Sintering process of silver nanoparticles in ink-jet printed conductive microstructures - Molecular dynamics approach

Author(s):  
Tomasz Falat ◽  
Bartosz Platek ◽  
Jan Felba
Author(s):  
Qianli Ma ◽  
Haisheng Fang

Nanofluids containing silver (Ag) nanoparticles have been used in three dimensional ink-jet printing (3DP) in recent years. Rheological properties of the nanofluids, for example, viscosity, play significant roles during the application. In this paper, viscosity of Ag-water nanofluid has been predicted using the equilibrium molecular dynamics method. The influencing factors of the viscosity, including temperature, nanoparticle size, nanoparticle concentration and nanoparticle aggregation, have been investigated. By screening the existing water models, TIP4P/2005 model is found the most suitable for viscosity calculation under the temperature range. The weight fraction of the nanoparticles, which proves more appropriate, is used during the study of the concentration effect instead of volume fraction. The results show that the viscosity of the nanofluid goes up by decreasing temperature or increasing nanoparticle concentration. Furthermore, as the nanoparticles get smaller, or aggregate, the viscosity increases slightly.


Author(s):  
Tomasz Falat ◽  
Bartosz Platek ◽  
Jan Felba ◽  
Andrzej Moscicki ◽  
Anita Smolarek ◽  
...  

2003 ◽  
Vol 778 ◽  
Author(s):  
Adamos S. Dalis ◽  
Sheldon K. Friedlander

AbstractNanoparticle chain aggregates (NCA) serve as reinforcing fillers that are combined with molecular polymers to produce nano-composite materials, e.g. carbon black in rubber. The reinforcing mechanism due to the incorporation of nanoparticle aggregates is not well understood. Molecular dynamics (MD) computer simulations are employed to investigate the behavior of nanoparticle chain aggregates under strain. The interaction potential used is that of Cu obtained with the embedded atom method (EAM). Three single-crystal Cu nanoparticles are placed in contact in two different configurations (linear and kinked) and the structures are initially relaxed with MD steps for 300 ps. We observe plastic deformation during the sintering process for very small particles (∼2.5 nm in diameter) at temperatures as low as 300 K. The relaxed configurations are then strained to the breaking point at strain rates in the order of 1 m/s. We identify mechanisms of strain accommodation that lead to nanoparticle plastic deformation and eventually fracture. The linear and the kinked configurations break at strains of 0.263 and 0.344 respectively, while the maximum stress is close to 4 GPa (strain rate: 0.625 m/s). Both structures fail at the low-angle grain boundaries developed during the sintering process, while the higher strain for fracture for the kinked configuration is associated with interface sliding not observed in the linear case.


2013 ◽  
Vol 117 (19) ◽  
pp. 9663-9672 ◽  
Author(s):  
Jingxiang Xu ◽  
Ryota Sakanoi ◽  
Yuji Higuchi ◽  
Nobuki Ozawa ◽  
Kazuhisa Sato ◽  
...  

2011 ◽  
Vol 22 (42) ◽  
pp. 425601 ◽  
Author(s):  
Zhiliang Zhang ◽  
Xingye Zhang ◽  
Zhiqing Xin ◽  
Mengmeng Deng ◽  
Yongqiang Wen ◽  
...  

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