Monte Carlo simulation of X-ray diffraction embedded in experimental determination of residual stresses in microsystems

Author(s):  
U. Zschenderlein ◽  
B. Wunderle
Author(s):  
D. R. Liu ◽  
S. S. Shinozaki ◽  
R. J. Baird

The epitaxially grown (GaAs)Ge thin film has been arousing much interest because it is one of metastable alloys of III-V compound semiconductors with germanium and a possible candidate in optoelectronic applications. It is important to be able to accurately determine the composition of the film, particularly whether or not the GaAs component is in stoichiometry, but x-ray energy dispersive analysis (EDS) cannot meet this need. The thickness of the film is usually about 0.5-1.5 μm. If Kα peaks are used for quantification, the accelerating voltage must be more than 10 kV in order for these peaks to be excited. Under this voltage, the generation depth of x-ray photons approaches 1 μm, as evidenced by a Monte Carlo simulation and actual x-ray intensity measurement as discussed below. If a lower voltage is used to reduce the generation depth, their L peaks have to be used. But these L peaks actually are merged as one big hump simply because the atomic numbers of these three elements are relatively small and close together, and the EDS energy resolution is limited.


2016 ◽  
Vol 368 ◽  
pp. 99-102
Author(s):  
Lukáš Zuzánek ◽  
Ondřej Řidký ◽  
Nikolaj Ganev ◽  
Kamil Kolařík

The basic principle of the X-ray diffraction analysis is based on the determination of components of residual stresses. They are determined on the basis of the change in the distance between atomic planes. The method is limited by a relatively small depth in which the X-ray beam penetrates into the analysed materials. For determination of residual stresses in the surface layer the X-ray diffraction and electrolytic polishing has to be combined. The article is deals with the determination of residual stress and real material structure of a laser-welded steel sample with an oxide surface layer. This surface layer is created during the rolling and it prevents the material from its corrosion. Before the X-ray diffraction analysis can be performed, this surface layer has to be removed. This surface layer cannot be removed with the help of electrolytic polishing and, therefore, it has to be removed mechanically. This mechanical procedure creates “technological” residual stress in the surface layer. This additional residual stress is removed by the electrolytic polishing in the depth between 20 and 80 μm. Finally, the real structure and residual stresses can be determined by using the X-ray diffraction techniques.


2004 ◽  
Vol 148 (1) ◽  
pp. 60-63 ◽  
Author(s):  
M. Vila ◽  
M.L. Martínez ◽  
C. Prieto ◽  
P. Miranzo ◽  
M.I. Osendi ◽  
...  

2017 ◽  
Vol 29 (26) ◽  
pp. 264001 ◽  
Author(s):  
A Koc ◽  
M Reinhardt ◽  
A von Reppert ◽  
M Rössle ◽  
W Leitenberger ◽  
...  

Author(s):  
T. R. Welberry ◽  
D. J. Goossens

Studies of diffuse scattering had a prominent place in the first issue ofActa Crystallographica60 years ago at a time when conventional crystallography (determination of the average structure from Bragg peaks) was in its infancy. Since that time, conventional crystallography has developed enormously while diffuse-scattering analysis has seemingly lagged well behind. The paper highlights some of the extra difficulties involved in the measurement, interpretation and analysis of diffuse scattering and plots the progress that has been made. With the advent of the latest X-ray and neutron sources, area detectors and the ever-increasing power of computers, most disorder problems are now tractable. Two recent contrasting examples are described which highlight what can be achieved by current methods.


2001 ◽  
Vol 493 (1-3) ◽  
pp. 361-365 ◽  
Author(s):  
Yoshimichi Nakamura ◽  
Hiroshi Kawai ◽  
Yoshihide Yoshimoto ◽  
Masaru Tsukada

1986 ◽  
Vol 69 ◽  
Author(s):  
F. Cembali ◽  
A. M. Mazzone ◽  
M. Servidori

The widespread use of through-oxide implants in Si-MOS technology has prompted many studies to characterize the behaviour of oxygen recoiling from the passivating SiO2 layer into the Si substrate. These studies have given support for the idea that an anomalous formation of defects, which alter the profile of the implanted impurity and the mobility of the free carriers, is connected with the oxygen recoils.


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