Experimental Investigation of a Thermochemical Reactor for High-Temperature Heat Storage via Carbonation-Calcination Based Cycles

We report on the design of a modular, high-temperature thermochemical energy storage system based on endothermic-exothermic reversible gas-solid reactions for application in concentrated solar power and industrial thermal processes. It consists of an array of tubular reactors, each containing an annular packed bed subjected to radial flow, and integrated in series with a thermocline-based sensible thermal energy storage. The calcination-carbonation of limestone, CaCO3 ↔ CaO + CO2, is selected as the reversible thermochemical reaction for the experimental demonstration. Synthetized 4.2 mm-mean size agglomerates and 2 mm-mean size granules of CaO with 42 %wt sintering-inhibitor MgO support attained reaction extents of up to 84.0% for agglomerates and 31.9% for granules, and good cycling stability in pressure-swing and temperature-swing thermogravimetric runs. A lab-scale reactor prototype is fabricated and tested with both formulations for 80 consecutive carbonation-calcination cycles at ambient pressure using a temperature-swing mode between 830°C and 930°C. The reactor exhibited stable cyclic operation and low pressure drop, and yielded specific gravimetric and volumetric heat storage capacities of 866 kJ/kg and 322 MJ/m3 for agglomerates, respectively, and 450 kJ/kg and 134 MJ/m3 for granules, respectively.

Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter

New technological and packaging solutions are more and more being employed for power semiconductor switches in an automotive environment, especially the SiC- and GaN-based ones. In this framework, new front-end and back-end solutions have been developed, and many more are in the design stage. New and more integrated power devices are useful to guarantee the performances in electric vehicles, in terms of thermal management, size reduction, and low power losses. In this paper, a GaN-based system in package solution is simulated to assess the structure temperature submitted to a Joule heating power loss. The monolithic package solution involves a half-bridge topology, as well as a driver logic. A novel integrated electromagnetic and thermal method, based on finite element simulations, is proposed in this work. More specifically, dynamic electric power losses of the copper interconnections are computed in the first simulation stage, by an electromagnetic model. In the second stage, the obtained losses’ geometrical map is imported in the finite element thermal simulation, and it is considered as the input. Hence, the temperature distribution of the package’s copper traces is computed. The simulation model verifies the proper design of copper traces. The obtained temperature swing avoids any thermal-related reliability bottleneck.