Temperature and stress distribution of IGBT module in DC power cycling test with different switching frequencies

2018 ◽  
Author(s):  
FANG Chao ◽  
AN Tong ◽  
QIN Fei ◽  
ZHAO Jingyi ◽  
YUAN Xuequan
Keyword(s):  
Stress Distribution ◽  
Cycling Test ◽  
Dc Power ◽  
Power Cycling ◽  
Igbt Module

Power cycling test and failure analysis of molded Intelligent Power IGBT Module under different temperature swing durations

2016 ◽  
Vol 64 ◽  
pp. 403-408 ◽  
Author(s):  
U.M. Choi ◽  
F. Blaabjerg ◽  
S. Jørgensen ◽  
F. Iannuzzo ◽  
H. Wang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Cycling Test ◽  
Power Cycling ◽  
Igbt Module ◽  
Temperature Swing

Characterization of high-voltage IGBT module degradations under PWM power cycling test at high ambient temperature

2010 ◽  
Vol 50 (9-11) ◽  
pp. 1810-1814 ◽  
Author(s):  
M. Tounsi ◽  
A. Oukaour ◽  
B. Tala-Ighil ◽  
H. Gualous ◽  
B. Boudart ◽  
...  
Keyword(s):  
Ambient Temperature ◽  
High Voltage ◽  
High Ambient Temperature ◽  
Cycling Test ◽  
Power Cycling ◽  
Igbt Module

Analysis of Transient Thermal Stress of IGBT Module Based on Electrical-Thermal-Mechanical Coupling Model

2014 ◽  
Vol 986-987 ◽  
pp. 823-827
Author(s):  
Qing Yuan Zheng ◽  
Min You Chen ◽  
Bing Gao ◽  
Nan Jiang
Keyword(s):  
Thermal Stress ◽  
Stress Distribution ◽  
Uniform Distribution ◽  
Inelastic Strain ◽  
Coupling Model ◽  
Power Module ◽  
Mechanical Coupling ◽  
Fem Method ◽  
Igbt Module ◽  
Solder Layer

Reliability of IGBT power module is one of the biggest concerns regarding wind power system, which generates the non-uniform distribution of temperature and thermal stress. The effects of non-uniform distribution will cause failure of IGBT module. Therefore, analysis of thermal mechanical stress distribution is crucially important for investigation of IGBT failure mechanism. This paper uses FEM method to establish an electrical-thermal mechanical coupling model of IGBT power module. Firstly, thermal stress distribution of solder layer is studied under power cycling. Then, the effects of initial failure of solder layer on the characteristic of IGBT module is investigated. Experimental results indicate that the strain energy density and inelastic strain are higher which will reduce reliability and lifetime of power modules.

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