Photonic sintering process of ink-jet printed conductive microstructures

2012 ◽  
Author(s):  
Tomasz Falat ◽  
Bartosz Platek ◽  
Jan Felba ◽  
Andrzej Moscicki ◽  
Anita Smolarek ◽  
...  
Keyword(s):  
Sintering Process ◽  
Ink Jet ◽  
Photonic Sintering

Free Form Fabrication of 3D-Ceramic Parts with InkJet-Printing

2006 ◽  
Vol 45 ◽  
pp. 720-725
Author(s):  
Ulrike Kaufmann ◽  
Urban Harrysson ◽  
Per Johander ◽  
Werner Bauer
Keyword(s):  
Structural Information ◽  
Raw Material ◽  
Free Form ◽  
Rapid Manufacturing ◽  
Heating Process ◽  
Sintering Process ◽  
Powder Bed ◽  
Manufacturing Method ◽  
Ink Jet ◽  
Good Flow

A rapid manufacturing method for fabrication of 3D ceramic parts will be presented. The structural information is printed by ink jet in powder layers of 80 µm thickness. Different granulated powders can be used, such as zirconia and alumina if they show good flow ability. After printing the structures a heating process takes place. After these the parts can be picked out from the powder bed. The manufactured parts can be impregnated with epoxy. Another option is the infiltration with ceramic slurries and glass with sintering to higher density. The sintering process has been studied and the shrinkage and material properties evaluated. The interrelationship between the raw material qualities, infiltration media and the sinter parameters as well as the material-specific properties such as density and stability will be presented. The manufacturing method is used for fabrication of moulds and cores for casting processes. Otherwise the process can be used for fast fabrication of models and prototypes. The possibilities to use these methods for implant manufacturing will be shown. A cost analysis has been performed comparing direct manufacturing of small batches of components to mould injection processes.

scholarly journals Optimization of Hybrid Ink Formulation and IPL Sintering Process for Ink-Jet 3D Printing

Nanomaterials ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 1295
Author(s):  
Jae-Young Lee ◽  
Cheong-Soo Choi ◽  
Kwang-Taek Hwang ◽  
Kyu-Sung Han ◽  
Jin-Ho Kim ◽  
...  
Keyword(s):  
3D Printing ◽  
Complex Structure ◽  
Operating Conditions ◽  
Conductive Layer ◽  
Sintering Process ◽  
Insulation Layer ◽  
Printing Technology ◽  
3D Printing Technology ◽  
Ink Jet ◽  
Multiple Materials

Ink-jet 3D printing technology facilitates the use of various materials of ink on each ink-jet head and simultaneous printing of multiple materials. It is suitable for manufacturing to process a complex multifunctional structure such as sensors and printed circuit boards. In this study, a complex structure of a SiO2 insulation layer and a conductive Cu layer was fabricated with photo-curable nano SiO2 ink and Intense Pulsed Light (IPL)-sinterable Cu nano ink using multi-material ink-jet 3D printing technology. A precise photo-cured SiO2 insulation layer was designed by optimizing the operating conditions and the ink rheological properties, and the resistance of the insulation layer was 2.43 × 1013 Ω·cm. On the photo-cured SiO2 insulation layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the IPL-sinterable nano Cu ink was performed using an IPL sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Then, Cu conductive layer was annealed at 100 °C to remove the solvent, and IPL sintered at 700 V. The Cu conductive layer of the complex structure had an electrical property of 29 µΩ·cm and an adhesive property with SiO2 insulation layer of 5B.

Morphological influences on the electrical sintering process of Aerosol Jet and Ink Jet printed silver microstructures

2013 ◽  
Vol 24 (11) ◽  
pp. 4367-4377 ◽  
Author(s):  
Christian Werner ◽  
Dirk Godlinski ◽  
Volker Zöllmer ◽  
Matthias Busse
Keyword(s):  
Sintering Process ◽  
Ink Jet

A photonic sintering derived Ag flake/nanoparticle-based highly sensitive stretchable strain sensor for human motion monitoring

Nanoscale ◽  
2018 ◽  
Vol 10 (17) ◽  
pp. 7890-7897 ◽  
Author(s):  
Inhyuk Kim ◽  
Kyoohee Woo ◽  
Zhaoyang Zhong ◽  
Pyungsam Ko ◽  
Yunseok Jang ◽  
...  
Keyword(s):  
Strain Sensor ◽  
Human Motion ◽  
Intense Pulsed Light ◽  
Sintering Process ◽  
Pulsed Light ◽  
Highly Sensitive ◽  
Highly Stretchable ◽  
Human Motion Monitoring ◽  
Photonic Sintering

A highly stretchable sensor with excellent sensitivity was obtained using an Ag flake/Ag NC hybrid by an intense pulsed light sintering process.

scholarly journals Highly conductive and transparent copper nanowire electrodes on surface coated flexible and heat-sensitive substrates

RSC Advances ◽  
2018 ◽  
Vol 8 (4) ◽  
pp. 2109-2115 ◽  
Author(s):  
Su Ding ◽  
Yanhong Tian ◽  
Jinting Jiu ◽  
Katsuaki Suganuma
Keyword(s):  
High Energy ◽  
Surface Coatings ◽  
Sintering Process ◽  
Transparent Electrodes ◽  
Copper Nanowire ◽  
Photonic Sintering

The optoelectrical property of CuNW transparent electrodes on C-PET substrates was superior to that on N-PET because the surface coatings protected the destruction of PET polymer by the high-energy light during the photonic sintering process.

Formation of Mn-Co-Ni-O Nanoceramic Microspheres Using In Situ Ink-Jet Printing: Sintering Process Effect on the Microstructure and Electrical Properties

Small ◽  
2016 ◽  
Vol 12 (36) ◽  
pp. 5027-5033 ◽  
Author(s):  
Long Chen ◽  
Qinan Zhang ◽  
Jincheng Yao ◽  
Junhua Wang ◽  
Wenwen Kong ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Sintering Process ◽  
Ink Jet Printing ◽  
Ink Jet ◽  
Jet Printing

Roll‐to‐Roll Reverse‐Offset Printing Combined with Photonic Sintering Process for Highly Conductive Ultrafine Patterns

2020 ◽  
Vol 22 (10) ◽  
pp. 2000463 ◽  
Author(s):  
Zhaoyang Zhong ◽  
Pyeongsam Ko ◽  
Jae Young Seok ◽  
Hyuntae Kim ◽  
Sin Kwon ◽  
...  
Keyword(s):  
Sintering Process ◽  
Offset Printing ◽  
Roll To Roll ◽  
Photonic Sintering

Microstructural Study of Diamond Deformed Under High Pressure and Temperature

1985 ◽  
Vol 43 ◽  
pp. 230-231
Author(s):  
E. F. Koch
Keyword(s):  
High Pressure ◽  
High Temperature ◽  
Lattice Structure ◽  
Diamond Particle ◽  
Polycrystalline Diamond ◽  
Sintering Process ◽  
Ion Milling ◽  
Sintered Compact ◽  
Transmission Electron ◽  
High Pressure Sintering

Because of the extremely rigid lattice structure of diamond, generating new dislocations or moving existing dislocations in diamond by applying mechanical stress at ambient temperature is very difficult. Analysis of portions of diamonds deformed under bending stress at elevated temperature has shown that diamond deforms plastically under suitable conditions and that its primary slip systems are on the ﹛111﹜ planes. Plastic deformation in diamond is more commonly observed during the high temperature - high pressure sintering process used to make diamond compacts. The pressure and temperature conditions in the sintering presses are sufficiently high that many diamond grains in the sintered compact show deformed microtructures.In this report commercially available polycrystalline diamond discs for rock cutting applications were analyzed to study the deformation substructures in the diamond grains using transmission electron microscopy. An individual diamond particle can be plastically deformed in a high pressure apparatus at high temperature, but it is nearly impossible to prepare such a particle for TEM observation, since any medium in which the diamond is mounted wears away faster than the diamond during ion milling and the diamond is lost.

Sign in / Sign up

Export Citation Format

Share Document