In this paper, we investigated TiO2 as gate dielectric to achieve the large dielectric constant. The ultra high-k value over 30 was obtained by Capacitance–Voltage measurement of Al/Ti/TiO2/Si Metal-Insulator–Semiconductor (MIS) capacitor. Among
as deposited, rapid thermal annealing (RTA) at 750 °C and 1000 °C, the RTA at 750 °C showed the lowest gate leakage current. It implies that TiO2 has optimum RTA temperature having the lowest leakage current. When TiO2 is annealed at 750 °C, the phase
of TiO2 changes to anatase and interfacial layer between TiOx and Si was formed. While TiO2 is annealed at 1000 °C, the phase of TiO2 changes to rutile and diffusion of silicon atoms was clearly observed and it causes the silicide formation. Based on measurement
data, we proposed the energy band diagram of Al/TiO2/Si MIS capacitors. This diagram shows that the energy band gap of RTA at 750 °C is expanded while that of RTA at 1000 °C is contracted. In addition, TiO2 with RTA at 550 °C was tested to confirm leakage
current and it shows lower leakage current than RTA at 750 °C as we expected. This result confirmed that optimum RTA temperature of TiO2 would exist under 750 °C.
Electrical characteristics of metal–insulator–semiconductor and metal–insulator–semiconductor–insulator–metal capacitors under different high-k gate dielectrics investigated in the semi-classical and quantum mechanical models