Finite element analysis for the wire bonding process and impact force variation

Author(s):  
Yongjun Jiang ◽  
Chongfeng Tan ◽  
Jian Gao ◽  
Yun Chen ◽  
Xin Chen ◽  
...  
2014 ◽  
Vol 609-610 ◽  
pp. 1153-1158
Author(s):  
Dong Rui Wang ◽  
Mei Liu

The wire bonding process in the package of MEMS accelerometer is analyzed by the finite element software ANSYS/LS-DYNA. Impact on the bonding strength of the ultrasonic amplitude, ultrasonic frequency and the friction between wire bond and bond pad are studied. The strength of wire bond is evaluated through the bond pull test experiment. The test result shows that the analysis on the wire bonding is helpful for improving the quality of wire bonding.


2007 ◽  
Vol 35 (3) ◽  
pp. 226-238 ◽  
Author(s):  
K. M. Jeong ◽  
K. W. Kim ◽  
H. G. Beom ◽  
J. U. Park

Abstract The effects of variations in stiffness and geometry on the nonuniformity of tires are investigated by using the finite element analysis. In order to evaluate tire uniformity, a three-dimensional finite element model of the tire with imperfections is developed. This paper considers how imperfections, such as variations in stiffness or geometry and run-out, contribute to detrimental effects on tire nonuniformity. It is found that the radial force variation of a tire with imperfections depends strongly on the geometrical variations of the tire.


2004 ◽  
Vol 2004.5 (0) ◽  
pp. 71-72
Author(s):  
Katsuaki TANIMURA ◽  
Sadayuki UJIHASHI ◽  
David Nash ◽  
Bill Dempster

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