Twisted Offset Strip Fin Heat Sink For Power Electronics Cooling

Liquid-cooled heat sink (cold plate) used for power electronics cooling is numerically studied. Thermal performance and hydraulic resistance are analyzed, with emphasis on geometric construction of cooling channels. Two heat transfer enhancing channel shapes are investigated, such as alternating elliptical channel and alternating rectangular channel (AR-C). Their performances are compared with that of three traditional straight channel shapes, as straight circular channel, straight elliptical channel, and straight rectangular channel. A heat sink with uniform and discrete heat sources is studied. Thermal and hydraulic characteristics in the heat sink are simulated using computational fluid dynamics approach, with water as coolant. The results show that the AR-C has the highest thermal performance with a little penalty on pressure drop, considering fixed channel hydraulic diameter and coolant volumetric flow rate. Geometry optimization is investigated for the AR-C, as well as the effect of channel density. It is found that higher channel density can improve both thermal performance and hydraulic resistance. It is concluded that alternating channel can improve cold plate performance and should be taken into application to power electronics cooling.

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Thermal Characterization of Copper Microchannel Heat Sink for Power Electronics Cooling

Journal of Thermophysics and Heat Transfer ◽

10.2514/1.40033 ◽

2009 ◽

Vol 23 (2) ◽

pp. 371-380 ◽

Cited By ~ 4

Author(s):

Randeep Singh ◽

Aliakbar Akbarzadeh ◽

Masataka Mochizuki ◽

Thang Nguyen ◽

Tien Nguyen

Keyword(s):

Power Electronics ◽

Heat Sink ◽

Electronics Cooling ◽

Thermal Characterization ◽

Microchannel Heat Sink

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Design and Fabrication of a Substrate Integrated Phase Change Thermal Buffer Heat Sink

Volume 5: Electronics and Photonics ◽

10.1115/imece2009-12713 ◽

2009 ◽

Cited By ~ 1

Author(s):

Nicholas R. Jankowski ◽

Brian C. Morgan ◽

F. Patrick McCluskey

Keyword(s):

Phase Change ◽

Power Electronics ◽

Heat Sink ◽

Electronics Cooling ◽

Department Of Energy ◽

Dominant Factor ◽

Thermal Resistivity ◽

Bonding Layer ◽

Electronic Temperature ◽

Transient Thermal

Recent power electronics cooling efforts have shown that bringing the cooling mechanism directly into the device substrate can achieve reduced package thermal resistance and reduced system pumping requirements while maintaining traditional circuit manufacturing processes. At the same time, it has been demonstrated that effective compact methods of managing electronic temperature excursions from brief power surges or other transient events include the use of a solid-liquid phase change material (PCM), but tight integration into the electronics package without degrading overall cooling has proven difficult. Recognizing that such a thermal buffer heat sink (TBHS) would enable lighter weight, more compact cooling hardware for vehicle power electronic modules, the U.S. Army Research Laboratory has developed a method for integrating and assembling a PCM-based TBHS within a power electronics substrate. The TBHS design builds upon both the author’s previous efforts in substrate integrated cooling and design trade studies sponsored by the Department of Energy. By fabricating the PCM cavities alongside the fluidic passages on the backside of a ceramic substrate, the PCM thermal bottleneck can be minimized, and a compact solution can be found. Low fabrication temperature limits imposed by the presence of an integrated PCM can be circumvented by using a room temperature curing silicone bonding layer for assembly. The prototype fabrication plan is presented along with steady and transient thermal models to verify performance of the integrated heatsink. A representative design is shown to have a steady state thermal resistivity of less than 0.4 cm2K/W, with the convective rate of the cooling fluid being the dominant factor. Transient analysis shows peak temperature suppression due to the effect of phase change heat absorption, including a 4°C reduction under a pulsed loading condition.

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A ROBUST ANALYTIC MODEL OF FOLDED FIN COLD PLATES FOR AUTOMOTIVE POWER ELECTRONICS COOLING

10.1615/tfec2020.trn.032440 ◽

2020 ◽

Author(s):

Andrew J. Bomar ◽

Thomas M. Adams

Keyword(s):

Power Electronics ◽

Electronics Cooling ◽

Analytic Model ◽

Cold Plates

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Thermal management of power electronics with liquid cooled metal foam heat sink

International Journal of Thermal Sciences ◽

10.1016/j.ijthermalsci.2020.106796 ◽

2021 ◽

Vol 163 ◽

pp. 106796

Author(s):

Yongtong Li ◽

Liang Gong ◽

Bin Ding ◽

Minghai Xu ◽

Yogendra Joshi

Keyword(s):

Power Electronics ◽

Thermal Management ◽

Heat Sink ◽

Metal Foam

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Two-Phase Flow in Microchannels

10.1115/imece2001/htd-24204 ◽

2001 ◽

Author(s):

G. Hetsroni ◽

A. Mosyak ◽

Z. Segal

Keyword(s):

Heat Sink ◽

High Speed ◽

Single Phase ◽

Flow Boiling ◽

Electronics Cooling ◽

Working Fluid ◽

Microchannel Heat Sink ◽

Two Phase ◽

Infrared Radiometry ◽

Phase Water

Abstract Experimental investigation of a heat sink for electronics cooling is performed. The objective is to keep the operating temperature at a relatively low level of about 323–333K, while reducing the undesired temperature variation in both the streamwise and transverse directions. The experimental study is based on systematic temperature, flow and pressure measurements, infrared radiometry and high-speed digital video imaging. The heat sink has parallel triangular microchannels with a base of 250μm. According to the objectives of the present study, Vertrel XF is chosen as the working fluid. Experiments on flow boiling of Vertrel XF in the microchannel heat sink are performed to study the effect of mass velocity and vapor quality on the heat transfer, as well as to compare the two-phase results to a single-phase water flow.

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Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

Journal of Electronic Packaging ◽

10.1115/1.4007258 ◽

2012 ◽

Vol 134 (4) ◽

Cited By ~ 3

Author(s):

A. F. M. Arif ◽

Syed M. Zubair ◽

S. Pashah

Keyword(s):

Heat Sink ◽

Structural Response ◽

Electronics Cooling ◽

Base Plate ◽

Thermal Design ◽

Heat Flow Rate ◽

Thermal Interface ◽

Conductive Composites ◽

Thermally Conductive ◽

As Stress

Thermally conductive composites as compared to metals have reduced density, decreased oxidation, and improved chemical resistance, as well as adjustable properties to fit a given application. However, there are several challenges that need to be addressed before they can be successfully implemented in heat sink design. The interface between the device and heat sink is an important factor in the thermal design of microelectronics cooling. Depending on the thermal interface conditions and material properties, the contact pressure and thermal stress level can attain undesirable values. In this paper, we investigate the effect of thermal interface between the fin and base plate on thermal-structural behavior of heat sinks. A coupled-field (thermal-structural) analysis using finite element method is performed to predict temperature as well as stress fields in the interface region. In addition temperature and heat flow rate predictions are supported through analytical results. effect of various interface geometrical (such as slot-depth, axial-gap, and radial-gap) and contact properties (such as air gap with surface roughness and gaps filled with interface material) on the resulting thermal-structural response is investigated with respect to four interface materials combinations, and it is found that the thermal performance is most sensitive to the slot-depth compared to any other parameter.

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