Design of a High Precision Low Temperature Drift Oscillation Circuit Based on CMOS Technology

2020 ◽  
Author(s):  
Rui Xu ◽  
Jun Pan
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Cmos Technology ◽  
Temperature Drift ◽  
Oscillation Circuit

A digital interface integration circuit design for high precision quartz-gyro

2019 ◽  
Vol 33 (19) ◽  
pp. 1950222
Author(s):  
Xinpeng Di ◽  
Weiping Chen ◽  
Xiaowei Liu
Keyword(s):  
Angular Velocity ◽  
High Precision ◽  
Integrated Circuit ◽  
Cmos Technology ◽  
Low Noise ◽  
Temperature Drift ◽  
Interface Circuit ◽  
Digital Detection ◽  
Fast Start ◽  
Application Specific Integrated Circuit

A design of digital application specific integrated circuit (ASIC) of quartz-gyro is proposed in this paper. The digital drive circuit with fast-start oscillation and digital detection circuit with low noise are adopted to implement the digital output of the main circuit node and high precision angular velocity detection. The interface circuit is fabricated in a standard 0.35 [Formula: see text]m CMOS technology and test result shows the angular random walk and zero stability are [Formula: see text]/[Formula: see text] and [Formula: see text]/h ([Formula: see text]), respectively. The bias-instability is [Formula: see text]/h (Allen). The nonlinearity is limited to 0.035% and the zero temperature drift is [Formula: see text]/h from [Formula: see text] to [Formula: see text]. The chip exhibits great superiority on the aspects of high precision angular velocity digital detection and temperature characteristics of overall system.

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology
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