Nano-silver paste, as an important basic material for manufacturing thick film components, ultra-fine circuits, and transparent conductive films, has been widely used in various fields of electronics. Here, aiming at the shortcomings of the existing nano-silver paste in printing technology and the problem that the existing printing technology cannot achieve the printing of high viscosity, high solid content nano-silver paste, a nano-silver paste suitable for electric-field-driven (EFD) micro-scale 3D printing is developed. The result shows that there is no oxidation and settlement agglomeration of nano-silver paste with a storage time of over six months, which indicates that it has good dispersibility. We focus on the printing process parameters, sintering process, and electrical conductivity of nano-silver paste. The properties of the nano-silver paste were analyzed and the feasibility and practicability of the prepared nano-silver paste in EFD micro-scale 3D printing technology were verified. The experiment results indicate that the printed silver mesh which can act as transparent electrodes shows high conductivity (1.48 Ω/sq) and excellent transmittance (82.88%). The practical viability of the prepared nano-silver paste is successfully demonstrated with a deicing test. Additionally, the experimental results show that the prepared silver mesh has excellent heating properties, which can be used as transparent heaters.
Dynamic Resistance Monitoring of Nano Silver Paste during Sintering and Thermoelectric Aging Process
