Deformation characteristics and microstructural evolution of SnAgCu solder joints

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ◽

10.1109/esime.2005.1502780 ◽

2005 ◽

Author(s):

T.O. Reinikainen ◽

P. Marjamaki ◽

J.K. Kivilahti

Keyword(s):

Microstructural Evolution ◽

Solder Joints ◽

Deformation Characteristics ◽

Download Full-text

Effect of Au Content on Microstructural Evolution of SnAgCu Solder Joints that Undergo Isothermal Aging and Reliability Testing

10.15368/theses.2011.163 ◽

2011 ◽

Author(s):

Patrick J Hyland

Keyword(s):

Microstructural Evolution ◽

Isothermal Aging ◽

Solder Joints ◽

Reliability Testing ◽

Download Full-text

Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

Microelectronics Reliability ◽

10.1016/j.microrel.2006.12.006 ◽

2007 ◽

Vol 47 (12) ◽

pp. 2161-2168 ◽

Author(s):

Weiqun Peng ◽

Eduardo Monlevade ◽

Marco E. Marques

Keyword(s):

Thermal Aging ◽

Solder Joints ◽

Interfacial Structure ◽

Download Full-text

Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756579 ◽

2013 ◽

Author(s):

Hailong Li ◽

Mingliang Fu ◽

Mei Zhu ◽

Rong An ◽

Chunqing Wang ◽

...

Keyword(s):

High Temperature ◽

Microstructural Evolution ◽

Thermal Aging ◽

Download Full-text

Creep–fatigue lifetime estimation of SnAgCu solder joints using an artificial neural network approach

Mechanics of Advanced Materials and Structures ◽

10.1080/15376494.2021.1951405 ◽

2021 ◽

pp. 1-7

Author(s):

Tzu-Chia Chen ◽

Wang-Wang Zhu ◽

Zi-Kun Jiao ◽

Aleksandr Mikhailovich Petrov

Keyword(s):

Neural Network ◽

Artificial Neural Network ◽

Solder Joints ◽

Network Approach ◽

Lifetime Estimation ◽

Neural Network Approach ◽

Fatigue Lifetime ◽

Snagcu Solder ◽

Creep Fatigue ◽

Artificial Neural Network Approach

Download Full-text

Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

Journal of Applied Physics ◽

10.1063/1.2769270 ◽

2007 ◽

Vol 102 (4) ◽

pp. 043502 ◽

Author(s):

Dan Yang ◽

B. Y. Wu ◽

Y. C. Chan ◽

K. N. Tu

Keyword(s):

Microstructural Evolution ◽

Flip Chip ◽

Solder Joints ◽

Atomic Transport

Download Full-text

Reliability Analysis of SnPb and SnAgCu Solder Joints in FC-BGA Packages with Thermal Enabling Preload

56th Electronic Components and Technology Conference 2006 ◽

10.1109/ectc.2006.1645711 ◽

2006 ◽

Author(s):

P.K. Bhatti ◽

Min Pei ◽

Xuejun Fan

Keyword(s):

Reliability Analysis ◽

Solder Joints ◽

Snagcu Solder ◽

Download Full-text

Effect of Temperature-Dependent Deformation Characteristics on Thermomechanical Fatigue Reliability of Eutectic Sn-Ag Solder Joints

Lead-Free Solders: Materials Reliability for Electronics ◽

10.1002/9781119966203.ch11 ◽

2012 ◽

pp. 273-295 ◽

Author(s):

Andre Lee ◽

Deep Choudhuri ◽

K. N. Subramanian

Keyword(s):

Solder Joints ◽

Thermomechanical Fatigue ◽

Effect Of Temperature ◽

Deformation Characteristics ◽

Fatigue Reliability ◽

Temperature Dependent

Download Full-text

A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints

Journal of Manufacturing Processes ◽

10.1016/j.jmapro.2020.03.016 ◽

2020 ◽

Vol 54 ◽

pp. 221-227

Author(s):

Waluyo Adi Siswanto ◽

M. Arun ◽

Irina V. Krasnopevtseva ◽

A. Surendar ◽

Andino Maseleno

Keyword(s):

Joule Heating ◽

Microstructure Evolution ◽

Solder Joints ◽

Stress Triaxiality ◽

Download Full-text

Mechanical Behaviour of Grains in SnAgCu Solder Joints

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430595 ◽

2006 ◽

Author(s):

Jicheng Gong ◽

Changqing Liu ◽

Paul P. Conway ◽

Vadim V. Silberschmidt

Keyword(s):

Mechanical Behaviour ◽

Solder Joints ◽

Download Full-text

A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

Journal of Electronic Materials ◽

10.1007/s11664-018-6121-0 ◽

2018 ◽

Vol 47 (5) ◽

pp. 2526-2544 ◽

Author(s):

Peter Borgesen ◽

Luke Wentlent ◽

Sa’d Hamasha ◽

Saif Khasawneh ◽

Sam Shirazi ◽

...

Keyword(s):

Thermal Fatigue ◽

Solder Joints ◽

Snagcu Solder ◽

Download Full-text