Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish

2021 ◽  
Author(s):  
Denis Fros ◽  
Petr Vesely
Keyword(s):  
Mechanical Properties ◽  
Comparative Study ◽  
Surface Finish ◽  
Solder Joints

Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

2016 ◽  
Vol 45 (12) ◽  
pp. 6184-6191 ◽  
Author(s):  
Kyoung-Ho Kim ◽  
Junichi Koike ◽  
Jeong-Won Yoon ◽  
Sehoon Yoo
Keyword(s):  
Mechanical Properties ◽  
Surface Finish ◽  
Solder Joints ◽  
Sac305 Solder ◽  
Plasma Surface

scholarly journals Extrusion Based 3D Printing of Sustainable Biocomposites from Biocarbon and Poly(trimethylene terephthalate)

Molecules ◽  
2021 ◽  
Vol 26 (14) ◽  
pp. 4164
Author(s):  
Elizabeth Diederichs ◽  
Maisyn Picard ◽  
Boon Peng Chang ◽  
Manjusri Misra ◽  
Amar Mohanty
Keyword(s):  
Mechanical Properties ◽  
3D Printing ◽  
Surface Finish ◽  
Three Dimensional ◽  
Morphological Properties ◽  
Great Promise ◽  
Structural Components ◽  
Computer Aided ◽  
Trimethylene Terephthalate ◽  
Optimal Quantity

Three-dimensional (3D) printing manufactures intricate computer aided designs without time and resource spent for mold creation. The rapid growth of this industry has led to its extensive use in the automotive, biomedical, and electrical industries. In this work, biobased poly(trimethylene terephthalate) (PTT) blends were combined with pyrolyzed biomass to create sustainable and novel printing materials. The Miscanthus biocarbon (BC), generated from pyrolysis at 650 °C, was combined with an optimized PTT blend at 5 and 10 wt % to generate filaments for extrusion 3D printing. Samples were printed and analyzed according to their thermal, mechanical, and morphological properties. Although there were no significant differences seen in the mechanical properties between the two BC composites, the optimal quantity of BC was 5 wt % based upon dimensional stability, ease of printing, and surface finish. These printable materials show great promise for implementation into customizable, non-structural components in the electrical and automotive industries.

scholarly journals Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Circuit Boards ◽  
Ag Nps ◽  
Laser Bonding ◽  
Laser Soldering ◽  
Low Temperature Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

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