Wide bandgap semiconductor electronic devices for high frequency applications

Author(s):  
R.J. Trew ◽  
M.W. Shin ◽  
V. Gatto
2018 ◽  
Vol 6 (9) ◽  
pp. 2275-2282 ◽  
Author(s):  
J. Y. Zhang ◽  
W. W. Li ◽  
R. L. Z. Hoye ◽  
J. L. MacManus-Driscoll ◽  
M. Budde ◽  
...  

NiO is a p-type wide bandgap semiconductor of use in various electronic devices ranging from solar cells to transparent transistors. This work reports the controlling of conductivity and increase of work functions by Li doping.


2018 ◽  
Vol 86 (12) ◽  
pp. 3-16 ◽  
Author(s):  
Eric P Carlson ◽  
Daniel W Cunningham ◽  
Isik C. Kizilyalli

2013 ◽  
Vol 538 ◽  
pp. 173-176
Author(s):  
Jing Zhang

We present a fully coupled thermal-electrical-mechanical finite element based model to study material degradation behaviors of high-frequency electronic devices. The mechanisms of degradation and ultimately failure in wide bandgap (WBG) devices are very complex. Under operating conditions, the devices are usually subject to high electric fields, high stress/strain fields, high current densities, high temperatures and high thermal gradients. Moreover, these phenomena are coupled together. The presented finite element model is capable of computing stress, temperature, and electric fields based on an innovative finite element approach for the solution of non-linear coupled thermal-electrical-mechanical problems. The model can be applied to wide bandgap electronic devices to address major issues of performance and lifetime.


2021 ◽  
Vol 119 (5) ◽  
pp. 051906
Author(s):  
C. Yu ◽  
P. Andalib ◽  
A. Sokolov ◽  
O. Fitchorova ◽  
W. Liang ◽  
...  

2019 ◽  
Vol 31 (36) ◽  
pp. 1903580 ◽  
Author(s):  
Chuanhui Gong ◽  
Junwei Chu ◽  
Chujun Yin ◽  
Chaoyi Yan ◽  
Xiaozong Hu ◽  
...  

2015 ◽  
Vol 54 (11) ◽  
pp. 110302 ◽  
Author(s):  
Sandhya Chintalapati ◽  
Yongqing Cai ◽  
Ming Yang ◽  
Lei Shen ◽  
Yuan Ping Feng

Sign in / Sign up

Export Citation Format

Share Document