The influence of solder composition on the impact strength of lead-free solder ball grid array joints

Impact properties of a solder ball joint with a Sn-0.75mass%Cu lead-free solder were investigated under aging conditions at 393 K. Moreover, obtained impact properties were compared with those of the joints with Sn-3.5mass%Ag and Sn-3.5mass%Ag-0.5mass%Cu solders. Ball impact force of a Sn-0.75Cu joint was stable at 4.5~5 N, which is similar to that of a Sn-3.5Ag-0.5Cu joint without aging, upon aging at 393 K for 1000 h. In the Sn-0.75Cu joint without aging, main fracture mode was complex fracture of the solder and an intermetallic compound (IMC) formed in a joint interface. Main fracture mode changed from the complex mode to solder fracture upon aging, and thus the impact toughness improved.

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Application of response surface methods in Lead-free solder joints of plastic ball grid array thermal fatigue life prediction

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066961 ◽

2011 ◽

Cited By ~ 1

Author(s):

Zhao Qiang ◽

Dejian Zhou

Keyword(s):

Life Prediction ◽

Ball Grid Array ◽

Fatigue Life Prediction ◽

Lead Free ◽

Lead Free Solder ◽

Response Surface Methods ◽

Thermal Fatigue Life ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Free Solder

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Higher Copper Composition Shear Stress Analysis on Lead Free Solder Ball

2013 8th EUROSIM Congress on Modelling and Simulation ◽

10.1109/eurosim.2013.45 ◽

2013 ◽

Author(s):

Vithyacharan Retnasamy ◽

Zaliman Sauli ◽

Phaklen Ehkan ◽

Steven Taniselass

Keyword(s):

Shear Stress ◽

Stress Analysis ◽

Solder Ball ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 ◽

10.1115/ipack2011-52024 ◽

2011 ◽

Author(s):

Takahiro Kano ◽

Ikuo Shohji ◽

Tetsuyuki Tsuchida ◽

Toshikazu Ookubo

Keyword(s):

Reaction Layer ◽

Shear Force ◽

Solder Ball ◽

Lead Free ◽

Joint Interface ◽

Lead Free Solder ◽

Solder Balls ◽

Free Solder ◽

Ball Joints ◽

Electroless Ni

An electroless Ni/Pd/Au plated electrode is expected to be used as an electrode material for lead-free solder to improve joint reliability. The aim of this study is to investigate the effect of the thickness of the Pd layer on joint properties of the lead-free solder joint with the electroless Ni/Pd/Au plated electrode. Solder ball joints were fabricated with Sn-3Ag-0.5Cu (mass%) lead-free solder balls and electroless Ni/Pd/Au and Ni/Au plated electrodes. Ball shear force and microstructure of the joint were investigated. The (Cu,Ni)6Sn5 reaction layer formed in the joint interface in all specimens. The thickness of the reaction layer decreased with increasing the thickness of the Pd layer. In the joint with a Pd layer 0.36 μm thick, the remained Pd layer was observed in the joint interface. In the joint, impact shear force decreased compared with that of the joint without the remained Pd layer. On the contrary, when the thickness of the Pd layer was less than 0.36 μm, the Pd layer was not remained in the joint interface and impact shear force improved. Impact shear force of the joint with the electroless Ni/Pd/Au plated electrode was higher than that with the electroless Ni/Au one.

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