High Power Radiating System Based on a Compact Printed Circuit Board Marx Generator

Author(s):  
F. Olsson ◽  
M. Jansson ◽  
D. Aberg ◽  
M. Karlsson ◽  
B.O. Bergman ◽  
...  
2019 ◽  
Vol 37 (01) ◽  
pp. 110-121 ◽  
Author(s):  
Falun Song ◽  
Fei Li ◽  
Beizhen Zhang ◽  
Mingdong Zhu ◽  
Chunxia Li ◽  
...  

AbstractThis paper introduces recent activities on Marx-based compact repetitive pulsed power generators at the Institute of Applied Electronics (IAE), China Academy of Engineering Physics (CAEP), over the period 2010–2018. A characteristic feature of the generators described is the use of a simplified bipolar charged Marx circuit, in which the normal isolation resistors or inductors to ground are removed to make the circuit simpler. Several pulse-forming modules developed to generate a 100 ns square wave output are introduced, including thin-film dielectric lines of different structures, a pulse-forming line based on a Printed Circuit Board, and non-uniform pulse-forming networks. A compact repetitive three-electrode spark gap switch with low-jitter, high-voltage, and high-current was developed and is used in the generators. A positive and negative series resonant constant current power supply with high precision and high power is introduced. As an important part of the repetitive pulse power generator, a lower jitter pulse trigger source is introduced. Several typical high-power repetitive pulsed power generators developed at IAE are introduced including a 30 GW low-impedance Marx generator, a compact square-wave pulse generator based on Kapton-film dielectric Blumlein line, a 20 GW high pulse-energy repetitive PFN-Marx generator, and a coaxial Marx generator based on ceramic capacitors. The research of key technologies and their development status are discussed, which can provide a reference for the future development and application of miniaturization of compact and repetitive Marx generators.


Nano Research ◽  
2014 ◽  
Vol 8 (3) ◽  
pp. 722-730 ◽  
Author(s):  
Changbao Han ◽  
Chi Zhang ◽  
Wei Tang ◽  
Xiaohui Li ◽  
Zhong Lin Wang

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 55-60 ◽  
Author(s):  
Yuanming Chen ◽  
Shouxu Wang ◽  
Xuemei He ◽  
Wei He ◽  
Vadim V. Silberschmidt ◽  
...  

Purpose – The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation. Design/methodology/approach – Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB. Findings – The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing. Originality/value – The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry.


Energies ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 605
Author(s):  
Jaeil Baek ◽  
Moo-Hyun Park ◽  
Taewoo Kim ◽  
Han-Shin Youn

This paper presents a modified power factor correction (PFC) ON/OFF control and three-dimensional (3D) printed circuit board (PCB) design for a high-efficiency and high-power density onboard charger (OBC). By alternately operating one of two boost modules of the PFC stage at a 50% or less load condition, the proposed PFC control can reduce the load-independent power loss of the PFC stage, such as core loss and capacitor charging loss of switches. It enables OBCs to have high efficiency across a wide output power range and better thermal performance. The 3D-PCB design decouples a trade-off relationship of the PCB trace design and heat spreader design, increasing the power density of OBCs. A 3.3 kW prototype composed of an interleaved totem-pole bridgeless boost PFC converter and full-bridge (FB) LLC converter has been built and tested to verify the proposed PFC control and 3D-PCB effectiveness design. The prototype has 95.7% full power efficiency (98.2% PFC stage efficiency) and 52 W/in3 power density.


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