scholarly journals Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 55-60 ◽  
Author(s):  
Yuanming Chen ◽  
Shouxu Wang ◽  
Xuemei He ◽  
Wei He ◽  
Vadim V. Silberschmidt ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Thermal Simulation ◽  
Circuit Board ◽  
Reflow Soldering ◽  
Content Type ◽  
Printed Circuit ◽  
Flatness Control ◽  
Copper Coin

Purpose – The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation. Design/methodology/approach – Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB. Findings – The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing. Originality/value – The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry.

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering

2015 ◽  
Vol 27 (2) ◽  
pp. 61-68 ◽  
Author(s):  
Attila Geczy ◽  
Márta Fejos ◽  
László Tersztyánszky
Keyword(s):  
Efficient Method ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Automotive Electronics ◽  
Production Environment ◽  
Reflow Soldering ◽  
Content Type ◽  
Printed Circuit ◽  
Novel Approach ◽  
The Given

Purpose – This paper aims to reveal the causes and find an efficient method to compensate the shrinkage to reduce failure costs. Reflow-induced printed circuit board (PCB) shrinkage is inspected in automotive electronics production environment. The shrinkage of two-sided, large PCBs results in printing offset errors and consequently soldering failures on smaller components during the reflow soldering of the second PCB side. Design/methodology/approach – During the research, the investigations had to adapt to actual production in an electronics manufacturing plant. A measurement method was developed to approximate the overall shrinkage of the given product. With the shrinkage data, it is possible to perform an efficient compensation on the given stencil design in computer-aided manufacturing environment. Findings – It was found that even with the investigated lower-quality PCB materials, the compensation on the stencil significantly reduces the quantity of failures, offering an efficient method to improve the yield of the production. Research limitations/implications – Research was oriented by the confines of production (fixed PCB sources, given PCB materials, reflow process and production line), where an immediate solution is needed. Future investigations should be focussed on the PCB parameters (different epoxy types, glass-fibre reinforcements, etc.). Practical implications – The optimised production reduces overall failure costs. The stencil re-design and application is a fast and efficient way to immediately act against the shrinkage-induced failures. The method was successfully applied in automotive electronics production. Originality/value – The paper presents a novel approach on solving an emerging problem during reflow.

Computing method of thermal conductivity of heat dissipation vias in printed circuit board and its optimization

Circuit World ◽  
2015 ◽  
Vol 41 (1) ◽  
pp. 14-19 ◽  
Author(s):  
Shuo Xiao ◽  
Yang Zhao ◽  
Yuan Cao ◽  
Haifeng Jiang ◽  
Wenliang Zhu
Keyword(s):  
Thermal Conductivity ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Research Result ◽  
Circuit Board ◽  
Computational Formula ◽  
Filling Material ◽  
Content Type ◽  
Printed Circuit

Purpose – This paper aims to deduce a set of theory computational formula, and optimize and improve the heat conductivity of vias in printed circuit boards of electrical power apparatus. Design/methodology/approach – The authors adopted numerical simulation and experimental measurement to verify the reliability of this formula. Findings – Research result showed that 0.45 mm was the optimal bore diameter of vias; the conductivity had no obvious improvement when filling material was FR4 or Rogers, but if it was filled with texture of high thermal conductivity like soldering tine, the conductivity would improve a lot; the plating thickness of vias had a greater influence on thermal conductivity. Originality/value – Through the theory computational formula, this paper studied the influence of aperture of vias, filled materials and thickness of copper plated on vias on thermal conductivity.

Robotic system design and development for automated dismantling of PCB waste

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Ioan Doroftei ◽  
Daniel Chirita ◽  
Ciprian Stamate ◽  
Stelian Cazan ◽  
Carlos Pascal ◽  
...  
Keyword(s):  
Design Methodology ◽  
Printed Circuit Board ◽  
Vision System ◽  
Electronic Waste ◽  
Robotic System ◽  
Circuit Board ◽  
Short Introduction ◽  
Content Type ◽  
Printed Circuit ◽  
System A

Purpose The mass electronics sector is one of the most critical sources of waste, in terms of volume and content with dangerous effects on the environment. The purpose of this study is to provide an automated and accurate dismantling system that can improve the outcome of recycling. Design/methodology/approach Following a short introduction, the paper details the implementation layout and highlights the advantages of using a custom architecture for the automated dismantling of printed circuit board waste. Findings Currently, the amount of electronic waste is impressive while manual dismantling is a very common and non-efficient approach. Designing an automatic procedure that can be replicated, is one of the tasks for efficient electronic waste recovery. This paper proposes an automated dismantling system for the advanced recovery of particular waste materials from computer and telecommunications equipment. The automated dismantling architecture is built using a robotic system, a custom device and an eye-to-hand configuration for a stereo vision system. Originality/value The proposed approach is innovative because of its custom device design. The custom device is built using a programmable screwdriver combined with an innovative rotary dismantling tool. The dismantling torque can be tuned empirically.

Analysis of surface insulation resistance related failures in electronics by circuit simulation

Circuit World ◽  
2017 ◽  
Vol 43 (2) ◽  
pp. 45-55 ◽  
Author(s):  
Vadimas Verdingovas ◽  
Salil Joshy ◽  
Morten Stendahl Jellesen ◽  
Rajan Ambat
Keyword(s):  
Printed Circuit Board ◽  
Electronic Device ◽  
Early Stage ◽  
Circuit Simulation ◽  
Circuit Board ◽  
Insulation Resistance ◽  
Electronic Circuits ◽  
Content Type ◽  
Printed Circuit ◽  
Surface Insulation Resistance

Purpose The purpose of this study is to show that the humidity levels for surface insulation resistance (SIR)-related failures are dependent on the type of activators used in no-clean flux systems and to demonstrate the possibility of simulating the effects of humidity and contamination on printed circuit board components and sensitive parts if typical SIR data connected to a particular climatic condition are available. This is shown on representative components and typical circuits. Design/methodology/approach A range of SIR values obtained on SIR patterns with 1,476 squares was used as input data for the circuit analysis. The SIR data were compared to the surface resistance values observable on a real device printed circuit board assembly. SIR issues at the component and circuit levels were analysed on the basis of parasitic circuit effects owing to the formation of a water layer as an electrical conduction medium. Findings This paper provides a summary of the effects of contamination with various weak organic acids representing the active components in no-clean solder flux residue, and demonstrates the effect of humidity and contamination on the possible malfunctions and errors in electronic circuits. The effect of contamination and humidity is expressed as drift from the nominal resistance values of the resistors, self-discharge of the capacitors and the errors in the circuits due to parasitic leakage currents (reduction of SIR). Practical/implications The methodology of the analysis of the circuits using a range of empirical leakage resistance values combined with the knowledge of the humidity and contamination profile of the electronics can be used for the robust design of a device, which is also important for electronic products relying on low current consumption for long battery lifetime. Originality/value Examples provide a basic link between the combined effect of humidity and contamination and the performance of electronic circuits. The methodology shown provides the possibility of addressing the climatic reliability of an electronic device at the early stage of device design by using typical SIR data representing the possible climate exposure.

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

Circuit World ◽  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Denglin Fu ◽  
Yanan Wen ◽  
Jida Chen ◽  
Lansi Lu ◽  
Ting Yan ◽  
...  
Keyword(s):  
Corrosion Inhibitor ◽  
Corrosion Inhibitors ◽  
Printed Circuit Board ◽  
Copper Surface ◽  
Etching Process ◽  
Circuit Board ◽  
Content Type ◽  
Printed Circuit ◽  
Etching Method ◽  
Electrolytic Etching

Purpose The purpose of this paper is to study an electrolytic etching method to prepare fine lines on printed circuit board (PCB). And the influence of organics on the side corrosion protection of PCB fine lines during electrolytic etching is studied in detail. Design/methodology/approach In this paper, the etching factor of PCB fine lines produced by new method and the traditional method was analyzed by the metallographic microscope. In addition, field emission scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were used to study the inhibition of undercut of the four organometallic corrosion inhibitors with 2,5-dimercapto-1,3,4-thiadiazole, benzotriazole, l-phenylalanine and l-tryptophan in the electrolytic etching process. Findings The SEM results show that corrosion inhibitors can greatly inhibit undercut of PCB fine lines during electrolytic etching process. XPS results indicate that N and S atoms on corrosion inhibitors can form covalent bonds with copper during electrolytic etching process, which can be adsorbed on sidewall of PCB fine lines to form a dense protective film, thereby inhibiting undercut of PCB fine lines. Quantum chemical calculations show that four corrosion inhibitor molecules tend to be parallel to copper surface and adsorb on copper surface in an optimal form. COMSOL Multiphysics simulation revealed that there is a significant difference in the amount of corrosion inhibitor adsorbed on sidewall of the fine line and the etching area. Originality/value As a clean production technology, electrolytic etching method has a good development indicator for the production of high-quality fine lines in PCB industry in the future. And it is of great significance in saving resources and reducing environmental pollution.

Surface temperature of electronic assemblies equipped with tilted and low-powered QFN64 subjected to free convection

2017 ◽  
Vol 27 (6) ◽  
pp. 1304-1310 ◽  
Author(s):  
Abderrahmane Baïri ◽  
Clara Ortega Hermoso ◽  
David San Martén Ortega ◽  
Iken Baïri ◽  
Zsolt Peter
Keyword(s):  
Surface Temperature ◽  
Inclination Angle ◽  
Printed Circuit Board ◽  
Electronic Device ◽  
Thermal Design ◽  
Circuit Board ◽  
Content Type ◽  
Printed Circuit ◽  
Volume Method ◽  
Electronic Assemblies

Purpose This work deals with the case of the quad flat non-lead 64 (QFN64) electronic package generating a low power range ranging from 0.01 to 0.1W. It is installed on one side of a printed circuit board (PCB) that can be inclined relative to the horizontal plane with an angle varying between 0° and 90° (horizontal and vertical positions, respectively). The surface temperature of the electronic assembly is subjected to air natural convection. Design/methodology/approach Calculations are done by means of the finite volume method for many configurations obtained by varying the generated power and the inclination angle. Findings The distribution of the surface temperature is determined on all the assembly areas (QFN and PCB). The study shows that the thermal behaviour of the electronic device is influenced by the generated power and the inclination angle. The 3D numerical survey leads to correlations allowing calculation of the average surface temperature in any part of the assembly, according to the power generated by the QFN64 and the inclination angle. Originality/value The proposed accurate correlations are original and unpublished. They optimize the thermal design of the electronic QFN64 package, which is increasingly used in many engineering fields.

Influence of the area of a thermal pad on optical and thermal parameters of LED modules

Circuit World ◽  
2020 ◽  
Vol 46 (2) ◽  
pp. 65-70 ◽  
Author(s):  
Krzysztof Górecki ◽  
Przemysław Piotr Ptak
Keyword(s):  
Thermal Resistance ◽  
Power Density ◽  
Printed Circuit Board ◽  
Thermal Parameters ◽  
Circuit Board ◽  
Optical Parameters ◽  
Metal Core ◽  
Content Type ◽  
Printed Circuit

Purpose The purpose of this paper is to present and discuss the results of measurements illustrating influence of the area of a thermal pad and the kind of the used base on thermal and optical parameters of LED modules. Design/methodology/approach LED modules including six power LEDs are designed. In the layout of these modules, different areas of a thermal pad of each LED are used. These modules are made using the classical FR-4 base and metal core printed circuit board (MCPCB). Thermal and optical parameters of all the tested modules are measured using the method elaborated by the authors. Findings The obtained results of measurements prove that increasing the area of a thermal pad causes a decrease in thermal resistance of the tested LED modules and an increase in power density of the emitted light. The role of the area of a thermal pad is more important for the classical FR-4 base than for MCPCB. Research limitations/implications Investigations were performed for only two values of the area of thermal pads and selected values of LEDs forward current. Originality/value The presented results of investigations show how the used layout and type of the used base of these modules influence optical and thermal parameters of LED modules. Changing the base of a module can cause even a double decrease in thermal resistance and a double increase in power density of the emitted light.

High power triboelectric nanogenerator based on printed circuit board (PCB) technology

Nano Research ◽  
2014 ◽  
Vol 8 (3) ◽  
pp. 722-730 ◽  
Author(s):  
Changbao Han ◽  
Chi Zhang ◽  
Wei Tang ◽  
Xiaohui Li ◽  
Zhong Lin Wang
Keyword(s):  
High Power ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Triboelectric Nanogenerator ◽  
Printed Circuit
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