturing, and machining precision and surface quality of the silicon wafer impacts on the quality and performance of the electronic products directly. Silicon grinding technology has high accuracy, low cost and can obtained high surface quality, which has become the mainstream of silicon ultra-precision machining. Stick-slip of feeding system in silicon ultra-precision grinding machine is an important factor which influencing the machining precision of the silicon wafer. In this paper, based on the structure analysis of feeding system in a certain type of silicon ultra-precision grinding machine, the rigid body coupling virtual prototype model of the feeding system is established using ADAMS, the factors which influencing the stick-slip is analyzed deeply via the dynamic simulation of the virtual prototype.

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Ultra-precision grinding machine design and application in grinding the thin-walled complex component with small ball-end diamond wheel

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-018-3102-7 ◽

2018 ◽

Vol 101 (5-8) ◽

pp. 2097-2110 ◽

Cited By ~ 5

Author(s):

Tingzhang Wang ◽

Jian Cheng ◽

Henan Liu ◽

Mingjun Chen ◽

Chunya Wu ◽

...

Keyword(s):

Diamond Wheel ◽

Machine Design ◽

Precision Grinding ◽

Small Ball ◽

Complex Component ◽

Ultra Precision ◽

Thin Walled ◽

Grinding Machine ◽

Design And Application

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Research of the Grinding Mode Applied by the Cranfield BoX Ultra Precision Grinding Machine

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.712-715.553 ◽

2013 ◽

Vol 712-715 ◽

pp. 553-558

Author(s):

Zhuang De Jiang ◽

Shu Ming Yang ◽

Jin Long Wang ◽

Guang Tao Yuan ◽

Xing Yuan Long

Keyword(s):

Grinding Wheel ◽

Precision Grinding ◽

Wheel Surface ◽

Cutting Depth ◽

Workpiece Surface ◽

Ultra Precision ◽

Simulation Results ◽

Grinding Machine

In this paper an efficient grinding mode which is employed by the Cranfield BoX ultra precision grinding machine is discussed. The equations of workpiece surface and grinding wheel surface are proposed and the grinding motion is simulated via Matlab. The trajectory of the changing cutting region is discussed. The simulation results show that this grinding mode is suit to manufacture low slope surfaces. Generally, the workpiece surface is steeper, and the cutting range of the machine is smaller. The angle of the spindle inclination, the grinding wheel width and the cutting depth should be chose properly for different manufacturing capacity.

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